rt7257bhzsp: specified limits as data (metadata.characteristics, 22 rows from the datasheet)
rt7257bhzsp: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
rt7257bhzsp: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
rt7257bhzsp: laser-etched CAD + chip hero (factory 2.0.0 backfill)
rt7257bhzsp: backfill missing artifacts (variants)
rt7257bhzsp: publish the laser-etched STEP alongside the bare one
fix ordering variants: suffix was duplicated into the MPN
symbol: bind pad 4, 9 (GND), which had no pin. The footprint carries the pad and page.json described it as "4,9", but n…
orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <te…
pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left)
fix footprint: SOIC-8_3.9x4.9mm_P1.27mm -> SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm (ep_dropped, 8 pins)
rt7257bhzsp: factory component page (tier=mfr)
Initial commit: component/rt7257bhzsp