STM32F103C8T6 - Arm Cortex-M3 MCU (Blue Pill)

{
  "mpn": "STM32F103C8T6",
  "schema": "adom-node-tooltips@1",
  "source": "ds2sf symbol extract",
  "nodeCount": 99,
  "nodes": {
    "pad_1": {
      "label": "Pin 1 · VBAT (Power in)",
      "type": "power_in",
      "why": "Backup battery supply for RTC and backup registers."
    },
    "solder_1": {
      "label": "Solder joint · pin 1 (VBAT)",
      "why": "Reflowed solder bonding pin 1's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_2": {
      "label": "Pin 2 · PC13-TAMPER-RTC (I/O)",
      "type": "bidirectional",
      "why": "GPIO port C bit 13, muxed with TAMPER input and RTC output."
    },
    "solder_2": {
      "label": "Solder joint · pin 2 (PC13-TAMPER-RTC)",
      "why": "Reflowed solder bonding pin 2's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_3": {
      "label": "Pin 3 · PC14-OSC32_IN (I/O)",
      "type": "bidirectional",
      "why": "GPIO port C bit 14, muxed with 32 kHz LSE oscillator input (OSC32_IN)."
    },
    "solder_3": {
      "label": "Solder joint · pin 3 (PC14-OSC32_IN)",
      "why": "Reflowed solder bonding pin 3's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_4": {
      "label": "Pin 4 · PC15-OSC32_OUT (I/O)",
      "type": "bidirectional",
      "why": "GPIO port C bit 15, muxed with 32 kHz LSE oscillator output (OSC32_OUT)."
    },
    "solder_4": {
      "label": "Solder joint · pin 4 (PC15-OSC32_OUT)",
      "why": "Reflowed solder bonding pin 4's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_5": {
      "label": "Pin 5 · PD0-OSC_IN (I/O)",
      "type": "bidirectional",
      "why": "HSE crystal oscillator input (OSC_IN) after reset; remappable to GPIO PD0 by software."
    },
    "solder_5": {
      "label": "Solder joint · pin 5 (PD0-OSC_IN)",
      "why": "Reflowed solder bonding pin 5's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_6": {
      "label": "Pin 6 · PD1-OSC_OUT (I/O)",
      "type": "bidirectional",
      "why": "HSE crystal oscillator output (OSC_OUT) after reset; remappable to GPIO PD1 by software."
    },
    "solder_6": {
      "label": "Solder joint · pin 6 (PD1-OSC_OUT)",
      "why": "Reflowed solder bonding pin 6's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_7": {
      "label": "Pin 7 · NRST (I/O)",
      "type": "bidirectional",
      "why": "Active-low bidirectional device reset."
    },
    "solder_7": {
      "label": "Solder joint · pin 7 (NRST)",
      "why": "Reflowed solder bonding pin 7's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_8": {
      "label": "Pin 8 · VSSA (Power in)",
      "type": "power_in",
      "why": "Analog ground reference for ADC, reset block, PLL, and analog peripherals."
    },
    "solder_8": {
      "label": "Solder joint · pin 8 (VSSA)",
      "why": "Reflowed solder bonding pin 8's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_9": {
      "label": "Pin 9 · VDDA (Power in)",
      "type": "power_in",
      "why": "Analog supply for ADC, reset block, PLL, and analog I/O."
    },
    "solder_9": {
      "label": "Solder joint · pin 9 (VDDA)",
      "why": "Reflowed solder bonding pin 9's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_10": {
      "label": "Pin 10 · PA0-WKUP (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 0, 5 V-tolerant when configured as digital input."
    },
    "solder_10": {
      "label": "Solder joint · pin 10 (PA0-WKUP)",
      "why": "Reflowed solder bonding pin 10's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_11": {
      "label": "Pin 11 · PA1 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 1."
    },
    "solder_11": {
      "label": "Solder joint · pin 11 (PA1)",
      "why": "Reflowed solder bonding pin 11's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_12": {
      "label": "Pin 12 · PA2 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 2."
    },
    "solder_12": {
      "label": "Solder joint · pin 12 (PA2)",
      "why": "Reflowed solder bonding pin 12's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_13": {
      "label": "Pin 13 · PA3 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 3."
    },
    "solder_13": {
      "label": "Solder joint · pin 13 (PA3)",
      "why": "Reflowed solder bonding pin 13's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_14": {
      "label": "Pin 14 · PA4 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 4."
