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John Lauer Initial publish: canonical per-vendor PCB fab design rules. 13 vendors, 56 records (vendor, process, layer count) read… bafc3ce 1mo ago
(version 1)

# Aisler 4-layer design rules (enig process)
# 
# Min trace width: 0.125 mm (5.0 mil) - Cu 35um (1oz), ENIG finish
# Min spacing: 0.125 mm (5.0 mil) - Cu 35um (1oz), ENIG finish
# Min drill: 0.25 mm (10.0 mil)
# Min via: 0.25 mm hole / 0.45 mm pad
# Annular ring: via 0.1 mm
# Copper to board edge: 0.3 mm
# Hole to hole: 0.3 mm
# Board thickness options: 0.8 mm, 1.6 mm
# Copper weight options: 1 oz
# Surface finishes: ENIG
# Max board size: 500 x 500 mm
# 
# Source page states rules are valid for both 0.8mm and 1.6mm PCB thickness. Imperial measures are rounded from metric on the source page. Min board dimension greater than 10mm. PTH drill range 0.5mm to 5.6mm, via drill range 0.25mm to 0.45mm, via annular ring 100um, NPTH drill range 0.5mm to 5.6mm. Min NPTH slot 0.8mm, min PTH slot 0.7mm, max PTH slot 2.6mm. Min silkscreen text height 800um (32 mil). Castellated edges supported free of charge. Green soldermask. Via pad diameter not published.
# 
# Sources:
# - https://community.aisler.net/t/4-layer-35-m-enig-design-rules/3733 (read 2026-09-03)

(rule "min-track-width"
  (constraint track_width (min 0.125mm))
  (layer "*.Cu")
  (condition "A.type == 'track'"))

(rule "min-clearance"
  (constraint clearance (min 0.125mm))
  (condition "A.type == 'track' && B.type == 'track'"))

(rule "min-hole"
  (constraint hole (min 0.25mm))
  (condition "A.type == 'pad' || A.type == 'via'"))

(rule "min-via-diameter"
  (constraint via_diameter (min 0.45mm))
  (condition "A.type == 'via'"))

(rule "min-edge-clearance"
  (constraint edge_clearance (min 0.3mm))
  (condition "A.type == 'track'"))

(rule "min-silk-thickness"
  (constraint text_thickness (min 0.15mm))
  (layer "*.SilkS")
  (condition "A.type == 'text' || A.type == 'graphic'"))