PCB Design Rules

description[Eurocircuits 2-layer design rules (standard process) |  | Min trace width: 0.1 mm (3.94 mil) - pooling; non-pooling 0.090 mm (3.5433 mil) | Min spacing: 0.1 mm (3.94 mil) - pooling; non-pooling 0.090 mm (3.5433 mil); pattern class table: class 6 track/gap 0.150 mm (5.9055 mil), class 7 0.125 mm (4.9213 mil), class 8 0.100 mm (3.937 mil), class 9 0.090 mm (3.5433 mil), class 5 0.175 mm (6.8898 mil) | Min drill: 0.1 mm (3.94 mil) | Min via: 0.1 mm hole / 0.4 mm pad | Annular ring: via 0.125 mm | Copper to board edge: 0.25 mm | Hole to hole: 0.25 mm | Board thickness options: 1.0 mm, 1.55 mm, 2.4 mm | Copper weight options: 0.5 oz, 0.67 oz, 1 oz, 2 oz | Surface finishes: ENIG, LF HAL, Immersion Silver | Max board size: 580 x 425 mm |  | Min board 5 x 5 mm. Base copper foil pooling 2 layer: 12 µm (0.33 oz), 18 µm (0.5 oz), 35 µm (1 oz), 70 µm (2 oz); inner layers 18 µm and 35 µm. Minimum pad diameter: outer PTH finished hole plus 0.300 mm, outer NPTH plus 0.200 mm, inner PTH plus 0.350 mm, inner NPTH plus 0.250 mm. Classification min pattern values also limited by base copper foil: 12 µm 0.090 mm (3.5 mil), 18 µm 0.100 mm (4 mil), 35 µm 0.125 mm (5 mil), 70 µm 0.200 mm (8 mil), 105 µm 0.250 mm (10 mil), for both outer and inner layers. Drill class minimum TOOLSIZE: class A 0.60 mm (23.622 mil), B 0.45 mm (17.7165 mil), C 0.35 mm (13.7795 mil), D 0.25 mm (9.8425 mil), E 0.20 mm (7.874 mil); max board thickness per drill class: A and B 3.20 mm, C 2.40 mm, D 2.00 mm, E 1.60 mm; aspect ratio 1:8. TOOLSIZE equals finished PTH size plus 0.10 mm (4 mil). Soldermask colors pooling: green, blue, black, white, red; non-pooling transparent. Legend white one or both sides, non-pooling black and white. |  | Sources: | - https://www.eurocircuits.com/services/standard-pool/ (read 2026-09-03) | - https://www.eurocircuits.com/technical-guidelines/pcb-design-guidelines/classification/ (read 2026-09-03) | - https://www.eurocircuits.com/content/uploads/2025/04/EC-classification-ENGLISH-5-2024-V3.png (read 2026-09-03)]

layerSetup = (1*16)
mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 3.94mil
mdWirePad = 3.94mil
mdWireVia = 3.94mil
mdPadPad = 5.91mil
mdPadVia = 3.94mil
mdViaVia = 3.94mil
mdSmdPad = 3.94mil
mdSmdVia = 3.94mil
mdSmdSmd = 3.94mil
mdCopperDimension = 9.84mil
mdDrill = 9.84mil
msWidth = 3.94mil
msDrill = 3.94mil
mdViaViaSameLayer = 6mil
mdSmdStop = 0mil
msMicroVia = 12mil
msBlindViaRatio = 0.5
rvPadTop = 0
rvPadInner = 0
rvPadBottom = 0
rvViaOuter = 0
rvViaInner = 0
rvMicroViaOuter = 0
rvMicroViaInner = 0
rlMinPadTop = 7.09mil
rlMaxPadTop = 80mil
rlMinPadInner = 7.09mil
rlMaxPadInner = 20mil
rlMinPadBottom = 7.09mil
rlMaxPadBottom = 80mil
rlMinViaOuter = 4.92mil
rlMaxViaOuter = 20mil
rlMinViaInner = 4.92mil
rlMaxViaInner = 20mil
rlMinMicroViaOuter = 4.92mil
rlMaxMicroViaOuter = 20mil
rlMinMicroViaInner = 4.92mil
rlMaxMicroViaInner = 20mil
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 0
mvCreamFrame = 0
mlMinStopFrame = 1.5mil
mlMaxStopFrame = 4mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 20mil
srRoundness = 0
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 10mil
slThermalsForVias = 0
dpMaxLengthDifference = 400mil
dpGapFactor = 2.5
checkAngle = 0
checkRestrict = 1
checkStop = 0
checkValues = 0
checkNames = 1
checkWireStubs = 1
checkPolygonWidth = 0
useDiameter = 13
maxErrors = 50