STM32F103C8T6 - Arm Cortex-M3 MCU (Blue Pill)

@@ -16,6 +16,14 @@ body{background:var(--bg);color:var(--ink);font-family:'Satoshi',system-ui,sans- .stage{flex:1;min-height:0;position:relative;overflow:hidden;background:var(--bg)} .stage canvas{width:100%;height:100%;display:block;outline:none;touch-action:none} .ph{position:absolute;inset:0;display:flex;align-items:center;justify-content:center;color:var(--mut);font-size:12px}+.timeline{display:flex;align-items:center;gap:9px;padding:7px 11px;border-top:1px solid var(--edge);flex:none;background:var(--bg)}+.tl-play{width:26px;height:26px;flex:none;border-radius:50%;border:1px solid var(--acc);background:rgba(0,184,176,.12);color:var(--acc);cursor:pointer;font-size:10px;line-height:1;display:flex;align-items:center;justify-content:center}+.tl-play:hover{background:rgba(0,184,176,.2)}+.tl-track{position:relative;flex:1;display:flex;height:24px;border-radius:6px;overflow:hidden;background:#0d1117;border:1px solid var(--edge);cursor:pointer;touch-action:none}+.tl-seg{display:flex;align-items:center;justify-content:center;border-right:1px solid var(--edge);font-size:9.5px;color:var(--mut);text-transform:uppercase;letter-spacing:.05em;user-select:none;min-width:0}+.tl-seg:last-child{border-right:0}+.tl-seg.on{color:var(--ink);background:rgba(0,184,176,.12)}+.tl-head{position:absolute;top:0;bottom:0;left:0;width:2px;background:var(--acc);box-shadow:0 0 8px var(--acc);pointer-events:none} </style></head><body> <div class=bar><span class=h>3D model</span><span class=sp></span>   <button class="lyrtog on" data-mesh="solder"><span class=d style="background:#c9ccd1"></span>Solder</button>@@ -25,6 +33,15 @@ body{background:var(--bg);color:var(--ink);font-family:'Satoshi',system-ui,sans-   <button class="act plain" id=reset>Reset</button> </div> <div class=stage id=stage><div class=ph id=ph>loading 3D&hellip;</div></div>+<div class=timeline id=timeline hidden>+  <button class="tl-play" id=tl-play 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`}return this.children.forEach(u=>{i+=u.process(e,t)}),this.additionalDefineKey&&(e[this.additionalDefineKey]=this.additionalDefineValue||"true"),i}}class LPe{constructor(){this._lines=[]}get currentLine(){return this._lines[this.lineIndex]}get canRead(){return this.lineIndex<this._lines.length-1}set lines(e){this._lines.length=0;for(const t of e){if(!t||t==="\r")continue;if(t[0]==="#"){this._lines.push(t);continue}const i=t.trim();if(!i)continue;if(i.startsWith("//")){this._lines.push(t);continue}const s=i.indexOf(";");if(s===-1)this._lines.push(i);else if(s===i.length-1)i.length>1&&this._lines.push(i);else{const r=t.split(";");for(let n=0;n<r.length;n++){let o=r[n];o&&(o=o.trim(),o&&this._lines.push(o+(n!==r.length-1?";":"")))}}}}}class nX extends uw{process(e,t){for(let i=0;i<this.children.length;i++){const s=this.children[i];if(s.isValid(e))return s.process(e,t)}return""}}class IPe extends uw{isValid(e){return this.testExpression.isTrue(e)}}class Zo{isTrue(e){return!0}static postfixToInfix(e){const t=[];for(const i of e)if(Zo._OperatorPriority[i]===void 0)t.push(i);else{const s=t[t.length-1],r=t[t.length-2];t.length-=2,t.push(`(${r}${i}${s})`)}return t[t.length-1]}static infixToPostfix(e){const t=Zo._InfixToPostfixCache.get(e);if(t)return t.accessTime=Date.now(),t.result;if(!e.includes("&&")&&!e.includes("||")&&!e.includes(")")&&!e.includes("("))return[e];const i=[];let s=-1;const r=()=>{u=u.trim(),u!==""&&(i.push(u),u="")},n=f=>{s<Zo._Stack.length-1&&(Zo._Stack[++s]=f)},o=()=>Zo._Stack[s],l=()=>s===-1?"!!INVALID EXPRESSION!!":Zo._Stack[s--];let c=0,u="";for(;c<e.length;){const f=e.charAt(c),p=c<e.length-1?e.substring(c,2+c):"";if(f==="(")u="",n(f);else if(f===")"){for(r();s!==-1&&o()!=="(";)i.push(l());l()}else if(Zo._OperatorPriority[p]>1){for(r();s!==-1&&Zo._OperatorPriority[o()]>=Zo._OperatorPriority[p];)i.push(l());n(p),c++}else u+=f;c++}for(r();s!