MCP2562FD-E/SN - CAN FD Transceiver
Public Made by Adomby adom
Microchip MCP2562FD-E/SN: high-speed CAN FD transceiver with a VIO pin for 1.8 V to 5.5 V logic, ISO 11898-2/-5, extended temperature, SOIC-8. KiCad symbol and footprint, Fusion and Altium libraries, 3D model and datasheet.
| Name | Last updated |
|---|---|
| altium | 2d ago |
| artwork | 2d ago |
| docs | 2d ago |
| lod | 2d ago |
| provenance | 2d ago |
| viewers | 2d ago |
| LICENSE | 2d ago |
| mcp2562fd-e-sn-etched.glb | 2d ago |
| mcp2562fd-e-sn-etched.step | 2d ago |
| mcp2562fd-e-sn.glb | 2d ago |
| mcp2562fd-e-sn.kicad_mod | 2d ago |
| mcp2562fd-e-sn.kicad_sym | 2d ago |
| mcp2562fd-e-sn.lbr | 2d ago |
| mcp2562fd-e-sn.step | 2d ago |
| models.json | 2d ago |
| page.json | 2d ago |
| README.md | 2d ago |
| verification.json | 2d ago |
MCP2562FD-E/SN
Microchip Technology · High-speed CAN FD transceiver with VIO pin · SOIC-8 (SN, 3.90 mm body)
MCP2562FD-E/SN is the SOIC-8, extended-temperature member of Microchip's MCP2561/2FD family: a second-generation high-speed CAN transceiver that implements the ISO 11898-2 and ISO 11898-5 physical layer, guarantees loop delay symmetry for CAN FD, and has a VIO pin so TXD, RXD and STBY talk directly to 1.8 V to 5.5 V logic while the transceiver runs from a 5 V VDD (DS20005284B p.1, p.4).
Key specifications
| Parameter | Value | Source |
|---|---|---|
| Function | High-speed CAN transceiver optimized for CAN FD (2, 5 and 8 Mbps operation) | p.1 |
| Standards | ISO 11898-2, ISO 11898-5 | p.1 |
| VDD supply | 4.5 V to 5.5 V; 5 mA typ recessive, 45 mA typ dominant | p.9 |
| VIO (digital I/O supply) | 1.8 V to 5.5 V | p.9 |
| Standby current | 5 uA typ, 15 uA max (VDD, includes IIO) | p.9 |
| Propagation delay TXD to RXD | 90 ns typ, 120 ns max | p.13 |
| Bit rate (AC table) | 14.4 kHz to 5000 kHz bit frequency, 0.2 us minimum bit time | p.13 |
| Bus pin DC range | -58 V to +58 V (absolute maximum) | p.8 |
| ESD on CANH, CANL (IEC 61000-4-2) | +-8 kV for MCP2562FD (the +-14 kV figure on p.1 is the MCP2561FD's) | p.8 |
| Thermal shutdown | 175 C typ junction | p.11 |
| Temperature range (-E) | -40 C to +125 C ambient | p.1, p.29 |
| Package | 8-lead SOIC (SN), 3.90 x 4.90 mm body, 1.27 mm pitch, 1.75 mm max height | p.23 to p.24 |
| Unpowered behaviour | CANH and CANL disconnect from the bus; an unpowered node does not load it | p.1, p.5 |
Pinout (SOIC-8, top view)
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TXD | input | Transmit data from the CAN controller. Low = bus Dominant, high = Recessive. Internal pull-up (nominal 33 kOhm) to VIO. |
| 2 | VSS | power | Ground. |
| 3 | VDD | power | Supply, 4.5 V to 5.5 V; powers the transmitter and both receivers. |
| 4 | RXD | output | Receive data to the CAN controller, push-pull from VIO: high when the bus is Recessive, low when Dominant. |
| 5 | VIO | power | Digital I/O supply, 1.8 V to 5.5 V; sets the logic level of TXD, RXD and STBY. |
| 6 | CANL | bidirectional | CAN bus low-level I/O. |
| 7 | CANH | bidirectional | CAN bus high-level I/O. |
| 8 | STBY | input | Low = Normal mode; high = Standby (transmitter and high-speed receiver off, low-power wake-up receiver on). Internal pull-up to VIO. |
Source: DS20005284B p.4 (Table 1-2) and p.5 (sections 1.7.1 to 1.7.9).
Design notes
- Two supplies. VDD needs 4.5 V to 5.5 V; VIO follows the controller's logic rail. The bus wake-up function needs both in range (p.3). Microchip's application figure decouples each with 0.1 uF (Figure 1-2, p.6).
- Modes. STBY low = Normal; STBY high = Standby, where RXD shows a filtered copy of the bus so a dominant bus can wake the controller (Table 1-1, p.3).
- Dominant time-out. A TXD or bus dominant for longer than 1.25 ms (typ) is treated as a fault, which limits the slowest usable bit time to 69.44 us (p.4).
- EMC. Microchip notes a common-mode choke may be needed above 1 Mbps (p.6). Example only: the typical-application figure ends the bus in 120 Ohm; split termination is drawn for the MCP2561FD's SPLIT pin, which this part does not have.
- Family. MCP2561FD has a SPLIT pin on pin 5 instead of VIO; MCP2562FDT-E/SN is this part on tape and reel; -H parts run to +150 C; the SNVAO suffix is AEC-Q100 qualified (p.29).
CAD
| File | What it is |
|---|---|
| mcp2562fd-e-sn.kicad_sym | KiCad symbol MCP2562FD-E-SN (adom-symbol 1.2.6), pins grouped Controller / CAN bus / Power / Ground, chip outline drawn in the body. Properties: MPN, Manufacturer, Datasheet, Mouser, DigiKey, LCSC, Adom Wiki. |
| mcp2562fd-e-sn.kicad_mod | KiCad footprint built with adom-footprint to Microchip's recommended land pattern. Its 3D path is ${KIPRJMOD}/mcp2562fd-e-sn-etched.step; put the STEP beside your project or repoint the path. |
| mcp2562fd-e-sn.lbr | Fusion / EAGLE library (adom-lbr 2.47.5, lint PASS) with MPN, MANUFACTURER, MOUSER_PN, DIGIKEY_PN, LCSC_PN attributes. |
| altium/MCP2562FD-E-SN.SchLib, altium/MCP2562FD-E-SN.PcbLib | Native Altium libraries (adom-lbr assemble-altium) with the etched STEP embedded in the footprint and Supplier 1 to 3 parameters. Altium does not allow / in a component name, so the component is MCP2562FD-E_SN; its MPN parameters keep the exact MCP2562FD-E/SN. |
| altium/MCP2562FD-E-SN.adom-lbr.json | The adom-lbr hub (symbol, footprint, pin to pad map) every export is made from. |
| mcp2562fd-e-sn-etched.step | The library 3D model (see below). |
Footprint
The pads follow Microchip's recommended land pattern (DS20005284B p.25, drawing C04-02057-SN Rev L): eight 1.55 x 0.60 mm rectangles, contact pad spacing C = 5.40 mm (pad centres at x = +-2.70), pitch 1.27 mm. Each pad was compared with the drawing (provenance/footprint-check.json): all eight match.
KiCad's stock SOIC-8_3.9x4.9mm_P1.27mm is not the same pattern: its pads are 1.95 x 0.60 mm at x = +-2.475 (IPC nominal for JEDEC MS-012), reaching 0.425 mm further under the body. Either solders; this page follows the manufacturer.