    },
    "solder_14": {
      "label": "Solder joint · pin 14 (PA4)",
      "why": "Reflowed solder bonding pin 14's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_15": {
      "label": "Pin 15 · PA5 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 5."
    },
    "solder_15": {
      "label": "Solder joint · pin 15 (PA5)",
      "why": "Reflowed solder bonding pin 15's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_16": {
      "label": "Pin 16 · PA6 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 6."
    },
    "solder_16": {
      "label": "Solder joint · pin 16 (PA6)",
      "why": "Reflowed solder bonding pin 16's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_17": {
      "label": "Pin 17 · PA7 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 7."
    },
    "solder_17": {
      "label": "Solder joint · pin 17 (PA7)",
      "why": "Reflowed solder bonding pin 17's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_18": {
      "label": "Pin 18 · PB0 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 0."
    },
    "solder_18": {
      "label": "Solder joint · pin 18 (PB0)",
      "why": "Reflowed solder bonding pin 18's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_19": {
      "label": "Pin 19 · PB1 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 1."
    },
    "solder_19": {
      "label": "Solder joint · pin 19 (PB1)",
      "why": "Reflowed solder bonding pin 19's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_20": {
      "label": "Pin 20 · PB2 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 2, 5 V-tolerant."
    },
    "solder_20": {
      "label": "Solder joint · pin 20 (PB2)",
      "why": "Reflowed solder bonding pin 20's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_21": {
      "label": "Pin 21 · PB10 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 10, 5 V-tolerant."
    },
    "solder_21": {
      "label": "Solder joint · pin 21 (PB10)",
      "why": "Reflowed solder bonding pin 21's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_22": {
      "label": "Pin 22 · PB11 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 11, 5 V-tolerant."
    },
    "solder_22": {
      "label": "Solder joint · pin 22 (PB11)",
      "why": "Reflowed solder bonding pin 22's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_23": {
      "label": "Pin 23 · VSS_1 (Power in)",
      "type": "power_in",
      "why": "Digital ground, group 1."
    },
    "solder_23": {
      "label": "Solder joint · pin 23 (VSS_1)",
      "why": "Reflowed solder bonding pin 23's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_24": {
      "label": "Pin 24 · VDD_1 (Power in)",
      "type": "power_in",
      "why": "Digital supply, group 1."
    },
    "solder_24": {
      "label": "Solder joint · pin 24 (VDD_1)",
      "why": "Reflowed solder bonding pin 24's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_25": {
      "label": "Pin 25 · PB12 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 12, 5 V-tolerant."
    },
    "solder_25": {
      "label": "Solder joint · pin 25 (PB12)",
      "why": "Reflowed solder bonding pin 25's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_26": {
      "label": "Pin 26 · PB13 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 13, 5 V-tolerant."
    },
    "solder_26": {
      "label": "Solder joint · pin 26 (PB13)",
      "why": "Reflowed solder bonding pin 26's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_27": {
      "label": "Pin 27 · PB14 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 14, 5 V-tolerant."
    },
    "solder_27": {
      "label": "Solder joint · pin 27 (PB14)",
      "why": "Reflowed solder bonding pin 27's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_28": {
      "label": "Pin 28 · PB15 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 15, 5 V-tolerant."
    },
    "solder_28": {
      "label": "Solder joint · pin 28 (PB15)",
      "why": "Reflowed solder bonding pin 28's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_29": {
      "label": "Pin 29 · PA8 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 8, 5 V-tolerant."
    },
    "solder_29": {
      "label": "Solder joint · pin 29 (PA8)",
      "why": "Reflowed solder bonding pin 29's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_30": {
      "label": "Pin 30 · PA9 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 9, 5 V-tolerant."
    },
    "solder_30": {
      "label": "Solder joint · pin 30 (PA9)",
      "why": "Reflowed solder bonding pin 30's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_31": {
      "label": "Pin 31 · PA10 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 10, 5 V-tolerant."
    },
    "solder_31": {
      "label": "Solder joint · pin 31 (PA10)",
      "why": "Reflowed solder bonding pin 31's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_32": {
      "label": "Pin 32 · PA11 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 11, 5 V-tolerant."
    },
    "solder_32": {
      "label": "Solder joint · pin 32 (PA11)",
      "why": "Reflowed solder bonding pin 32's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_33": {
      "label": "Pin 33 · PA12 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 12, 5 V-tolerant."
    },
    "solder_33": {
      "label": "Solder joint · pin 33 (PA12)",
      "why": "Reflowed solder bonding pin 33's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_34": {
      "label": "Pin 34 · PA13 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 13, 5 V-tolerant."
