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John Lauer Initial publish: canonical per-vendor PCB fab design rules. 13 vendors, 56 records (vendor, process, layer count) read… bafc3ce 1mo ago
{
  "vendor": "Sierra Circuits",
  "vendorSlug": "sierra-circuits",
  "vendorUrl": null,
  "records": [
    {
      "process": "standard",
      "layerCount": 2,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "STANDARD tier"
      },
      "minSpacing": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "STANDARD tier"
      },
      "minDrill": {
        "mm": 0.15,
        "mil": 5.9
      },
      "minVia": {
        "drillMm": 0.15,
        "drillMil": 5.9,
        "padMm": 0.4547,
        "padMil": 17.9
      },
      "annularRing": {
        "viaMm": 0.0254,
        "viaMil": 1.0
      },
      "copperToBoardEdge": {
        "mm": 0.254,
        "mil": 10.0,
        "condition": "V-score edge to copper, STANDARD tier"
      },
      "holeToHole": null,
      "maskExpansion": null,
      "maskSliver": {
        "mm": 0.127,
        "mil": 5.0,
        "condition": "solder mask min dam size, based on green solder mask color"
      },
      "silkLineWidth": null,
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, STANDARD tier"
      },
      "boardThicknessOptionsMm": [
        0.254,
        7.62
      ],
      "copperWeightOptionsOz": [
        4
      ],
      "surfaceFinishes": [
        "HASL",
        "Lead-Free HASL",
        "OSP (Shikoku F2)",
        "OSP (Entek)",
        "ENIG",
        "Immersion Silver",
        "Electrolytic Soft Gold",
        "Electrolytic Hard Gold",
        "Selective Gold"
      ],
      "maxBoardSize": {
        "xMm": 304.8,
        "yMm": 457.2
      },
      "notes": "Values from the rigid PCB STANDARD tier table, published per process tier, not broken out by layer count, so 2-layer uses the same STANDARD values. Min board thickness 0.010 in (0.254 mm), max 0.300 in (7.62 mm). Max finished copper: outer layer 4 oz, inner layer 4 oz, min starting foil 3 microns. Min via pad derived from published process pad formula D plus 0.012 in, i.e. min drill 5.9 mil plus 12 mil. Annular ring 1 mil as stated in the process pad row. Max panel size STANDARD tier 12 x 18 in. Smallest laser drill 5 mil (0.127 mm), min finished hole 4 mil (0.102 mm). Solder mask registration 2 mil (0.0508 mm), solder mask feature tolerance 1.5 mil (0.0381 mm).",
      "sources": [
        {
          "url": "https://www.protoexpress.com/products/rigid-pcb/",
          "dateRead": "2026-09-03"
        }
      ],
      "processDetail": "standard rigid PCB (Sierra Circuits fabrication STANDARD tier)"
    },
    {
      "process": "standard",
      "layerCount": 4,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "STANDARD tier"
      },
      "minSpacing": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "STANDARD tier"
      },
      "minDrill": {
        "mm": 0.15,
        "mil": 5.9
      },
      "minVia": {
        "drillMm": 0.15,
        "drillMil": 5.9,
        "padMm": 0.4547,
        "padMil": 17.9
      },
      "annularRing": {
        "viaMm": 0.0254,
        "viaMil": 1.0
      },
      "copperToBoardEdge": {
        "mm": 0.254,
        "mil": 10.0,
        "condition": "V-score edge to copper, STANDARD tier"
      },
      "holeToHole": null,
      "maskExpansion": null,
      "maskSliver": {
        "mm": 0.127,
        "mil": 5.0,
        "condition": "solder mask min dam size, based on green solder mask color"
      },
      "silkLineWidth": null,
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, STANDARD tier"
      },
      "boardThicknessOptionsMm": [
        0.254,
        7.62
      ],
      "copperWeightOptionsOz": [
        4
      ],
      "surfaceFinishes": [
        "HASL",
        "Lead-Free HASL",
        "OSP (Shikoku F2)",
        "OSP (Entek)",
        "ENIG",
        "Immersion Silver",
        "Electrolytic Soft Gold",
        "Electrolytic Hard Gold",
        "Selective Gold"
      ],
      "maxBoardSize": {
        "xMm": 304.8,
        "yMm": 457.2
      },
      "notes": "Same STANDARD tier table as 2-layer, Sierra does not publish separate 4-layer limits on this page. Blind and buried vias available. Controlled impedance tolerance 10 percent STANDARD tier.",
      "sources": [
        {
          "url": "https://www.protoexpress.com/products/rigid-pcb/",
          "dateRead": "2026-09-03"
        }
      ],
      "processDetail": "standard rigid PCB (Sierra Circuits fabrication STANDARD tier)"
    },
    {
      "process": "turnkey-pro",
      "layerCount": 2,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "Turnkey PRO quick-turn prototype"
      },
      "minSpacing": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "Turnkey PRO quick-turn prototype"
      },
      "minDrill": null,
      "minVia": null,
      "annularRing": null,
      "copperToBoardEdge": null,
      "holeToHole": null,
      "maskExpansion": null,
      "maskSliver": null,
      "silkLineWidth": null,
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, Turnkey PRO"
      },
      "boardThicknessOptionsMm": [
        0.7874,
        1.5748,
        2.3622
      ],
      "copperWeightOptionsOz": [
        1,
        2
      ],
      "surfaceFinishes": [
        "ENIG",
        "HASL"
      ],
      "maxBoardSize": null,
      "notes": "Online Turnkey PRO service: layer count 2, 4, 6, 8; board thickness 0.031, 0.062, 0.093 in; inner layer copper 1 oz, outer layer finished copper 1 oz or 2 oz; FR-4 lead-free; IPC-6012 Class 2. No drill or via numbers published for this tier on the page.",
      "sources": [
        {
          "url": "https://www.protoexpress.com/",
          "dateRead": "2026-09-03"
        }
      ],
      "processDetail": "Turnkey PRO prototype online service (2, 4, 6, 8 layer quick-turn)"
    },
    {
      "process": "turnkey-pro",
      "layerCount": 4,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "Turnkey PRO quick-turn prototype"
      },
      "minSpacing": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "Turnkey PRO quick-turn prototype"
      },
      "minDrill": null,
      "minVia": null,
      "annularRing": null,
      "copperToBoardEdge": null,
      "holeToHole": null,
      "maskExpansion": null,
      "maskSliver": null,
      "silkLineWidth": null,
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, Turnkey PRO"
      },
      "boardThicknessOptionsMm": [
        0.7874,
        1.5748,
        2.3622
      ],
      "copperWeightOptionsOz": [
        1,
        2
      ],
      "surfaceFinishes": [
        "ENIG",
        "HASL"
      ],
      "maxBoardSize": null,
      "notes": "Same Turnkey PRO limits as 2-layer, page does not differentiate by layer count.",
      "sources": [
        {
          "url": "https://www.protoexpress.com/",
          "dateRead": "2026-09-03"
        }
      ],
      "processDetail": "Turnkey PRO prototype online service (2, 4, 6, 8 layer quick-turn)"
    }
  ],
  "unreachable": [
    "https://www.sierracircuits.com/pcb-manufacturing-capabilities (404)",
    "https://www.sierracircuits.com/pcb-capabilities (404)",
    "https://www.protoexpress.com/pcb-capabilities/ (404)"
  ]
}