PCB Design Rules - fusion/eurocircuits-4L.dru

by adom

Canonical PCB fab design rules (DRC) for every popular vendor: one JSON record per vendor, process and layer count, with generated Fusion/EAGLE .dru and .edru, KiCad .kicad_dru plus board-setup JSON, Altium .RUL exports, and a human comparison table. Every number cites the vendor's own capabilities page and the date it was read.

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John Lauer Initial publish: canonical per-vendor PCB fab design rules. 13 vendors, 56 records (vendor, process, layer count) read… bafc3ce 1mo ago

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description[Eurocircuits 4-layer design rules (standard process) |  | Min trace width: 0.1 mm (3.94 mil) - pooling; non-pooling 0.090 mm (3.5433 mil); inner layer same classification values | Min spacing: 0.1 mm (3.94 mil) - pooling; non-pooling 0.090 mm (3.5433 mil); pattern class 6 is 0.150 mm (5.9055 mil) | Min drill: 0.1 mm (3.94 mil) | Min via: 0.1 mm hole / 0.4 mm pad | Annular ring: via 0.125 mm | Copper to board edge: 0.25 mm | Hole to hole: 0.25 mm | Board thickness options: 1.0 mm, 1.55 mm | Copper weight options: 0.5 oz, 0.67 oz, 1 oz, 2 oz | Surface finishes: ENIG, LF HAL, Immersion Silver | Max board size: 500 x 425 mm |  | 4 layer pooling board thickness 1.00 mm; 1.55 mm pooling for 6 to 16 layers. Multilayer max dimension 500 x 425 mm. Standard buildups pooled, 8 predefined non-pooling builds; blind and buried vias non-pooling specials. Base copper inner layers pooling 18 µm and 35 µm. |  | Sources: | - https://www.eurocircuits.com/services/standard-pool/ (read 2026-09-03) | - https://www.eurocircuits.com/technical-guidelines/pcb-design-guidelines/classification/ (read 2026-09-03)]

layerSetup = (1*2*15*16)
mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 3.94mil
mdWirePad = 3.94mil
mdWireVia = 3.94mil
mdPadPad = 5.91mil
mdPadVia = 3.94mil
mdViaVia = 3.94mil
mdSmdPad = 3.94mil
mdSmdVia = 3.94mil
mdSmdSmd = 3.94mil
mdCopperDimension = 9.84mil
mdDrill = 9.84mil
msWidth = 3.94mil
msDrill = 3.94mil
mdViaViaSameLayer = 6mil
mdSmdStop = 0mil
msMicroVia = 12mil
msBlindViaRatio = 0.5
rvPadTop = 0
rvPadInner = 0
rvPadBottom = 0
rvViaOuter = 0
rvViaInner = 0
rvMicroViaOuter = 0
rvMicroViaInner = 0
rlMinPadTop = 7.09mil
rlMaxPadTop = 80mil
rlMinPadInner = 7.09mil
rlMaxPadInner = 20mil
rlMinPadBottom = 7.09mil
rlMaxPadBottom = 80mil
rlMinViaOuter = 4.92mil
rlMaxViaOuter = 20mil
rlMinViaInner = 4.92mil
rlMaxViaInner = 20mil
rlMinMicroViaOuter = 4.92mil
rlMaxMicroViaOuter = 20mil
rlMinMicroViaInner = 4.92mil
rlMaxMicroViaInner = 20mil
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 0
mvCreamFrame = 0
mlMinStopFrame = 1.5mil
mlMaxStopFrame = 4mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 20mil
srRoundness = 0
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 10mil
slThermalsForVias = 0
dpMaxLengthDifference = 400mil
dpGapFactor = 2.5
checkAngle = 0
checkRestrict = 1
checkStop = 0
checkValues = 0
checkNames = 1
checkWireStubs = 1
checkPolygonWidth = 0
useDiameter = 13
maxErrors = 50