PCB Design Rules

description[ALLPCB 2-layer design rules (standard process) |  | Min trace width: 0.1 mm (3.94 mil) - all copper weights; vendor suggests 6mil (0.15mm) or more to save cost | Min spacing: 0.1 mm (3.94 mil) - all copper weights; vendor suggests 6mil (0.15mm) or more to save cost | Min drill: 0.2 mm (7.87 mil) | Min via: 0.2 mm hole / 0.506 mm pad | Annular ring: via 0.153 mm | Copper to board edge: 0.3 mm | Hole to hole: 0.2032 mm | Board thickness options: 0.4 mm, 3.2 mm | Copper weight options: 0.5 oz, 1 oz, 2 oz | Surface finishes: HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, Hard Gold plating, Soft Gold plating, NiPdAu | Max board size: 506 x 580 mm |  | Single published limit set covers 1 to 14 layers, so this entry also applies to 4 and 6 layer boards. Board thickness is a continuous 0.4 to 3.2mm range. Copper: outer 1oz to 2oz (35 to 70um), inner 0.5oz to 2oz (18 to 70um). Min dimension 80x80mm. Drill range 0.2 to 6.5mm, finished CNC hole 0.2 to 6.5mm, hole size tolerance ±0.075mm. Copper to V-cut line 0.4mm (15.748mil) for panelized boards. Via space same net 8mil (0.2032mm), different nets 17mil (0.4318mm), component vias different nets 24mil (0.6096mm). Annular ring 6mil or larger where surrounded by traces. Min slot width 0.6mm, finished slot 0.45mm for HASL and 0.5mm for other finishes. Board thickness to via diameter ratio 6:1, 7:1 to 8:1 adds a fabrication day. Min character height 0.8mm (31.4961mil), width to height ratio 1:5. Mask sliver recorded from solder mask bridge value 0.1mm (price may rise). |  | Sources: | - https://www.allpcb.com/standard_pcb_manufacturing_capability.html (read 2026-09-03)]

layerSetup = (1*16)
mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 3.94mil
mdWirePad = 3.94mil
mdWireVia = 3.94mil
mdPadPad = 5.91mil
mdPadVia = 3.94mil
mdViaVia = 3.94mil
mdSmdPad = 3.94mil
mdSmdVia = 3.94mil
mdSmdSmd = 3.94mil
mdCopperDimension = 11.81mil
mdDrill = 8.0mil
msWidth = 3.94mil
msDrill = 7.87mil
mdViaViaSameLayer = 6mil
mdSmdStop = 0mil
msMicroVia = 12mil
msBlindViaRatio = 0.5
rvPadTop = 0
rvPadInner = 0
rvPadBottom = 0
rvViaOuter = 0
rvViaInner = 0
rvMicroViaOuter = 0
rvMicroViaInner = 0
rlMinPadTop = 7.09mil
rlMaxPadTop = 80mil
rlMinPadInner = 7.09mil
rlMaxPadInner = 20mil
rlMinPadBottom = 7.09mil
rlMaxPadBottom = 80mil
rlMinViaOuter = 6.02mil
rlMaxViaOuter = 20mil
rlMinViaInner = 6.02mil
rlMaxViaInner = 20mil
rlMinMicroViaOuter = 6.02mil
rlMaxMicroViaOuter = 20mil
rlMinMicroViaInner = 6.02mil
rlMaxMicroViaInner = 20mil
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 0
mvCreamFrame = 0
mlMinStopFrame = 1.5mil
mlMaxStopFrame = 4mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 20mil
srRoundness = 0
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 10mil
slThermalsForVias = 0
dpMaxLengthDifference = 400mil
dpGapFactor = 2.5
checkAngle = 0
checkRestrict = 1
checkStop = 0
checkValues = 0
checkNames = 1
checkWireStubs = 1
checkPolygonWidth = 0
useDiameter = 13
maxErrors = 50