Pin 1: pad 1 is top left in KiCad's footprint frame, with a silkscreen bar above it. The 3D model's pin 1 lead and its pin-1 dimple land on pad 1 with zero offset and rotation, and the pin order runs counter-clockwise seen from the top, as in Microchip's top view (p.23).
3D models
| File | What it is |
|---|---|
| mcp2562fd-e-sn-etched.step | Library model for board CAD: the package with the MPN etched on top in an Adom.LaserEtch group. |
| mcp2562fd-e-sn.step | The same package, unmarked. |
| mcp2562fd-e-sn-etched.glb | Web and board-viewer copy of the etched model, matte-tin leads, no footprint artwork. |
| mcp2562fd-e-sn.glb | Web copy of the unmarked model. |
| lod/ | Four board detail levels (below). |
Frame for every file: Z up, seated on z = 0, centred on the footprint origin, pin 1 at (-x, +y), which is footprint pad 1.
How the model was made. Microchip's product page links its CAD models, but the page refused a plain request, so the manufacturer STEP was not obtained. KiCad's library model SOIC-8_3.9x4.9mm_P1.27mm.step was measured against Microchip's SN drawing (C04-00057-SN Rev L, p.24): every dimension fits except the foot. Measured on a section through pin 1's centre line, from the lead tip to where the lead's lower surface crosses the 0.25 mm gauge plane (JEDEC), KiCad's foot is 0.362 mm; Microchip's minimum is 0.40 mm (0.275 mm flat on KiCad's model). So the model was built from the drawing with CadQuery (provenance/tools/build_soic8.py), keeping KiCad's radiused gull-wing bends, lead angle, mold draft and pin-1 dimple and lengthening the flat foot until the gauge-plane foot measures 0.500 mm. Method and both numbers are in provenance/3d-model.json.

