PCB Design Rules

{
  "vendor": "PCBWay",
  "vendorSlug": "pcbway",
  "vendorUrl": null,
  "records": [
    {
      "process": "standard",
      "layerCount": 2,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "prototype process, any copper weight; per copper weight outer layer limits are 0.5oz: 4/5mil, 1oz: 5/6mil, 2oz: 7/8mil, 3oz: 10/12mil (before compensation)"
      },
      "minSpacing": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "prototype process, different nets; per copper weight outer layer limits are 0.5oz: 4/5mil, 1oz: 5/6mil, 2oz: 7/8mil, 3oz: 10/12mil (before compensation)"
      },
      "minDrill": {
        "mm": 0.2,
        "mil": 7.87
      },
      "minVia": {
        "drillMm": 0.2,
        "drillMil": 7.87,
        "padMm": 0.454,
        "padMil": 17.87
      },
      "annularRing": {
        "viaMm": 0.127,
        "viaMil": 5.0,
        "note": "via, 1oz outer copper; 0.5oz via: 5mil, component hole 1oz: 10mil"
      },
      "copperToBoardEdge": {
        "mm": 0.25,
        "mil": 9.84,
        "condition": "line to board edge, CNC routing"
      },
      "holeToHole": {
        "mm": 0.2794,
        "mil": 11.0,
        "condition": "via hole to via hole, via diameter 0.45mm or less; component holes: 16mil (0.4064mm)"
      },
      "maskExpansion": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "green solder mask opening"
      },
      "maskSliver": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "solder mask bridge, copper under 2oz; 2oz and above: 5mil (0.127mm)"
      },
      "silkLineWidth": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "minimum legend character width; minimum character height 0.8mm"
      },
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, prototype process"
      },
      "boardThicknessOptionsMm": [
        0.4,
        0.6,
        0.8,
        1.0,
        1.2,
        1.6,
        2.0,
        2.4
      ],
      "copperWeightOptionsOz": [
        0.5,
        1,
        2,
        3,
        4
      ],
      "surfaceFinishes": [
        "HASL with lead",
        "HASL lead free",
        "Immersion gold (ENIG)",
        "OSP",
        "Immersion Tin"
      ],
      "maxBoardSize": {
        "xMm": 508.0,
        "yMm": 610.0
      },
      "notes": "Min board thickness 0.3mm, max board thickness 3.2mm. Prototype quote page lists max PCB size 500x1100mm and drill range 0.2 to 6.3mm. Grid trace 1oz: 9/11mil. Hole diameter tolerance PTH: plus or minus 0.075mm. Panel size max 20x24 inch.",
      "sources": [
        {
          "url": "https://www.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        },
        {
          "url": "https://m.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        }
      ]
    },
    {
      "process": "standard",
      "layerCount": 4,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "inner layer, 1oz (35um) copper, before compensation; inner 0.5oz: 4mil, 2oz: 6mil, 3oz: 8mil. Outer layer 1oz: 5mil"
      },
      "minSpacing": {
        "mm": 0.127,
        "mil": 5.0,
        "condition": "inner layer, 1oz (35um) copper, before compensation; inner 0.5oz: 5mil (4/4mil class), 2oz: 8mil, 3oz: 11mil. Outer layer 1oz: 6mil"
      },
      "minDrill": {
        "mm": 0.2,
        "mil": 7.87
      },
      "minVia": {
        "drillMm": 0.2,
        "drillMil": 7.87,
        "padMm": 0.454,
        "padMil": 17.87
      },
      "annularRing": {
        "viaMm": 0.127,
        "viaMil": 5.0,
        "note": "via, 1oz outer copper; component hole 1oz: 10mil"
      },
      "copperToBoardEdge": {
        "mm": 0.25,
        "mil": 9.84,
        "condition": "line to board edge, CNC routing"
      },
      "holeToHole": {
        "mm": 0.2794,
        "mil": 11.0,
        "condition": "via hole to via hole, via diameter 0.45mm or less; component holes: 16mil (0.4064mm)"
      },
      "maskExpansion": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "green solder mask opening"
      },
      "maskSliver": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "solder mask bridge, copper under 2oz; 2oz and above: 5mil (0.127mm)"
      },
      "silkLineWidth": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "minimum legend character width; minimum character height 0.8mm"