==-1;)o()==="("?l():i.push(l());return Zo._InfixToPostfixCache.size>=Zo.InfixToPostfixCacheLimitSize&&Zo.ClearCache(),Zo._InfixToPostfixCache.set(e,{result:i,accessTime:Date.now()}),i}static ClearCache(){const e=Array.from(Zo._InfixToPostfixCache.entries()).sort((t,i)=>t[1].accessTime-i[1].accessTime);for(let t=0;t<Zo.InfixToPostfixCacheCleanupSize;t++)Zo._InfixToPostfixCache.delete(e[t][0])}}Zo.InfixToPostfixCacheLimitSize=5e4,Zo.InfixToPostfixCacheCleanupSize=25e3,Zo._InfixToPostfixCache=new Map,Zo._OperatorPriority={")":0,"(":1,"||":2,"&&":3},Zo._Stack=["","","","","","","","","","","","","","","","","","","",""];class HV extends Zo{constructor(e,t=!1){super(),this.define=e,this.not=t}isTrue(e){let t=e[this.define]!==void 0;return this.not&&(t=!t),t}}class PPe extends Zo{isTrue(e){return this.leftOperand.isTrue(e)||this.rightOperand.isTrue(e)}}class OPe extends Zo{isTrue(e){return this.leftOperand.isTrue(e)&&this.rightOperand.isTrue(e)}}class RPe extends Zo{constructor(e,t,i){super(),this.define=e,this.operand=t,this.testValue=i}isTrue(e){let t=e[this.define];t===void 0&&(t=this.define);let i=!1;const s=parseInt(t),r=parseInt(this.testValue);switch(this.operand){case">":i=s>r;break;case"<":i=s<r;break;case"<=":i=s<=r;break;case">=":i=s>=r;break;case"==":i=s===r;break;case"!=":i=s!==r;break}return i}}const YV={};function Due(a,e,t=""){return t+(e?e+` `:"")+a}function Nue(a,e,t,i,s,r,n){const o=n||YV.loadFile;if(o)return o(a,e,t,i,s,r);throw as("FileTools")}function wue(a,e,t,i){if(a){e?a.IS_NDC_HALF_ZRANGE="":delete a.IS_NDC_HALF_ZRANGE,t?a.USE_REVERSE_DEPTHBUFFER="":delete a.USE_REVERSE_DEPTHBUFFER,i?a.USE_EXACT_SRGB_CONVERSIONS="":delete a.USE_EXACT_SRGB_CONVERSIONS;return}else{let s="";return e&&(s+="#define IS_NDC_HALF_ZRANGE"),t&&(s&&(s+=`@@ -41571,17 +41588,18 @@ function onReady(s){       byName(s,re).forEach(function(m){ m.setEnabled(on); });     });   });-  var pb=document.getElementById('play'); if(pb) pb.addEventListener('click',function(){ playLifecycle(s); });+  initLifecycle(s); wireTimeline();+  var pb=document.getElementById('play'); if(pb) pb.addEventListener('click',lcToggle);   var rb=document.getElementById('reset'); if(rb) rb.addEventListener('click',function(){ try{v.goHome&&v.goHome();}catch(_){} });-  if((location.hash||'').indexOf('play')>=0) setTimeout(function(){playLifecycle(s);},500);+  if((location.hash||'').indexOf('play')>=0) setTimeout(function(){lcPlay();},500);   if((location.hash||'').indexOf('low')>=0){ try{var c=v.getCamera(); if(c){c.beta=1.46; c.radius=c.radius*0.32;}}catch(_){} }   if((location.hash||'').indexOf('demo')>=0){     try{var c=v.getCamera(); if(c){c.beta=1.05; c.radius=c.radius*1.12;}}catch(_){}-    var reps=6,i=0; (function loop(){ if(i++>=reps)return; playLifecycle(s); setTimeout(loop,9800); })();+    var reps=6,i=0; (function loop(){ if(i++>=reps)return; lcPlay(); setTimeout(loop,9800); })();   }   if((location.hash||'').indexOf('vid')>=0){   // single play from a nice angle, delayed so recording can start first     try{var c=v.getCamera(); if(c){c.beta=1.08; c.radius=c.radius*0.9;}}catch(_){}-    setTimeout(function(){ playLifecycle(s); }, 3800);+    setTimeout(function(){ lcPlay(); }, 3800);   } } @@ -41617,29 +41635,59 @@ var animing=false; function setEmis(mm,r,g,b){mm.forEach(function(m){try{if(m.material&&m.material.emissiveColor&&B.Color3)m.material.emissiveColor=new B.Color3(r,g,b);}catch(_){}});} function tween(dur,upd,done){var t0=performance.now();(function st(now){var t=Math.min(1,(now-t0)/dur);upd(t);if(t<1)requestAnimationFrame(st);else if(done)done();})(t0);} function easeIO(t){return t<0.5?4*t*t*t:1-Math.pow(-2*t+2,3)/2;}-function playLifecycle(s){-  if(animing||!B.Vector3)return; animing=true;-  var pb=document.getElementById('play'); if(pb)pb.disabled=true;-  var chip=byName(s,RE.chip), sol=byName(s,RE.solder), solBtn=document.querySelector('.lyrtog[data-mesh="solder"]');+// ---- lifecycle as a scrubbable TIMELINE (the "mini movie": place -> reflow -> power-on) ----+// John's ask: 10 datasheet pages compressed into one 3D viewer with a timeline the+// user enjoys watching. applyLifecycle(t) maps global t in [0,1] to chip position ++// solder + emissive across three "chapters", so it can be played OR scrubbed.