    },
    "solder_34": {
      "label": "Solder joint · pin 34 (PA13)",
      "why": "Reflowed solder bonding pin 34's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_35": {
      "label": "Pin 35 · VSS_2 (Power in)",
      "type": "power_in",
      "why": "Digital ground, group 2."
    },
    "solder_35": {
      "label": "Solder joint · pin 35 (VSS_2)",
      "why": "Reflowed solder bonding pin 35's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_36": {
      "label": "Pin 36 · VDD_2 (Power in)",
      "type": "power_in",
      "why": "Digital supply, group 2."
    },
    "solder_36": {
      "label": "Solder joint · pin 36 (VDD_2)",
      "why": "Reflowed solder bonding pin 36's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_37": {
      "label": "Pin 37 · PA14 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 14, 5 V-tolerant."
    },
    "solder_37": {
      "label": "Solder joint · pin 37 (PA14)",
      "why": "Reflowed solder bonding pin 37's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_38": {
      "label": "Pin 38 · PA15 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port A bit 15, 5 V-tolerant."
    },
    "solder_38": {
      "label": "Solder joint · pin 38 (PA15)",
      "why": "Reflowed solder bonding pin 38's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_39": {
      "label": "Pin 39 · PB3 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 3, 5 V-tolerant."
    },
    "solder_39": {
      "label": "Solder joint · pin 39 (PB3)",
      "why": "Reflowed solder bonding pin 39's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_40": {
      "label": "Pin 40 · PB4 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 4, 5 V-tolerant."
    },
    "solder_40": {
      "label": "Solder joint · pin 40 (PB4)",
      "why": "Reflowed solder bonding pin 40's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_41": {
      "label": "Pin 41 · PB5 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 5 (NOT 5 V-tolerant on this pin)."
    },
    "solder_41": {
      "label": "Solder joint · pin 41 (PB5)",
      "why": "Reflowed solder bonding pin 41's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_42": {
      "label": "Pin 42 · PB6 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 6, 5 V-tolerant."
    },
    "solder_42": {
      "label": "Solder joint · pin 42 (PB6)",
      "why": "Reflowed solder bonding pin 42's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_43": {
      "label": "Pin 43 · PB7 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 7, 5 V-tolerant."
    },
    "solder_43": {
      "label": "Solder joint · pin 43 (PB7)",
      "why": "Reflowed solder bonding pin 43's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_44": {
      "label": "Pin 44 · BOOT0 (Input)",
      "type": "input",
      "why": "Boot mode selection input sampled at reset (with BOOT1/PB2): selects boot from Flash, System memory (bootloader), or embedded SRAM."
    },
    "solder_44": {
      "label": "Solder joint · pin 44 (BOOT0)",
      "why": "Reflowed solder bonding pin 44's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_45": {
      "label": "Pin 45 · PB8 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 8, 5 V-tolerant."
    },
    "solder_45": {
      "label": "Solder joint · pin 45 (PB8)",
      "why": "Reflowed solder bonding pin 45's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_46": {
      "label": "Pin 46 · PB9 (I/O)",
      "type": "bidirectional",
      "why": "GPIO port B bit 9, 5 V-tolerant."
    },
    "solder_46": {
      "label": "Solder joint · pin 46 (PB9)",
      "why": "Reflowed solder bonding pin 46's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_47": {
      "label": "Pin 47 · VSS_3 (Power in)",
      "type": "power_in",
      "why": "Digital ground, group 3."
    },
    "solder_47": {
      "label": "Solder joint · pin 47 (VSS_3)",
      "why": "Reflowed solder bonding pin 47's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "pad_48": {
      "label": "Pin 48 · VDD_3 (Power in)",
      "type": "power_in",
      "why": "Digital supply, group 3."
    },
    "solder_48": {
      "label": "Solder joint · pin 48 (VDD_3)",
      "why": "Reflowed solder bonding pin 48's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."
    },
    "chip": {
      "label": "STM32F103C8T6 · LQFP-48",
      "why": "The LQFP-48 body. Leads on 48 pins carry every signal and supply to the die inside."
    },
    "fr4": {
      "label": "PCB substrate (FR4)",
      "why": "The board the part mounts to — copper pads sit on this FR4 laminate."
    },
    "silk_pin1": {
      "label": "Pin-1 marker",
      "why": "Silkscreen dot marking pin 1, so the part is placed in the correct orientation."
    }
  }
}