      },
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, inner layer 0.5oz base copper"
      },
      "boardThicknessOptionsMm": [
        0.6,
        0.8,
        1.0,
        1.2,
        1.6,
        2.0,
        2.4
      ],
      "copperWeightOptionsOz": [
        0.5,
        1,
        1.5,
        2,
        3,
        4
      ],
      "surfaceFinishes": [
        "HASL with lead",
        "HASL lead free",
        "Immersion gold (ENIG)",
        "OSP",
        "Immersion Tin"
      ],
      "maxBoardSize": {
        "xMm": 508.0,
        "yMm": 600.0
      },
      "notes": "Min board thickness 0.6mm, max board thickness 3.2mm. Min inner layer isolation ring (hole to inner layer conductor, before compensation) 7mil (0.1778mm). Inner layer copper weight options 1oz or 1.5oz. Max aspect ratio 8:1.",
      "sources": [
        {
          "url": "https://www.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        }
      ]
    },
    {
      "process": "standard",
      "layerCount": 6,
      "minTraceWidth": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "inner layer, 1oz (35um) copper, before compensation; outer layer 1oz: 5mil"
      },
      "minSpacing": {
        "mm": 0.127,
        "mil": 5.0,
        "condition": "inner layer, 1oz (35um) copper, before compensation; inner 2oz: 8mil, 3oz: 11mil. Outer layer 1oz: 6mil"
      },
      "minDrill": {
        "mm": 0.2,
        "mil": 7.87
      },
      "minVia": {
        "drillMm": 0.2,
        "drillMil": 7.87,
        "padMm": 0.454,
        "padMil": 17.87
      },
      "annularRing": {
        "viaMm": 0.127,
        "viaMil": 5.0,
        "note": "via, 1oz outer copper; component hole 1oz: 10mil"
      },
      "copperToBoardEdge": {
        "mm": 0.25,
        "mil": 9.84,
        "condition": "line to board edge, CNC routing"
      },
      "holeToHole": {
        "mm": 0.2794,
        "mil": 11.0,
        "condition": "via hole to via hole, via diameter 0.45mm or less; component holes: 16mil (0.4064mm)"
      },
      "maskExpansion": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "green solder mask opening"
      },
      "maskSliver": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "solder mask bridge, copper under 2oz; 2oz and above: 5mil (0.127mm)"
      },
      "silkLineWidth": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "minimum legend character width; minimum character height 0.8mm"
      },
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.1016,
        "mil": 4.0,
        "condition": "different nets, inner layer 0.5oz base copper"
      },
      "boardThicknessOptionsMm": [
        0.8,
        1.0,
        1.2,
        1.6,
        2.0,
        2.4
      ],
      "copperWeightOptionsOz": [
        0.5,
        1,
        1.5,
        2,
        3,
        4
      ],
      "surfaceFinishes": [
        "HASL with lead",
        "HASL lead free",
        "Immersion gold (ENIG)",
        "OSP",
        "Immersion Tin"
      ],
      "maxBoardSize": {
        "xMm": 508.0,
        "yMm": 600.0
      },
      "notes": "Min board thickness 0.9mm, max board thickness 3.2mm. Min inner layer isolation ring (hole to inner layer conductor, before compensation) 8mil (0.2032mm). Inner layer copper weight options 1oz or 1.5oz. Max aspect ratio 8:1.",
      "sources": [
        {
          "url": "https://www.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        }
      ]
    },
    {
      "process": "advanced",
      "layerCount": 2,
      "minTraceWidth": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "outer layer, 1/3 oz base copper, only part of traces on the board, not whole board; capabilities table advanced outer 0.5oz: 4mil with parts 3.5mil (0.0889mm) in BGA chip area"
      },
      "minSpacing": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "outer layer, 1/3 oz base copper, partial traces only; capabilities table advanced outer 0.5oz: 4mil, parts 3.5mil"
      },
      "minDrill": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "CNC drilled; laser blind or buried via 0.1mm (3.937mil)"
      },
      "minVia": {
        "drillMm": 0.15,
        "drillMil": 5.91,
        "padMm": 0.3024,
        "padMil": 11.91
      },