+var _lc = null;   // { chip, sol, lift, solBtn } captured once the model is ready+function initLifecycle(s){+  var chip=byName(s,RE.chip), sol=byName(s,RE.solder);+  if(!chip.length){ return; }   var cb=boundsOf(chip); var lift=cb?Math.max(cb.hi.x-cb.lo.x, cb.hi.y-cb.lo.y)*0.55:0.004;   chip.forEach(function(m){ if(!m.__oz){m.computeWorldMatrix(true); m.__op=m.getAbsolutePosition().clone(); m.__oz=1;} });-  function place(f){ chip.forEach(function(m){ try{m.setAbsolutePosition(new B.Vector3(m.__op.x, m.__op.y, m.__op.z+lift*f));}catch(_){} }); }-  function solOn(on){ sol.forEach(function(m){m.setEnabled(on);}); if(solBtn)solBtn.classList.toggle('on',on); }-  function fin(){ place(0); setEmis(chip,0,0,0); setEmis(sol,0,0,0); animing=false; if(pb)pb.disabled=false; }-  place(0); solOn(true);-  tween(1000, function(t){ place(easeIO(t)); }, function(){                 // 1) lift the chip up-    setTimeout(function(){ solOn(false);                                     // 2) solder off-      setTimeout(function(){ solOn(true);                                    //    solder back on-        setTimeout(function(){-          tween(1400, function(t){ place(1-easeIO(t)); }, function(){        // 3) lower onto the solder-            tween(1600, function(t){ var g=Math.sin(t*Math.PI); setEmis(sol,0.95*g,0.30*g,0); setEmis(chip,0.26*g,0.08*g,0); }, function(){ setEmis(sol,0,0,0); setEmis(chip,0,0,0);  // 4) slow reflow glow-              tween(1700, function(t){ var p=Math.sin(t*Math.PI); setEmis(chip,0,0.5*p,0.48*p); }, fin);   // 5) slow power-on pulse-            });-          });-        }, 700);-      }, 800);-    }, 700);-  });+  _lc={chip:chip, sol:sol, lift:lift, solBtn:document.querySelector('.lyrtog[data-mesh="solder"]')};+  var tl=document.getElementById('timeline'); if(tl)tl.hidden=false;+  applyLifecycle(0);+}+function _place(f){ if(!_lc)return; _lc.chip.forEach(function(m){ try{m.setAbsolutePosition(new B.Vector3(m.__op.x, m.__op.y, m.__op.z+_lc.lift*f));}catch(_){} }); }+function _solOn(on){ if(!_lc)return; _lc.sol.forEach(function(m){m.setEnabled(on);}); if(_lc.solBtn)_lc.solBtn.classList.toggle('on',on); }+function applyLifecycle(t){+  if(!_lc||!B.Vector3)return; t=Math.max(0,Math.min(1,t));+  if(t<0.34){ var u=t/0.34; _place(1-easeIO(u)); _solOn(true); setEmis(_lc.chip,0,0,0); setEmis(_lc.sol,0,0,0); }         // Place: descend onto the pads+  else if(t<0.68){ var u=(t-0.34)/0.34; _place(0); _solOn(true); var g=Math.sin(u*Math.PI); setEmis(_lc.sol,0.95*g,0.30*g,0); setEmis(_lc.chip,0.26*g,0.08*g,0); } // Reflow: solder glows+  else { var u=(t-0.68)/0.32; _place(0); _solOn(true); setEmis(_lc.sol,0,0,0); var p=Math.min(1,u*1.6); setEmis(_lc.chip,0,0.42*p,0.40*p); }                       // Power-on: steady glow, held+  _tlPaint(t);+}+// player + scrubber+var LC_DUR=5200, _lcT=0, _lcPlaying=false, _lcRAF=0, _lcLast=0;+function _lcStop(){ _lcPlaying=false; if(_lcRAF)cancelAnimationFrame(_lcRAF); _lcRAF=0; _tlBtn(); }+function lcPlay(){+  if(!_lc)return;+  if(_lcT>=1)_lcT=0;+  _lcPlaying=true; _lcLast=performance.now(); _tlBtn();+  (function step(now){+    if(!_lcPlaying)return;+    _lcT+=(now-_lcLast)/LC_DUR; _lcLast=now;+    if(_lcT>=1){ _lcT=1; applyLifecycle(1); _lcStop(); return; }+    applyLifecycle(_lcT); _lcRAF=requestAnimationFrame(step);+  })(performance.now());+}+function lcToggle(){ if(_lcPlaying)_lcStop(); else lcPlay(); }+function lcSeek(t){ _lcStop(); _lcT=Math.max(0,Math.min(1,t)); applyLifecycle(_lcT); }+function _tlPaint(t){+  var head=document.getElementById('tl-head'); if(head)head.style.left=(t*100)+'%';+  var idx=t<0.34?0:(t<0.68?1:2);+  [].slice.call(document.querySelectorAll('.tl-seg')).forEach(function(el,i){ el.classList.toggle('on', i===idx); });+}+function _tlBtn(){ var b=document.getElementById('tl-play'); if(b)b.innerHTML=_lcPlaying?'