PCB Design Rules

description[NextPCB 2-layer design rules (standard process) |  | Min trace width: 0.0635 mm (2.5 mil) - H/HOZ 0.5oz inner layer copper | Min spacing: 0.0762 mm (3.0 mil) - H/HOZ 0.5oz inner layer copper | Min drill: 0.15 mm (5.91 mil) | Min via: 0.2 mm hole / 0.3278 mm pad | Annular ring: via 0.0889 mm | Copper to board edge: 0.2 mm | Hole to hole: 0.3048 mm | Board thickness options: 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.6 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.2 mm | Copper weight options: 0.5 oz, 1 oz, 2 oz | Max board size: 1500 x 600 mm |  | Trace/spacing table is by copper weight, not layer count: 0.5oz inner 2.5mil width/3mil spacing, 1oz outer 3mil/3mil, 2oz outer 5.5mil/5.5mil. Annular ring: 3.5mil for 1oz, 4.5mil for 2oz. Min drill 0.15mm only for board thickness 1.2mm or less. PTH hole size 0.2mm or larger single side. Copper to V-cut line 0.4mm (15.748mil). Hole to hole different nets 12mil for CAF avoidance; via to via same net 8mil (0.2032mm); PTH to track 9mil (0.2286mm); NPTH to track 8mil (0.2032mm); SMD pad to track 4mil (0.1016mm); SMD pad to SMD pad 0.15mm; pad to pad with hole different nets 0.40mm. Mask sliver (solder bridge dam): green 3.5mil, black/white 5mil (0.127mm), other colors 4mil (0.1016mm). Silk line width: silkscreen printing 5mil (0.127mm), printer printing 3mil (0.0762mm). Finished copper outer 1oz/2oz, inner 0.5oz/1oz/2oz. Surface finish cell left blank on page. BGA 1oz: min pad 0.2mm, min pad distance 0.15mm. Layer count 1 to 32 supported. |  | Sources: | - https://www.nextpcb.com/pcb-capabilities (read 2026-09-03)]

layerSetup = (1*16)
mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 3.0mil
mdWirePad = 3.0mil
mdWireVia = 3.0mil
mdPadPad = 5.91mil
mdPadVia = 3.0mil
mdViaVia = 3.0mil
mdSmdPad = 3.0mil
mdSmdVia = 3.0mil
mdSmdSmd = 3.0mil
mdCopperDimension = 7.87mil
mdDrill = 12.0mil
msWidth = 2.5mil
msDrill = 5.91mil
mdViaViaSameLayer = 6mil
mdSmdStop = 0mil
msMicroVia = 12mil
msBlindViaRatio = 0.5
rvPadTop = 0
rvPadInner = 0
rvPadBottom = 0
rvViaOuter = 0
rvViaInner = 0
rvMicroViaOuter = 0
rvMicroViaInner = 0
rlMinPadTop = 7.09mil
rlMaxPadTop = 80mil
rlMinPadInner = 7.09mil
rlMaxPadInner = 20mil
rlMinPadBottom = 7.09mil
rlMaxPadBottom = 80mil
rlMinViaOuter = 3.5mil
rlMaxViaOuter = 20mil
rlMinViaInner = 3.5mil
rlMaxViaInner = 20mil
rlMinMicroViaOuter = 3.5mil
rlMaxMicroViaOuter = 20mil
rlMinMicroViaInner = 3.5mil
rlMaxMicroViaInner = 20mil
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 0
mvCreamFrame = 0
mlMinStopFrame = 1.5mil
mlMaxStopFrame = 4mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 20mil
srRoundness = 0
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 10mil
slThermalsForVias = 0
dpMaxLengthDifference = 400mil
dpGapFactor = 2.5
checkAngle = 0
checkRestrict = 1
checkStop = 0
checkValues = 0
checkNames = 1
checkWireStubs = 1
checkPolygonWidth = 0
useDiameter = 13
maxErrors = 50