Loads when you scroll to it. Unloads after 5 minutes in the background.
Contents

README

markdown

MCP2562FD-E/SN

Microchip Technology · High-speed CAN FD transceiver with VIO pin · SOIC-8 (SN, 3.90 mm body)

MCP2562FD-E/SN is the SOIC-8, extended-temperature member of Microchip's MCP2561/2FD family: a second-generation high-speed CAN transceiver that implements the ISO 11898-2 and ISO 11898-5 physical layer, guarantees loop delay symmetry for CAN FD, and has a VIO pin so TXD, RXD and STBY talk directly to 1.8 V to 5.5 V logic while the transceiver runs from a 5 V VDD (DS20005284B p.1, p.4).

Key specifications

Parameter Value Source
Function High-speed CAN transceiver optimized for CAN FD (2, 5 and 8 Mbps operation) p.1
Standards ISO 11898-2, ISO 11898-5 p.1
VDD supply 4.5 V to 5.5 V; 5 mA typ recessive, 45 mA typ dominant p.9
VIO (digital I/O supply) 1.8 V to 5.5 V p.9
Standby current 5 uA typ, 15 uA max (VDD, includes IIO) p.9
Propagation delay TXD to RXD 90 ns typ, 120 ns max p.13
Bit rate (AC table) 14.4 kHz to 5000 kHz bit frequency, 0.2 us minimum bit time p.13
Bus pin DC range -58 V to +58 V (absolute maximum) p.8
ESD on CANH, CANL (IEC 61000-4-2) +-8 kV for MCP2562FD (the +-14 kV figure on p.1 is the MCP2561FD's) p.8
Thermal shutdown 175 C typ junction p.11
Temperature range (-E) -40 C to +125 C ambient p.1, p.29
Package 8-lead SOIC (SN), 3.90 x 4.90 mm body, 1.27 mm pitch, 1.75 mm max height p.23 to p.24
Unpowered behaviour CANH and CANL disconnect from the bus; an unpowered node does not load it p.1, p.5

Pinout (SOIC-8, top view)

Pin Name Type Function
1 TXD input Transmit data from the CAN controller. Low = bus Dominant, high = Recessive. Internal pull-up (nominal 33 kOhm) to VIO.
2 VSS power Ground.
3 VDD power Supply, 4.5 V to 5.5 V; powers the transmitter and both receivers.
4 RXD output Receive data to the CAN controller, push-pull from VIO: high when the bus is Recessive, low when Dominant.
5 VIO power Digital I/O supply, 1.8 V to 5.5 V; sets the logic level of TXD, RXD and STBY.
6 CANL bidirectional CAN bus low-level I/O.
7 CANH bidirectional CAN bus high-level I/O.
8 STBY input Low = Normal mode; high = Standby (transmitter and high-speed receiver off, low-power wake-up receiver on). Internal pull-up to VIO.

Source: DS20005284B p.4 (Table 1-2) and p.5 (sections 1.7.1 to 1.7.9).

Design notes

  • Two supplies. VDD needs 4.5 V to 5.5 V; VIO follows the controller's logic rail. The bus wake-up function needs both in range (p.3). Microchip's application figure decouples each with 0.1 uF (Figure 1-2, p.6).
  • Modes. STBY low = Normal; STBY high = Standby, where RXD shows a filtered copy of the bus so a dominant bus can wake the controller (Table 1-1, p.3).
  • Dominant time-out. A TXD or bus dominant for longer than 1.25 ms (typ) is treated as a fault, which limits the slowest usable bit time to 69.44 us (p.4).
  • EMC. Microchip notes a common-mode choke may be needed above 1 Mbps (p.6). Example only: the typical-application figure ends the bus in 120 Ohm; split termination is drawn for the MCP2561FD's SPLIT pin, which this part does not have.
  • Family. MCP2561FD has a SPLIT pin on pin 5 instead of VIO; MCP2562FDT-E/SN is this part on tape and reel; -H parts run to +150 C; the SNVAO suffix is AEC-Q100 qualified (p.29).