&#10073;&#10073;':'&#9654;'; }+function wireTimeline(){+  var tlp=document.getElementById('tl-play'); if(tlp)tlp.addEventListener('click',lcToggle);+  var trk=document.getElementById('tl-track'); if(!trk)return;+  var scrubbing=false;+  function seek(e){ var r=trk.getBoundingClientRect(); lcSeek((e.clientX-r.left)/r.width); }+  trk.addEventListener('pointerdown',function(e){ scrubbing=true; try{trk.setPointerCapture(e.pointerId);}catch(_){} seek(e); });+  trk.addEventListener('pointermove',function(e){ if(scrubbing)seek(e); });+  function end(){ scrubbing=false; } trk.addEventListener('pointerup',end); trk.addEventListener('pointerleave',end); }  // ---- cross-highlight bus: 3D receives pin hovers and lights the matching lead ----

@@ -0,0 +1,452 @@+{+  "mpn": "STM32F103C8T6",+  "schema": "adom-node-tooltips@1",+  "source": "ds2sf symbol extract",+  "nodeCount": 99,+  "nodes": {+    "pad_1": {+      "label": "Pin 1 · VBAT (Power in)",+      "type": "power_in",+      "why": "Backup battery supply for RTC and backup registers."+    },+    "solder_1": {+      "label": "Solder joint · pin 1 (VBAT)",+      "why": "Reflowed solder bonding pin 1's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_2": {+      "label": "Pin 2 · PC13-TAMPER-RTC (I/O)",+      "type": "bidirectional",+      "why": "GPIO port C bit 13, muxed with TAMPER input and RTC output."+    },+    "solder_2": {+      "label": "Solder joint · pin 2 (PC13-TAMPER-RTC)",+      "why": "Reflowed solder bonding pin 2's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_3": {+      "label": "Pin 3 · PC14-OSC32_IN (I/O)",+      "type": "bidirectional",+      "why": "GPIO port C bit 14, muxed with 32 kHz LSE oscillator input (OSC32_IN)."+    },+    "solder_3": {+      "label": "Solder joint · pin 3 (PC14-OSC32_IN)",+      "why": "Reflowed solder bonding pin 3's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_4": {+      "label": "Pin 4 · PC15-OSC32_OUT (I/O)",+      "type": "bidirectional",+      "why": "GPIO port C bit 15, muxed with 32 kHz LSE oscillator output (OSC32_OUT)."+    },+    "solder_4": {+      "label": "Solder joint · pin 4 (PC15-OSC32_OUT)",+      "why": "Reflowed solder bonding pin 4's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_5": {+      "label": "Pin 5 · PD0-OSC_IN (I/O)",+      "type": "bidirectional",+      "why": "HSE crystal oscillator input (OSC_IN) after reset; remappable to GPIO PD0 by software."+    },+    "solder_5": {+      "label": "Solder joint · pin 5 (PD0-OSC_IN)",+      "why": "Reflowed solder bonding pin 5's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_6": {+      "label": "Pin 6 · PD1-OSC_OUT (I/O)",+      "type": "bidirectional",+      "why": "HSE crystal oscillator output (OSC_OUT) after reset; remappable to GPIO PD1 by software."+    },+    "solder_6": {+      "label": "Solder joint · pin 6 (PD1-OSC_OUT)",+      "why": "Reflowed solder bonding pin 6's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_7": {+      "label": "Pin 7 · NRST (I/O)",+      "type": "bidirectional",+      "why": "Active-low bidirectional device reset."+    },+    "solder_7": {+      "label": "Solder joint · pin 7 (NRST)",+      "why": "Reflowed solder bonding pin 7's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_8": {+      "label": "Pin 8 · VSSA (Power in)",+      "type": "power_in",+      "why": "Analog ground reference for ADC, reset block, PLL, and analog peripherals."+    },+    "solder_8": {+      "label": "Solder joint · pin 8 (VSSA)",+      "why": "Reflowed solder bonding pin 8's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_9": {+      "label": "Pin 9 · VDDA (Power in)",+      "type": "power_in",+      "why": "Analog supply for ADC, reset block, PLL, and analog I/O."