      "annularRing": {
        "viaMm": 0.0762,
        "viaMil": 3.0,
        "note": "via; component hole annular ring 5mil (0.127mm)"
      },
      "copperToBoardEdge": {
        "mm": 0.2,
        "mil": 7.87,
        "condition": "line to board edge, CNC routing, advanced capability"
      },
      "holeToHole": {
        "mm": 0.3556,
        "mil": 14.0,
        "condition": "component hole to hole, advanced range 14 to 16mil"
      },
      "maskExpansion": {
        "mm": 0.0381,
        "mil": 1.5,
        "condition": "solder mask opening, advanced; 1mil (0.0254mm) only concentrated in BGA area"
      },
      "maskSliver": {
        "mm": 0.0889,
        "mil": 3.5,
        "condition": "min solder mask bridge width advanced, capabilities table range 3 to 4mil (0.0762 to 0.1016mm); copper 2oz and above: 4mil"
      },
      "silkLineWidth": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "minimum legend character width"
      },
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "different nets, advanced process, partial traces"
      },
      "boardThicknessOptionsMm": [
        0.4,
        0.6,
        0.8,
        1.0,
        1.2,
        1.6,
        2.0,
        2.4
      ],
      "copperWeightOptionsOz": [
        0.33,
        0.5,
        1,
        2,
        3,
        4,
        6,
        8
      ],
      "surfaceFinishes": [
        "ENIG",
        "HAL",
        "HAL lead free",
        "OSP",
        "Immersion Sn",
        "Immersion silver",
        "Plating hard gold",
        "Plating silver"
      ],
      "maxBoardSize": {
        "xMm": 609.0,
        "yMm": 889.0
      },
      "notes": "Advanced page does not distinguish limits by layer count for 2 layers. Min board thickness 0.25mm. Max aspect ratio 20:1. Max layer count 64. Min BGA pad diameter 8mil, min BGA pitch 0.4mm. Min base copper 1/3 oz, max finished copper 8 oz. Min insulating layer thickness 2mil. Max board thickness 4.5mm.",
      "sources": [
        {
          "url": "https://www.pcbway.com/advanced-pcb-capabilities.html",
          "dateRead": "2026-09-03"
        },
        {
          "url": "https://www.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        }
      ]
    },
    {
      "process": "advanced",
      "layerCount": 4,
      "minTraceWidth": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "inner layer 2/2mil with H/H oz base copper (partial traces only); capabilities table advanced inner 0.5oz: 4mil, parts 3.5mil. Outer layer 2/2mil with 1/3 oz base copper"
      },
      "minSpacing": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "inner layer H/H oz or outer 1/3 oz base copper, partial traces only; capabilities table advanced inner 0.5oz: 3.5mil spacing (4/3.5mil), outer 0.5oz: 4mil"
      },
      "minDrill": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "CNC drilled; laser blind or buried via 0.1mm (3.937mil)"
      },
      "minVia": {
        "drillMm": 0.15,
        "drillMil": 5.91,
        "padMm": 0.3024,
        "padMil": 11.91
      },
      "annularRing": {
        "viaMm": 0.0762,
        "viaMil": 3.0,
        "note": "via; component hole annular ring 5mil (0.127mm)"
      },
      "copperToBoardEdge": {
        "mm": 0.2,
        "mil": 7.87,
        "condition": "line to board edge, CNC routing, advanced capability"
      },
      "holeToHole": {
        "mm": 0.3556,
        "mil": 14.0,
        "condition": "component hole to hole, advanced range 14 to 16mil"
      },
      "maskExpansion": {
        "mm": 0.0381,
        "mil": 1.5,
        "condition": "solder mask opening, advanced; 1mil (0.0254mm) only concentrated in BGA area"
      },
      "maskSliver": {
        "mm": 0.0889,
        "mil": 3.5,
        "condition": "min solder mask bridge width advanced, range 3 to 4mil (0.0762 to 0.1016mm); copper 2oz and above: 4mil"
      },
      "silkLineWidth": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "minimum legend character width"
      },
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "different nets, hole to inner layer conductor 6mil (0.1524mm) advanced"
      },
      "boardThicknessOptionsMm": [
        0.4,
        0.6,
        0.8,
        1.0,
        1.2,
        1.6,
        2.0,
        2.4