CAD

File What it is
mcp2562fd-e-sn.kicad_sym KiCad symbol MCP2562FD-E-SN (adom-symbol 1.2.6), pins grouped Controller / CAN bus / Power / Ground, chip outline drawn in the body. Properties: MPN, Manufacturer, Datasheet, Mouser, DigiKey, LCSC, Adom Wiki.
mcp2562fd-e-sn.kicad_mod KiCad footprint built with adom-footprint to Microchip's recommended land pattern. Its 3D path is ${KIPRJMOD}/mcp2562fd-e-sn-etched.step; put the STEP beside your project or repoint the path.
mcp2562fd-e-sn.lbr Fusion / EAGLE library (adom-lbr 2.47.5, lint PASS) with MPN, MANUFACTURER, MOUSER_PN, DIGIKEY_PN, LCSC_PN attributes.
altium/MCP2562FD-E-SN.SchLib, altium/MCP2562FD-E-SN.PcbLib Native Altium libraries (adom-lbr assemble-altium) with the etched STEP embedded in the footprint and Supplier 1 to 3 parameters. Altium does not allow / in a component name, so the component is MCP2562FD-E_SN; its MPN parameters keep the exact MCP2562FD-E/SN.
altium/MCP2562FD-E-SN.adom-lbr.json The adom-lbr hub (symbol, footprint, pin to pad map) every export is made from.
mcp2562fd-e-sn-etched.step The library 3D model (see below).

Footprint

The pads follow Microchip's recommended land pattern (DS20005284B p.25, drawing C04-02057-SN Rev L): eight 1.55 x 0.60 mm rectangles, contact pad spacing C = 5.40 mm (pad centres at x = +-2.70), pitch 1.27 mm. Each pad was compared with the drawing (provenance/footprint-check.json): all eight match.

KiCad's stock SOIC-8_3.9x4.9mm_P1.27mm is not the same pattern: its pads are 1.95 x 0.60 mm at x = +-2.475 (IPC nominal for JEDEC MS-012), reaching 0.425 mm further under the body. Either solders; this page follows the manufacturer.

Footprint check

Pin 1: pad 1 is top left in KiCad's footprint frame, with a silkscreen bar above it. The 3D model's pin 1 lead and its pin-1 dimple land on pad 1 with zero offset and rotation, and the pin order runs counter-clockwise seen from the top, as in Microchip's top view (p.23).

3D models

File What it is
mcp2562fd-e-sn-etched.step Library model for board CAD: the package with the MPN etched on top in an Adom.LaserEtch group.
mcp2562fd-e-sn.step The same package, unmarked.
mcp2562fd-e-sn-etched.glb Web and board-viewer copy of the etched model, matte-tin leads, no footprint artwork.
mcp2562fd-e-sn.glb Web copy of the unmarked model.
lod/ Four board detail levels (below).

Frame for every file: Z up, seated on z = 0, centred on the footprint origin, pin 1 at (-x, +y), which is footprint pad 1.

How the model was made. Microchip's product page links its CAD models, but the page refused a plain request, so the manufacturer STEP was not obtained. KiCad's library model SOIC-8_3.9x4.9mm_P1.27mm.step was measured against Microchip's SN drawing (C04-00057-SN Rev L, p.24): every dimension fits except the foot. Measured on a section through pin 1's centre line, from the lead tip to where the lead's lower surface crosses the 0.25 mm gauge plane (JEDEC), KiCad's foot is 0.362 mm; Microchip's minimum is 0.40 mm (0.275 mm flat on KiCad's model). So the model was built from the drawing with CadQuery (provenance/tools/build_soic8.py), keeping KiCad's radiused gull-wing bends, lead angle, mold draft and pin-1 dimple and lengthening the flat foot until the gauge-plane foot measures 0.500 mm. Method and both numbers are in provenance/3d-model.json.

Lead section, KiCad library model and this model

Dimension (mm) Microchip min / nom / max Model KiCad library
e pitch 1.27 BSC 1.270 1.270
A overall height max 1.75 1.750 1.750
A2 molded thickness min 1.25 1.650 1.650
A1 standoff 0.10 / - / 0.25 0.100 0.100
E overall width 6.00 BSC 6.000 6.000
E1 molded width 3.90 BSC 3.900 3.900
D overall length 4.90 BSC 4.900 4.900
L foot, gauge plane 0.40 / - / 1.27 0.500 0.362
c lead thickness 0.17 / - / 0.25 0.200 0.200
b lead width 0.31 / - / 0.51 0.410 0.410
R, R1 bend radius min 0.07 0.10 0.10
Mold draft 5 to 15 deg 9.0 bottom, 11.6 top same

Not modelled: the optional end chamfer h.