+    },+    "solder_9": {+      "label": "Solder joint · pin 9 (VDDA)",+      "why": "Reflowed solder bonding pin 9's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_10": {+      "label": "Pin 10 · PA0-WKUP (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 0, 5 V-tolerant when configured as digital input."+    },+    "solder_10": {+      "label": "Solder joint · pin 10 (PA0-WKUP)",+      "why": "Reflowed solder bonding pin 10's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_11": {+      "label": "Pin 11 · PA1 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 1."+    },+    "solder_11": {+      "label": "Solder joint · pin 11 (PA1)",+      "why": "Reflowed solder bonding pin 11's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_12": {+      "label": "Pin 12 · PA2 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 2."+    },+    "solder_12": {+      "label": "Solder joint · pin 12 (PA2)",+      "why": "Reflowed solder bonding pin 12's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_13": {+      "label": "Pin 13 · PA3 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 3."+    },+    "solder_13": {+      "label": "Solder joint · pin 13 (PA3)",+      "why": "Reflowed solder bonding pin 13's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_14": {+      "label": "Pin 14 · PA4 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 4."+    },+    "solder_14": {+      "label": "Solder joint · pin 14 (PA4)",+      "why": "Reflowed solder bonding pin 14's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_15": {+      "label": "Pin 15 · PA5 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 5."+    },+    "solder_15": {+      "label": "Solder joint · pin 15 (PA5)",+      "why": "Reflowed solder bonding pin 15's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_16": {+      "label": "Pin 16 · PA6 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 6."+    },+    "solder_16": {+      "label": "Solder joint · pin 16 (PA6)",+      "why": "Reflowed solder bonding pin 16's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_17": {+      "label": "Pin 17 · PA7 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 7."+    },+    "solder_17": {+      "label": "Solder joint · pin 17 (PA7)",+      "why": "Reflowed solder bonding pin 17's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_18": {+      "label": "Pin 18 · PB0 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 0."+    },+    "solder_18": {+      "label": "Solder joint · pin 18 (PB0)",+      "why": "Reflowed solder bonding pin 18's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_19": {+      "label": "Pin 19 · PB1 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 1."+    },+    "solder_19": {+      "label": "Solder joint · pin 19 (PB1)",+      "why": "Reflowed solder bonding pin 19's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_20": {+      "label": "Pin 20 · PB2 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 2, 5 V-tolerant."+    },+    "solder_20": {+      "label": "Solder joint · pin 20 (PB2)",+      "why": "Reflowed solder bonding pin 20's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_21": {+      "label": "Pin 21 · PB10 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 10, 5 V-tolerant."+    },+    "solder_21": {+      "label": "Solder joint · pin 21 (PB10)",+      "why": "Reflowed solder bonding pin 21's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_22": {+      "label": "Pin 22 · PB11 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 11, 5 V-tolerant."+    },+    "solder_22": {+      "label": "Solder joint · pin 22 (PB11)",+      "why": "Reflowed solder bonding pin 22's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_23": {+      "label": "Pin 23 · VSS_1 (Power in)",+      "type": "power_in",+      "why": "Digital ground, group 1."