MCP2562FD-E/SN - CAN FD Transceiver

{
 "schema": "adom/3d-model-provenance@1",
 "mpn": "MCP2562FD-E/SN",
 "date": "2026-10-21",
 "classification": "Datasheet-built: a CadQuery model generated from Microchip's printed SN package values, with KiCad's library model's bend radii, lead angle, mold draft and pin-1 dimple; produced by Claude (AI) for Adom. Not manufacturer CAD and not a Microchip certification.",
 "method_chosen": "3 (build from the drawing): Microchip's own STEP was not reachable and KiCad's library model fails the drawing's L minimum",
 "manufacturer_step": {
  "tried": "https://www.microchip.com/en-us/product/MCP2562FD (CAD/CAE models on the product page; served through a third-party CAD portal)",
  "result": "HTTP 403 to a plain request on 2026-10-21; no browser session was used, so the Microchip model was not obtained",
  "status": "not reachable"
 },
 "datasheet": {
  "doc": "Microchip DS20005284B (Revision B, March 2026), MCP2561/2FD High-Speed CAN Flexible Data Rate Transceiver",
  "file": "docs/mcp2562fd-e-sn-datasheet.pdf",
  "url": "https://ww1.microchip.com/downloads/aemDocuments/documents/APID/ProductDocuments/DataSheets/MCP2561-2FD-High-Speed-CAN-Flexible-Data-Rate-Transceiver-DS20005284.pdf",
  "sha256": "659565909388fcd77320917548074362a2f4ff1a76d241e0e5206e114f9ccb71",
  "drawing_pages": "p.23-24 (C04-00057-SN Rev L), p.25 land pattern (C04-02057-SN Rev L)",
  "marking_page": "p.17"
 },
 "kicad_library_check": {
  "model": "KiCad packages3D Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.step (CC-BY-SA 4.0)",
  "file": "provenance/kicad-reference/SOIC-8_3.9x4.9mm_P1.27mm.step",
  "sha256": "07f46cff378d30e6c27dfd5a03092c795323f86d91c71fc7e743f4f418dc553a",
  "measured": "L, the foot length",
  "datasheet": "0.40 min / 1.27 max (no nominal printed)",
  "kicad_library": 0.362,
  "built": 0.5,
  "method": "section through pin 1's centre line (plane y = +1.905 in the 3D frame), cut at the 0.25 mm gauge plane (z = 0.25); L = distance from the lead tip to where the lead's lower outer surface crosses the gauge plane (JEDEC definition); provenance/tools/dims.py. The flat bottom alone (the reading of Microchip's View C without a gauge plane) is 0.275 mm on KiCad's model and 0.413 mm on this one, so the verdict holds either way.",
  "verdict": "Every other printed dimension of KiCad's model is inside the drawing, but its foot is 0.362 mm at the gauge plane (0.275 mm flat), under Microchip's 0.40 mm minimum, so it was not used as is. KiCad's package generator was not run (it would be downloaded code); the model was rebuilt with the same bend shape and a longer flat foot instead.",
  "evidence": "docs/proof/mcp2562fd-e-sn-lead-vs-kicad.png"
 },
 "model": {
  "file": "mcp2562fd-e-sn.step",
  "sha256": "8b668368e9ffd03575f4b5c2fef99dc8e9ce14b26ebd782684aaa2cc463c3a58",
  "builder": "provenance/tools/build_soic8.py (CadQuery 2.x, OpenCascade)",
  "params": "provenance/tools/params.json",
  "how": "drafted two-part body loft (parting line 0.825), eight swept leads (rectangle b x c along a centreline with two 0.20 mm centreline-radius bends, 9.3 deg off vertical), pin-1 dimple 0.60 mm diameter, 0.05 mm deep; flat foot 0.413 mm tuned so the gauge-plane L is 0.50 mm",
  "L_target": "0.50 mm, chosen inside 0.40 to 1.27 (neither Microchip nor JEDEC MS-012 prints a nominal)",
  "frame": "Z up, seated on z = 0, centred on the KiCad footprint origin, pin 1 at (-x, +y) = footprint pad 1 at (-2.70, -1.905) in KiCad's Y-down footprint frame; binds with zero offset and rotation",
  "parts": {
   "body": "black epoxy",
   "pins": "matte tin"
  },
  "dimensions_mm": [
   {
    "item": "e pitch",
    "datasheet_min_typ_max": "1.27 BSC",
    "model": "1.270",
    "kicad_library": "1.270"
   },
   {
    "item": "A overall height",
    "datasheet_min_typ_max": "max 1.75",
    "model": "1.750",
    "kicad_library": "1.750"
   },
   {
    "item": "A2 molded thickness",
    "datasheet_min_typ_max": "min 1.25",
    "model": "1.650",
    "kicad_library": "1.650"
   },
   {
    "item": "A1 standoff",
    "datasheet_min_typ_max": "0.10 / - / 0.25",
    "model": "0.100",
    "kicad_library": "0.100"
   },
   {
    "item": "E overall width",
    "datasheet_min_typ_max": "6.00 BSC",
    "model": "6.000",
    "kicad_library": "6.000"
   },
   {
    "item": "E1 molded width",
    "datasheet_min_typ_max": "3.90 BSC",
    "model": "3.900",
    "kicad_library": "3.900"
   },
   {
    "item": "D overall length",
    "datasheet_min_typ_max": "4.90 BSC",
    "model": "4.900",
    "kicad_library": "4.900"
   },
   {
    "item": "L foot length (gauge plane 0.25 mm)",
    "datasheet_min_typ_max": "0.40 / - / 1.27",
    "model": "0.500",
    "kicad_library": "0.362"
   },
   {
    "item": "L foot, flat bottom only",
    "datasheet_min_typ_max": "0.40 / - / 1.27",
    "model": "0.413",
    "kicad_library": "0.275"
   },
   {
    "item": "L1 footprint (tip to body)",
    "datasheet_min_typ_max": "1.04 REF",
    "model": "1.050",
    "kicad_library": "1.050"
   },
   {
    "item": "c lead thickness",
    "datasheet_min_typ_max": "0.17 / - / 0.25",
    "model": "0.200",
    "kicad_library": "0.200"
   },
   {
    "item": "b lead width",
    "datasheet_min_typ_max": "0.31 / - / 0.51",
    "model": "0.410",
    "kicad_library": "0.410"
   },
   {
    "item": "R, R1 bend radius (inner)",
    "datasheet_min_typ_max": "min 0.07",
    "model": "0.10",
    "kicad_library": "0.10"
   },
   {
    "item": "theta1 mold draft",
    "datasheet_min_typ_max": "5 to 15 deg",
    "model": "9.0 (bottom) / 11.6 (top)",
    "kicad_library": "9.0 / 11.6"
   },
   {
    "item": "h chamfer",
    "datasheet_min_typ_max": "0.25 to 0.50 (optional)",
    "model": "not modelled",
    "kicad_library": "not modelled"
   }
  ],
  "pin1_mark": "0.60 mm dimple at (-1.11, +1.61) on the top face, KiCad's position for its pin-1 circle; Microchip note 1: the pin-1 index may vary but lies in the hatched pin-1 quadrant",
  "not_modelled": "optional end chamfer h; mold flash",
  "measurements": [
   "provenance/dims-model.json",
   "provenance/dims-kicad-library.json"
  ]
 },
 "etched": {
  "file": "mcp2562fd-e-sn-etched.step",
  "sha256": "312b626ec67e979028ea640bd76a6d93874bd62054c73085ea2f1eea25065027",
  "tool": "adom-chip-laser 0.2.0 service (service-occt /laser-etch, flat light mark 5 um above the face, Adom.LaserEtch group), placed by adom-aiflow-etch's planner with the page footprint",
  "lines": [
   "MCP2562",
   "FD-E/SN"
  ],
  "capMm": 0.473,
  "virtual": true,
  "gate": "adom-aiflow-etch check: PASS (axis, upright, size, band, flat, group, colour, widget)",
  "first_try": "a direct adom-chip-laser etch (surface=top) failed the gate's size check (0.27 mm text, 56 % of what fits) and is not published",
  "check_image": "docs/proof/mcp2562fd-e-sn-etched.check.png",
  "plan": "docs/proof/mcp2562fd-e-sn-etched.mark-plan.json",
  "real_marking": "Microchip marks the SOIC as 2562FDE / SN e3 YYWW / NNN (DS20005284B p.17); the etch is the orderable MPN instead, as a virtual identification aid"
 },
 "glb": {
  "mcp2562fd-e-sn.glb": "1b56d6ed7bfc5096655f2863b2251d1051811bbbd864369d47ef95a318d33fc6",
  "mcp2562fd-e-sn-etched.glb": "5f79bd363586ef65c033a61bbc3a8b0dc44d2e583bcacea57ec1ffbd131ff0df"
 },
 "outline": {
  "file": "artwork/MCP2562FD-E-SN-3d-outline-dark-named.svg",
  "sha256": "fe2e7b0b734d2c8c45f16e81ff917ebb09f24bdbcfda0b273d56da10b5decd23",
  "tool": "adom-aiflow-etch outline (service body outline + single-stroke name on the planned band)",
  "gate": "PASS"
 },
 "tools": {
  "adom-chip-laser": "0.2.0",
  "adom-aiflow-etch": "adom/adom-aiflow (installed)",
  "step2glb": "0.13.2",
  "adom-symbol": "1.2.6",
  "adom-footprint": "1.0.26",
  "adom-lbr": "2.47.5",
  "cadquery": "2.x (local venv)"
 },
 "license": "Model, etch and artwork authored by Adom: CC-BY-4.0. The KiCad reference model in provenance/kicad-reference keeps CC-BY-SA 4.0 with the KiCad libraries exception. The Microchip datasheet keeps Microchip's terms."
}