      ],
      "copperWeightOptionsOz": [
        0.33,
        0.5,
        1,
        2,
        3,
        4,
        6,
        8
      ],
      "surfaceFinishes": [
        "ENIG",
        "HAL",
        "HAL lead free",
        "OSP",
        "Immersion Sn",
        "Immersion silver",
        "Plating hard gold",
        "Plating silver"
      ],
      "maxBoardSize": {
        "xMm": 609.0,
        "yMm": 889.0
      },
      "notes": "Advanced page does not distinguish limits by layer count; same published values apply to 4 layers. Min board thickness 0.4mm (advanced), standard 0.6mm. Min inner layer isolation ring advanced 6mil (0.1524mm) before compensation. Max aspect ratio 20:1. HDI 1 to 7 steps. Max board thickness 4.5mm.",
      "sources": [
        {
          "url": "https://www.pcbway.com/advanced-pcb-capabilities.html",
          "dateRead": "2026-09-03"
        },
        {
          "url": "https://www.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        }
      ]
    },
    {
      "process": "advanced",
      "layerCount": 6,
      "minTraceWidth": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "inner layer 2/2mil with H/H oz base copper (partial traces only); capabilities table advanced inner 0.5oz: 4mil, parts 3.5mil. Outer layer 2/2mil with 1/3 oz base copper"
      },
      "minSpacing": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "inner layer H/H oz or outer 1/3 oz base copper, partial traces only; capabilities table advanced inner 0.5oz: 3.5mil spacing, outer 0.5oz: 4mil"
      },
      "minDrill": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "CNC drilled; laser blind or buried via 0.1mm (3.937mil)"
      },
      "minVia": {
        "drillMm": 0.15,
        "drillMil": 5.91,
        "padMm": 0.3024,
        "padMil": 11.91
      },
      "annularRing": {
        "viaMm": 0.0762,
        "viaMil": 3.0,
        "note": "via; component hole annular ring 5mil (0.127mm)"
      },
      "copperToBoardEdge": {
        "mm": 0.2,
        "mil": 7.87,
        "condition": "line to board edge, CNC routing, advanced capability"
      },
      "holeToHole": {
        "mm": 0.3556,
        "mil": 14.0,
        "condition": "component hole to hole, advanced range 14 to 16mil"
      },
      "maskExpansion": {
        "mm": 0.0381,
        "mil": 1.5,
        "condition": "solder mask opening, advanced; 1mil (0.0254mm) only concentrated in BGA area"
      },
      "maskSliver": {
        "mm": 0.0889,
        "mil": 3.5,
        "condition": "min solder mask bridge width advanced, range 3 to 4mil (0.0762 to 0.1016mm); copper 2oz and above: 4mil"
      },
      "silkLineWidth": {
        "mm": 0.15,
        "mil": 5.91,
        "condition": "minimum legend character width"
      },
      "silkToCopper": null,
      "minCopperClearance": {
        "mm": 0.0508,
        "mil": 2.0,
        "condition": "different nets, hole to inner layer conductor 6mil (0.1524mm) advanced"
      },
      "boardThicknessOptionsMm": [
        0.7,
        0.8,
        1.0,
        1.2,
        1.6,
        2.0,
        2.4
      ],
      "copperWeightOptionsOz": [
        0.33,
        0.5,
        1,
        2,
        3,
        4,
        6,
        8
      ],
      "surfaceFinishes": [
        "ENIG",
        "HAL",
        "HAL lead free",
        "OSP",
        "Immersion Sn",
        "Immersion silver",
        "Plating hard gold",
        "Plating silver"
      ],
      "maxBoardSize": {
        "xMm": 609.0,
        "yMm": 889.0
      },
      "notes": "Advanced page does not distinguish limits by layer count; same published values apply to 6 layers. Min board thickness 0.7mm (advanced), standard 0.9mm. Min inner layer isolation ring advanced 6.5mil (0.1651mm) before compensation. Max aspect ratio 20:1. HDI 1 to 7 steps. Max board thickness 4.5mm.",
      "sources": [
        {
          "url": "https://www.pcbway.com/advanced-pcb-capabilities.html",
          "dateRead": "2026-09-03"
        },
        {
          "url": "https://www.pcbway.com/capabilities.html",
          "dateRead": "2026-09-03"
        }
      ]
    }
  ],
  "unreachable": [
    "https://www.pcbway.com/pcb_prototype.html",
    "https://www.pcbway.com/advanced-pcb.html"
  ]
}