| Dimension (mm) | Microchip min / nom / max | Model | KiCad library |
|---|---|---|---|
| e pitch | 1.27 BSC | 1.270 | 1.270 |
| A overall height | max 1.75 | 1.750 | 1.750 |
| A2 molded thickness | min 1.25 | 1.650 | 1.650 |
| A1 standoff | 0.10 / - / 0.25 | 0.100 | 0.100 |
| E overall width | 6.00 BSC | 6.000 | 6.000 |
| E1 molded width | 3.90 BSC | 3.900 | 3.900 |
| D overall length | 4.90 BSC | 4.900 | 4.900 |
| L foot, gauge plane | 0.40 / - / 1.27 | 0.500 | 0.362 |
| c lead thickness | 0.17 / - / 0.25 | 0.200 | 0.200 |
| b lead width | 0.31 / - / 0.51 | 0.410 | 0.410 |
| R, R1 bend radius | min 0.07 | 0.10 | 0.10 |
| Mold draft | 5 to 15 deg | 9.0 bottom, 11.6 top | same |
Not modelled: the optional end chamfer h.
The marking is virtual. The etch reads MCP2562 / FD-E/SN, the orderable part number, so the part is identifiable in a 3D board view. Microchip's real marking is 2562FDE / SN e3 YYWW / NNN (p.17). The etch was made with adom-chip-laser (service-occt flat mark, 5 um above the top face) placed by the adom-aiflow-etch planner from the footprint; its gate passes (axis, upright with pin 1 lower left, size 0.47 mm caps, band, flat, group, colour, widget).

Detail levels for board and digital-twin viewers
| Level | File | Triangles | Marking |
|---|---|---|---|
| high | mcp2562fd-e-sn-high.glb | 1552 | yes |
| medium | mcp2562fd-e-sn-medium.glb | 1168 | yes |
| low | mcp2562fd-e-sn-low.glb | 732 | no |
| super-low | mcp2562fd-e-sn-super-low.glb | 468 | no |
All four share the library model's frame and carry no footprint, silkscreen or label artwork. High is the etched GLB; medium and low come from the same generator with each bend drawn as three straight segments (medium keeps the etch); super-low has an undrafted body and one-segment bends. Every level keeps the eight leads and the pin-1 dimple. Status: candidate; the previews were inspected, a streaming LOD viewer has not qualified them.

Symbol chip outline
The symbol body carries the chip outline drawn from the etched model by adom-aiflow-etch outline (gate PASS): artwork/MCP2562FD-E-SN-3d-outline-dark-named.svg. The KiCad symbol, the Fusion library and the Altium SchLib carry the same drawing.

Sourcing
Checked 2026-10-21 with adom-parts-search.
| Distributor | Part number | Stock | Price |
|---|---|---|---|
| Mouser | 579-MCP2562FD-E/SN | 10,466 | 1.29 USD (1), 0.98 USD (100) |
| DigiKey | MCP2562FD-E/SN-ND | 146 | 1.29 USD (1), 0.98 USD (100) |
| LCSC / JLCPCB | C124016 | 1,719 | JLCPCB extended part |
The -E/SN part ships in tubes; order MCP2562FDT-E/SN for tape and reel (p.29).
Manufacturer and resources
| Resource | Link |
|---|---|
| Product page | microchip.com/en-us/product/MCP2562FD |
| Datasheet | DS20005284B, Revision B (March 2026), PDF on this page, microchip.com |
| Package drawings | C04-00057-SN Rev L (outline), C04-02057-SN Rev L (land pattern); current versions at microchip.com/packaging |
Related
- adom/mcp2562fdt-e: an earlier page for the tape-and-reel ordering code, built on KiCad's generic footprint and model.
- adom/mcp2562t-e: the classical-CAN MCP2562.
Provenance
- Datasheet: Microchip DS20005284B (March 2026), 31 pages, sha256
659565909388fcd7, downloaded from microchip.com on 2026-10-21 (docs/mcp2562fd-e-sn-datasheet.pdf). Every pin and spec above cites its page. - Footprint: provenance/footprint-check.json, pad by pad against p.25 and against KiCad's footprint.
- 3D model: provenance/3d-model.json: source attempts, the KiCad comparison with method and numbers, build parameters, etch gate, hashes. The tools are in provenance/tools/; KiCad's reference footprint and model are kept in provenance/kicad-reference/ for the comparison.
- Symbol: created from provenance/tools/symbol-create.json by adom-symbol 1.2.6, then every pin moved onto the 2.54 mm grid by snap_symbol.py (the tool placed the first pin of each column at y = -2.00 mm).
- Licence: Adom-authored files (symbol, footprint, models, etch, artwork, libraries, tools, text) are CC-BY-4.0, see LICENSE. The datasheet is Microchip's and keeps Microchip's terms; the KiCad reference files keep CC-BY-SA 4.0 with the KiCad libraries exception.
Cited datasheet pages:
