PCB Design Rules - fusion/pcbway-4L.dru

by adom

Canonical PCB fab design rules (DRC) for every popular vendor: one JSON record per vendor, process and layer count, with generated Fusion/EAGLE .dru and .edru, KiCad .kicad_dru plus board-setup JSON, Altium .RUL exports, and a human comparison table. Every number cites the vendor's own capabilities page and the date it was read.

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John Lauer Initial publish: canonical per-vendor PCB fab design rules. 13 vendors, 56 records (vendor, process, layer count) read… bafc3ce 1mo ago

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description[PCBWay 4-layer design rules (standard process) |  | Min trace width: 0.1016 mm (4.0 mil) - inner layer, 1oz (35um) copper, before compensation; inner 0.5oz: 4mil, 2oz: 6mil, 3oz: 8mil. Outer layer 1oz: 5mil | Min spacing: 0.127 mm (5.0 mil) - inner layer, 1oz (35um) copper, before compensation; inner 0.5oz: 5mil (4/4mil class), 2oz: 8mil, 3oz: 11mil. Outer layer 1oz: 6mil | Min drill: 0.2 mm (7.87 mil) | Min via: 0.2 mm hole / 0.454 mm pad | Annular ring: via 0.127 mm | Copper to board edge: 0.25 mm | Hole to hole: 0.2794 mm | Board thickness options: 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.6 mm, 2.0 mm, 2.4 mm | Copper weight options: 0.5 oz, 1 oz, 1.5 oz, 2 oz, 3 oz, 4 oz | Surface finishes: HASL with lead, HASL lead free, Immersion gold (ENIG), OSP, Immersion Tin | Max board size: 508 x 600 mm |  | Min board thickness 0.6mm, max board thickness 3.2mm. Min inner layer isolation ring (hole to inner layer conductor, before compensation) 7mil (0.1778mm). Inner layer copper weight options 1oz or 1.5oz. Max aspect ratio 8:1. |  | Sources: | - https://www.pcbway.com/capabilities.html (read 2026-09-03)]

layerSetup = (1*2*15*16)
mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 5.0mil
mdWirePad = 5.0mil
mdWireVia = 5.0mil
mdPadPad = 5.91mil
mdPadVia = 5.0mil
mdViaVia = 5.0mil
mdSmdPad = 5.0mil
mdSmdVia = 5.0mil
mdSmdSmd = 5.0mil
mdCopperDimension = 9.84mil
mdDrill = 11.0mil
msWidth = 4.0mil
msDrill = 7.87mil
mdViaViaSameLayer = 6mil
mdSmdStop = 0mil
msMicroVia = 12mil
msBlindViaRatio = 0.5
rvPadTop = 0
rvPadInner = 0
rvPadBottom = 0
rvViaOuter = 0
rvViaInner = 0
rvMicroViaOuter = 0
rvMicroViaInner = 0
rlMinPadTop = 7.09mil
rlMaxPadTop = 80mil
rlMinPadInner = 7.09mil
rlMaxPadInner = 20mil
rlMinPadBottom = 7.09mil
rlMaxPadBottom = 80mil
rlMinViaOuter = 5.0mil
rlMaxViaOuter = 20mil
rlMinViaInner = 5.0mil
rlMaxViaInner = 20mil
rlMinMicroViaOuter = 5.0mil
rlMaxMicroViaOuter = 20mil
rlMinMicroViaInner = 5.0mil
rlMaxMicroViaInner = 20mil
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 0
mvCreamFrame = 0
mlMinStopFrame = 1.5mil
mlMaxStopFrame = 4mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 20mil
srRoundness = 0
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 10mil
slThermalsForVias = 0
dpMaxLengthDifference = 400mil
dpGapFactor = 2.5
checkAngle = 0
checkRestrict = 1
checkStop = 0
checkValues = 0
checkNames = 1
checkWireStubs = 1
checkPolygonWidth = 0
useDiameter = 13
maxErrors = 50