skill
PCB Design Rules
Public Made by Adomby adom
Canonical PCB fab design rules (DRC) for every popular vendor: one JSON record per vendor, process and layer count, with generated Fusion/EAGLE .dru and .edru, KiCad .kicad_dru plus board-setup JSON, Altium .RUL exports, and a human comparison table. Every number cites the vendor's own capabilities page and the date it was read.
main
John Lauer
Initial publish: canonical per-vendor PCB fab design rules. 13 vendors, 56 records (vendor, process, layer count) read…
bafc3ce
1mo ago
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{
"vendor": "NextPCB",
"vendorSlug": "nextpcb",
"vendorUrl": null,
"records": [
{
"process": "standard",
"layerCount": 2,
"minTraceWidth": {
"mm": 0.0635,
"mil": 2.5,
"condition": "H/HOZ 0.5oz inner layer copper"
},
"minSpacing": {
"mm": 0.0762,
"mil": 3.0,
"condition": "H/HOZ 0.5oz inner layer copper"
},
"minDrill": {
"mm": 0.15,
"mil": 5.91
},
"minVia": {
"drillMm": 0.2,
"drillMil": 7.87,
"padMm": 0.3278,
"padMil": 12.91
},
"annularRing": {
"viaMm": 0.0889,
"viaMil": 3.5
},
"copperToBoardEdge": {
"mm": 0.2,
"mil": 7.87
},
"holeToHole": {
"mm": 0.3048,
"mil": 12.0
},
"maskExpansion": {
"mm": 0.0381,
"mil": 1.5
},
"maskSliver": {
"mm": 0.0889,
"mil": 3.5
},
"silkLineWidth": {
"mm": 0.0762,
"mil": 3.0
},
"silkToCopper": {
"mm": 0.1524,
"mil": 6.0
},
"minCopperClearance": {
"mm": 0.1778,
"mil": 7.0,
"condition": "via to track"
},
"boardThicknessOptionsMm": [
0.6,
0.8,
1.0,
1.2,
1.6,
2.0,
2.5,
3.0,
3.2
],
"copperWeightOptionsOz": [
0.5,
1,
2
],
"surfaceFinishes": null,
"maxBoardSize": {
"xMm": 1500,
"yMm": 600
},
"notes": "Trace/spacing table is by copper weight, not layer count: 0.5oz inner 2.5mil width/3mil spacing, 1oz outer 3mil/3mil, 2oz outer 5.5mil/5.5mil. Annular ring: 3.5mil for 1oz, 4.5mil for 2oz. Min drill 0.15mm only for board thickness 1.2mm or less. PTH hole size 0.2mm or larger single side. Copper to V-cut line 0.4mm (15.748mil). Hole to hole different nets 12mil for CAF avoidance; via to via same net 8mil (0.2032mm); PTH to track 9mil (0.2286mm); NPTH to track 8mil (0.2032mm); SMD pad to track 4mil (0.1016mm); SMD pad to SMD pad 0.15mm; pad to pad with hole different nets 0.40mm. Mask sliver (solder bridge dam): green 3.5mil, black/white 5mil (0.127mm), other colors 4mil (0.1016mm). Silk line width: silkscreen printing 5mil (0.127mm), printer printing 3mil (0.0762mm). Finished copper outer 1oz/2oz, inner 0.5oz/1oz/2oz. Surface finish cell left blank on page. BGA 1oz: min pad 0.2mm, min pad distance 0.15mm. Layer count 1 to 32 supported.",
"sources": [
{
"url": "https://www.nextpcb.com/pcb-capabilities",
"dateRead": "2026-09-03"
}
]
},
{
"process": "standard",
"layerCount": 4,
"minTraceWidth": {
"mm": 0.0635,
"mil": 2.5,
"condition": "H/HOZ 0.5oz inner layer copper"
},
"minSpacing": {
"mm": 0.0762,
"mil": 3.0,
"condition": "H/HOZ 0.5oz inner layer copper"
},
"minDrill": {
"mm": 0.15,
"mil": 5.91
},
"minVia": {
"drillMm": 0.2,
"drillMil": 7.87,
"padMm": 0.3278,
"padMil": 12.91
},
"annularRing": {
"viaMm": 0.0889,
"viaMil": 3.5
},
"copperToBoardEdge": {
"mm": 0.2,
"mil": 7.87
},
"holeToHole": {
"mm": 0.3048,
"mil": 12.0
},
"maskExpansion": {
"mm": 0.0381,
"mil": 1.5
},
"maskSliver": {
"mm": 0.0889,
"mil": 3.5
},
"silkLineWidth": {
"mm": 0.0762,
"mil": 3.0
},
"silkToCopper": {
"mm": 0.1524,
"mil": 6.0
},
"minCopperClearance": {
"mm": 0.1778,
"mil": 7.0,
"condition": "via to track"
},
"boardThicknessOptionsMm": [
0.6,
0.8,
1.0,
1.2,
1.6,
2.0,
2.5,
3.0,
3.2
],
"copperWeightOptionsOz": [
0.5,
1,
2
],
"surfaceFinishes": null,
"maxBoardSize": {
"xMm": 1500,
"yMm": 500
},
"notes": "Same published limits as 2 layer except max dimension 1500x500mm for 4 layers. Trace/spacing by copper weight: 0.5oz inner 2.5mil/3mil, 1oz outer 3mil/3mil, 2oz outer 5.5mil/5.5mil.",
"sources": [
{
"url": "https://www.nextpcb.com/pcb-capabilities",
"dateRead": "2026-09-03"
}
]
},
{
"process": "standard",
"layerCount": 6,
"minTraceWidth": {
"mm": 0.0635,
"mil": 2.5,
"condition": "H/HOZ 0.5oz inner layer copper"
},
"minSpacing": {
"mm": 0.0762,
"mil": 3.0,
"condition": "H/HOZ 0.5oz inner layer copper"
},
"minDrill": {
"mm": 0.15,
"mil": 5.91
},
"minVia": {
"drillMm": 0.2,
"drillMil": 7.87,
"padMm": 0.3278,
"padMil": 12.91
},
"annularRing": {
"viaMm": 0.0889,
"viaMil": 3.5
},
"copperToBoardEdge": {
"mm": 0.2,
"mil": 7.87
},
"holeToHole": {
"mm": 0.3048,
"mil": 12.0
},
"maskExpansion": {
"mm": 0.0381,
"mil": 1.5
},
"maskSliver": {
"mm": 0.0889,
"mil": 3.5
},
"silkLineWidth": {
"mm": 0.0762,
"mil": 3.0
},
"silkToCopper": {
"mm": 0.1524,
"mil": 6.0
},
"minCopperClearance": {
"mm": 0.1778,
"mil": 7.0,
"condition": "via to track"
},
"boardThicknessOptionsMm": [
0.6,
0.8,
1.0,
1.2,
1.6,
2.0,
2.5,
3.0,
3.2
],
"copperWeightOptionsOz": [
0.5,
1,
2
],
"surfaceFinishes": null,
"maxBoardSize": {
"xMm": 500,
"yMm": 400
},
"notes": "Max dimension 500x400mm applies to 6 or more layers. Other limits as 2 layer entry.",
"sources": [
{
"url": "https://www.nextpcb.com/pcb-capabilities",
"dateRead": "2026-09-03"
}
]
},
{
"process": "advanced",
"layerCount": 2,
"minTraceWidth": {
"mm": 0.0635,
"mil": 2.5,
"condition": "FR4 complex designs, general advanced"
},
"minSpacing": {
"mm": 0.0635,
"mil": 2.5,
"condition": "FR4 complex designs, general advanced"
},
"minDrill": {
"mm": 0.15,
"mil": 5.91
},
"minVia": {
"drillMm": 0.075,
"drillMil": 2.95,
"padMm": null,
"padMil": null
},
"annularRing": null,
"copperToBoardEdge": null,
"holeToHole": null,
"maskExpansion": null,
"maskSliver": null,
"silkLineWidth": null,
"silkToCopper": null,
"minCopperClearance": null,
"boardThicknessOptionsMm": null,
"copperWeightOptionsOz": null,
"surfaceFinishes": [
"HASL",
"Lead Free HASL",
"ENIG",
"OSP",
"Hard Gold",
"Electrolytic Gold",
"Gold Fingers",
"Immersion Tin",
"Immersion Silver",
"ENEPIG"
],
"maxBoardSize": {
"xMm": 500,
"yMm": 600
},
"notes": "Up to 32 layers, HDI III and any-layer HDI (ELIC). Trace/space by technology: HDI 2.0mil/2.0mil (0.0508mm), heavy copper 3oz 8mil/8mil (0.2032mm), FPC advanced 1.5mil/1.5mil (0.0381mm). Min laser drill microvia 0.075mm, microvia aspect ratio 0.8:1 to 1:1. Min mechanical drill 0.15mm quoted for rigid-flex. Copper up to 10oz outer (heavy copper section) and 4 to 6oz inner; summary banner states up to 6oz outer/4oz inner. Max board size 500x600mm quoted for high-Tg boards. Rigid-flex up to 20 rigid layers plus 8 flex layers. High-speed boards up to 40 layers. Drill aspect ratio up to 20:1. 0.15mm min drill also on rigid-flex section.",
"sources": [
{
"url": "https://www.nextpcb.com/advanced-pcb-manufacturing-capabilities",
"dateRead": "2026-09-03"
}
]
}
]
}