+    },+    "solder_23": {+      "label": "Solder joint · pin 23 (VSS_1)",+      "why": "Reflowed solder bonding pin 23's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_24": {+      "label": "Pin 24 · VDD_1 (Power in)",+      "type": "power_in",+      "why": "Digital supply, group 1."+    },+    "solder_24": {+      "label": "Solder joint · pin 24 (VDD_1)",+      "why": "Reflowed solder bonding pin 24's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_25": {+      "label": "Pin 25 · PB12 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 12, 5 V-tolerant."+    },+    "solder_25": {+      "label": "Solder joint · pin 25 (PB12)",+      "why": "Reflowed solder bonding pin 25's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_26": {+      "label": "Pin 26 · PB13 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 13, 5 V-tolerant."+    },+    "solder_26": {+      "label": "Solder joint · pin 26 (PB13)",+      "why": "Reflowed solder bonding pin 26's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_27": {+      "label": "Pin 27 · PB14 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 14, 5 V-tolerant."+    },+    "solder_27": {+      "label": "Solder joint · pin 27 (PB14)",+      "why": "Reflowed solder bonding pin 27's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_28": {+      "label": "Pin 28 · PB15 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 15, 5 V-tolerant."+    },+    "solder_28": {+      "label": "Solder joint · pin 28 (PB15)",+      "why": "Reflowed solder bonding pin 28's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_29": {+      "label": "Pin 29 · PA8 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 8, 5 V-tolerant."+    },+    "solder_29": {+      "label": "Solder joint · pin 29 (PA8)",+      "why": "Reflowed solder bonding pin 29's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_30": {+      "label": "Pin 30 · PA9 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 9, 5 V-tolerant."+    },+    "solder_30": {+      "label": "Solder joint · pin 30 (PA9)",+      "why": "Reflowed solder bonding pin 30's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_31": {+      "label": "Pin 31 · PA10 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 10, 5 V-tolerant."+    },+    "solder_31": {+      "label": "Solder joint · pin 31 (PA10)",+      "why": "Reflowed solder bonding pin 31's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_32": {+      "label": "Pin 32 · PA11 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 11, 5 V-tolerant."+    },+    "solder_32": {+      "label": "Solder joint · pin 32 (PA11)",+      "why": "Reflowed solder bonding pin 32's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_33": {+      "label": "Pin 33 · PA12 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 12, 5 V-tolerant."+    },+    "solder_33": {+      "label": "Solder joint · pin 33 (PA12)",+      "why": "Reflowed solder bonding pin 33's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_34": {+      "label": "Pin 34 · PA13 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 13, 5 V-tolerant."+    },+    "solder_34": {+      "label": "Solder joint · pin 34 (PA13)",+      "why": "Reflowed solder bonding pin 34's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_35": {+      "label": "Pin 35 · VSS_2 (Power in)",+      "type": "power_in",+      "why": "Digital ground, group 2."+    },+    "solder_35": {+      "label": "Solder joint · pin 35 (VSS_2)",+      "why": "Reflowed solder bonding pin 35's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_36": {+      "label": "Pin 36 · VDD_2 (Power in)",+      "type": "power_in",+      "why": "Digital supply, group 2."+    },+    "solder_36": {+      "label": "Solder joint · pin 36 (VDD_2)",+      "why": "Reflowed solder bonding pin 36's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_37": {+      "label": "Pin 37 · PA14 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 14, 5 V-tolerant."