The marking is virtual. The etch reads MCP2562 / FD-E/SN, the orderable part number, so the part is identifiable in a 3D board view. Microchip's real marking is 2562FDE / SN e3 YYWW / NNN (p.17). The etch was made with adom-chip-laser (service-occt flat mark, 5 um above the top face) placed by the adom-aiflow-etch planner from the footprint; its gate passes (axis, upright with pin 1 lower left, size 0.47 mm caps, band, flat, group, colour, widget).

Etch check

Detail levels for board and digital-twin viewers

Level File Triangles Marking
high mcp2562fd-e-sn-high.glb 1552 yes
medium mcp2562fd-e-sn-medium.glb 1168 yes
low mcp2562fd-e-sn-low.glb 732 no
super-low mcp2562fd-e-sn-super-low.glb 468 no

All four share the library model's frame and carry no footprint, silkscreen or label artwork. High is the etched GLB; medium and low come from the same generator with each bend drawn as three straight segments (medium keeps the etch); super-low has an undrafted body and one-segment bends. Every level keeps the eight leads and the pin-1 dimple. Status: candidate; the previews were inspected, a streaming LOD viewer has not qualified them.

Detail levels: high, medium, low, super-low

Symbol chip outline

The symbol body carries the chip outline drawn from the etched model by adom-aiflow-etch outline (gate PASS): artwork/MCP2562FD-E-SN-3d-outline-dark-named.svg. The KiCad symbol, the Fusion library and the Altium SchLib carry the same drawing.

Chip outline

Sourcing

Checked 2026-10-21 with adom-parts-search.

Distributor Part number Stock Price
Mouser 579-MCP2562FD-E/SN 10,466 1.29 USD (1), 0.98 USD (100)
DigiKey MCP2562FD-E/SN-ND 146 1.29 USD (1), 0.98 USD (100)
LCSC / JLCPCB C124016 1,719 JLCPCB extended part

The -E/SN part ships in tubes; order MCP2562FDT-E/SN for tape and reel (p.29).

Manufacturer and resources

Resource Link
Product page microchip.com/en-us/product/MCP2562FD
Datasheet DS20005284B, Revision B (March 2026), PDF on this page, microchip.com
Package drawings C04-00057-SN Rev L (outline), C04-02057-SN Rev L (land pattern); current versions at microchip.com/packaging
  • adom/mcp2562fdt-e: an earlier page for the tape-and-reel ordering code, built on KiCad's generic footprint and model.
  • adom/mcp2562t-e: the classical-CAN MCP2562.

Provenance

  • Datasheet: Microchip DS20005284B (March 2026), 31 pages, sha256 659565909388fcd7, downloaded from microchip.com on 2026-10-21 (docs/mcp2562fd-e-sn-datasheet.pdf). Every pin and spec above cites its page.
  • Footprint: provenance/footprint-check.json, pad by pad against p.25 and against KiCad's footprint.
  • 3D model: provenance/3d-model.json: source attempts, the KiCad comparison with method and numbers, build parameters, etch gate, hashes. The tools are in provenance/tools/; KiCad's reference footprint and model are kept in provenance/kicad-reference/ for the comparison.
  • Symbol: created from provenance/tools/symbol-create.json by adom-symbol 1.2.6, then every pin moved onto the 2.54 mm grid by snap_symbol.py (the tool placed the first pin of each column at y = -2.00 mm).
  • Licence: Adom-authored files (symbol, footprint, models, etch, artwork, libraries, tools, text) are CC-BY-4.0, see LICENSE. The datasheet is Microchip's and keeps Microchip's terms; the KiCad reference files keep CC-BY-SA 4.0 with the KiCad libraries exception.

Cited datasheet pages:

p.1 Features and package types p.4 Pin descriptions p.5 Pin functions p.8 Absolute maximum ratings p.9 DC characteristics p.13 AC characteristics p.17 Package marking p.23 SN package drawing p.24 SN package dimensions p.25 Recommended land pattern p.29 Product identification

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF