PCB Design Rules - fusion/nextpcb-advanced-2L.dru

by adom

Canonical PCB fab design rules (DRC) for every popular vendor: one JSON record per vendor, process and layer count, with generated Fusion/EAGLE .dru and .edru, KiCad .kicad_dru plus board-setup JSON, Altium .RUL exports, and a human comparison table. Every number cites the vendor's own capabilities page and the date it was read.

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John Lauer Initial publish: canonical per-vendor PCB fab design rules. 13 vendors, 56 records (vendor, process, layer count) read… bafc3ce 1mo ago

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description[NextPCB 2-layer design rules (advanced process) |  | Min trace width: 0.0635 mm (2.5 mil) - FR4 complex designs, general advanced | Min spacing: 0.0635 mm (2.5 mil) - FR4 complex designs, general advanced | Min drill: 0.15 mm (5.91 mil) | Min via: 0.075 mm hole | Surface finishes: HASL, Lead Free HASL, ENIG, OSP, Hard Gold, Electrolytic Gold, Gold Fingers, Immersion Tin, Immersion Silver, ENEPIG | Max board size: 500 x 600 mm |  | Up to 32 layers, HDI III and any-layer HDI (ELIC). Trace/space by technology: HDI 2.0mil/2.0mil (0.0508mm), heavy copper 3oz 8mil/8mil (0.2032mm), FPC advanced 1.5mil/1.5mil (0.0381mm). Min laser drill microvia 0.075mm, microvia aspect ratio 0.8:1 to 1:1. Min mechanical drill 0.15mm quoted for rigid-flex. Copper up to 10oz outer (heavy copper section) and 4 to 6oz inner; summary banner states up to 6oz outer/4oz inner. Max board size 500x600mm quoted for high-Tg boards. Rigid-flex up to 20 rigid layers plus 8 flex layers. High-speed boards up to 40 layers. Drill aspect ratio up to 20:1. 0.15mm min drill also on rigid-flex section. |  | Sources: | - https://www.nextpcb.com/advanced-pcb-manufacturing-capabilities (read 2026-09-03)]

layerSetup = (1*16)
mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 2.5mil
mdWirePad = 2.5mil
mdWireVia = 2.5mil
mdPadPad = 5.91mil
mdPadVia = 2.5mil
mdViaVia = 2.5mil
mdSmdPad = 2.5mil
mdSmdVia = 2.5mil
mdSmdSmd = 2.5mil
mdCopperDimension = 7.87mil
mdDrill = 7.87mil
msWidth = 2.5mil
msDrill = 5.91mil
mdViaViaSameLayer = 6mil
mdSmdStop = 0mil
msMicroVia = 12mil
msBlindViaRatio = 0.5
rvPadTop = 0
rvPadInner = 0
rvPadBottom = 0
rvViaOuter = 0
rvViaInner = 0
rvMicroViaOuter = 0
rvMicroViaInner = 0
rlMinPadTop = 7.09mil
rlMaxPadTop = 80mil
rlMinPadInner = 7.09mil
rlMaxPadInner = 20mil
rlMinPadBottom = 7.09mil
rlMaxPadBottom = 80mil
rlMinViaOuter = 3.94mil
rlMaxViaOuter = 20mil
rlMinViaInner = 3.94mil
rlMaxViaInner = 20mil
rlMinMicroViaOuter = 3.94mil
rlMaxMicroViaOuter = 20mil
rlMinMicroViaInner = 3.94mil
rlMaxMicroViaInner = 20mil
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 0
mvCreamFrame = 0
mlMinStopFrame = 1.5mil
mlMaxStopFrame = 4mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 20mil
srRoundness = 0
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 10mil
slThermalsForVias = 0
dpMaxLengthDifference = 400mil
dpGapFactor = 2.5
checkAngle = 0
checkRestrict = 1
checkStop = 0
checkValues = 0
checkNames = 1
checkWireStubs = 1
checkPolygonWidth = 0
useDiameter = 13
maxErrors = 50