+    },+    "solder_37": {+      "label": "Solder joint · pin 37 (PA14)",+      "why": "Reflowed solder bonding pin 37's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_38": {+      "label": "Pin 38 · PA15 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port A bit 15, 5 V-tolerant."+    },+    "solder_38": {+      "label": "Solder joint · pin 38 (PA15)",+      "why": "Reflowed solder bonding pin 38's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_39": {+      "label": "Pin 39 · PB3 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 3, 5 V-tolerant."+    },+    "solder_39": {+      "label": "Solder joint · pin 39 (PB3)",+      "why": "Reflowed solder bonding pin 39's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_40": {+      "label": "Pin 40 · PB4 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 4, 5 V-tolerant."+    },+    "solder_40": {+      "label": "Solder joint · pin 40 (PB4)",+      "why": "Reflowed solder bonding pin 40's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_41": {+      "label": "Pin 41 · PB5 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 5 (NOT 5 V-tolerant on this pin)."+    },+    "solder_41": {+      "label": "Solder joint · pin 41 (PB5)",+      "why": "Reflowed solder bonding pin 41's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_42": {+      "label": "Pin 42 · PB6 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 6, 5 V-tolerant."+    },+    "solder_42": {+      "label": "Solder joint · pin 42 (PB6)",+      "why": "Reflowed solder bonding pin 42's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_43": {+      "label": "Pin 43 · PB7 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 7, 5 V-tolerant."+    },+    "solder_43": {+      "label": "Solder joint · pin 43 (PB7)",+      "why": "Reflowed solder bonding pin 43's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_44": {+      "label": "Pin 44 · BOOT0 (Input)",+      "type": "input",+      "why": "Boot mode selection input sampled at reset (with BOOT1/PB2): selects boot from Flash, System memory (bootloader), or embedded SRAM."+    },+    "solder_44": {+      "label": "Solder joint · pin 44 (BOOT0)",+      "why": "Reflowed solder bonding pin 44's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_45": {+      "label": "Pin 45 · PB8 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 8, 5 V-tolerant."+    },+    "solder_45": {+      "label": "Solder joint · pin 45 (PB8)",+      "why": "Reflowed solder bonding pin 45's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_46": {+      "label": "Pin 46 · PB9 (I/O)",+      "type": "bidirectional",+      "why": "GPIO port B bit 9, 5 V-tolerant."+    },+    "solder_46": {+      "label": "Solder joint · pin 46 (PB9)",+      "why": "Reflowed solder bonding pin 46's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_47": {+      "label": "Pin 47 · VSS_3 (Power in)",+      "type": "power_in",+      "why": "Digital ground, group 3."+    },+    "solder_47": {+      "label": "Solder joint · pin 47 (VSS_3)",+      "why": "Reflowed solder bonding pin 47's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "pad_48": {+      "label": "Pin 48 · VDD_3 (Power in)",+      "type": "power_in",+      "why": "Digital supply, group 3."+    },+    "solder_48": {+      "label": "Solder joint · pin 48 (VDD_3)",+      "why": "Reflowed solder bonding pin 48's lead to its pad. Formed when the board passes through reflow; the joint you inspect for shorts/opens."+    },+    "chip": {+      "label": "STM32F103C8T6 · LQFP-48",+      "why": "The LQFP-48 body. Leads on 48 pins carry every signal and supply to the die inside."+    },+    "fr4": {+      "label": "PCB substrate (FR4)",+      "why": "The board the part mounts to — copper pads sit on this FR4 laminate."+    },+    "silk_pin1": {+      "label": "Pin-1 marker",+      "why": "Silkscreen dot marking pin 1, so the part is placed in the correct orientation."+    }+  }+}\ No newline at end of file