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orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <technology> (LCSC_PN C27998). The published library carried no attributes at all, so a BOM had nothing to buy from. Distributor PNs matched on exact MPN AND corroborating manufacturer.

Ray ·976db0ae15 · ·parent 3599b21
2 files changed +30−10
page.json+10−8
@@ -26,37 +26,39 @@       "model_3d_step": "rt7257bhzsp.step",       "lbr": "rt7257bhzsp.lbr"     },-    "distributor_links": {},+    "distributor_links": {+      "lcsc": "C27998"+    },     "pins": [       {         "number": "1",         "name": "BOOT",         "type": "power_in",-        "description": "Bootstrap for high-side gate driver. Connect a 0.1μF or greater ceramic capacitor from BOOT to SW. V(BOOT)-V(SW) absolute max 6V."+        "description": "Bootstrap for high-side gate driver. Connect a 0.1\u03bcF or greater ceramic capacitor from BOOT to SW. V(BOOT)-V(SW) absolute max 6V."       },       {         "number": "2",         "name": "VIN",         "type": "power_in",-        "description": "Input supply voltage, 4.5V to 18V (abs max 20V). Must be bypassed with a suitable large ceramic capacitor (e.g. 10μF x2 + 0.1μF)."+        "description": "Input supply voltage, 4.5V to 18V (abs max 20V). Must be bypassed with a suitable large ceramic capacitor (e.g. 10\u03bcF x2 + 0.1\u03bcF)."       },       {         "number": "3",         "name": "SW",         "type": "power_out",-        "description": "Switch node. Connect to an external L-C output filter. Swings between GND and VIN at up to 1.2MHz. High-side RDS(on) 110mΩ, low-side 90mΩ."+        "description": "Switch node. Connect to an external L-C output filter. Swings between GND and VIN at up to 1.2MHz. High-side RDS(on) 110m\u03a9, low-side 90m\u03a9."       },       {         "number": "4,9",         "name": "GND",         "type": "power_in",-        "description": "Ground. Pin 4 and the exposed pad (pin 9) must both be soldered to a large PCB copper area connected to GND for maximum power dissipation (θJA 75°C/W with exposed pad)."+        "description": "Ground. Pin 4 and the exposed pad (pin 9) must both be soldered to a large PCB copper area connected to GND for maximum power dissipation (\u03b8JA 75\u00b0C/W with exposed pad)."       },       {         "number": "5",         "name": "FB",         "type": "input",-        "description": "Feedback input. Regulates the output via an external resistive voltage divider. Internal reference VREF = 0.8V (±1.5%)."+        "description": "Feedback input. Regulates the output via an external resistive voltage divider. Internal reference VREF = 0.8V (\u00b11.5%)."       },       {         "number": "6",@@ -68,13 +70,13 @@         "number": "7",         "name": "EN",         "type": "input",-        "description": "Enable input. Logic high (VIH ≥ 2.7V) enables the converter; logic low (VIL ≤ 0.4V) puts the device into shutdown (<3μA supply). Tie to VIN via a 100kΩ pull-up for automatic startup. Absolute max 20V."+        "description": "Enable input. Logic high (VIH \u2265 2.7V) enables the converter; logic low (VIL \u2264 0.4V) puts the device into shutdown (<3\u03bcA supply). Tie to VIN via a 100k\u03a9 pull-up for automatic startup. Absolute max 20V."       },       {         "number": "8",         "name": "SS",         "type": "input",-        "description": "Soft-start control input. Connect a capacitor from SS to GND to set the soft-start period; a 0.1μF cap gives ~13.5ms (ISS = 6μA typ)."+        "description": "Soft-start control input. Connect a capacitor from SS to GND to set the soft-start period; a 0.1\u03bcF cap gives ~13.5ms (ISS = 6\u03bcA typ)."       }     ],     "provenance": {
rt7257bhzsp.lbr+20−2
@@ -63,6 +63,18 @@   <smd name="7" x="2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1"/>   <smd name="8" x="2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1"/>   <smd name="9" x="0.0000" y="-0.0000" dx="2.2900" dy="3.0000" layer="1"/>+  <polygon width="0.1200" layer="21">+    <vertex x="-2.6000" y="2.4700"/>+    <vertex x="-2.8400" y="2.8000"/>+    <vertex x="-2.3600" y="2.8000"/>+  </polygon>+  <polygon width="0.1000" layer="51">+    <vertex x="-0.9750" y="2.4500"/>+    <vertex x="1.9500" y="2.4500"/>+    <vertex x="1.9500" y="-2.4500"/>+    <vertex x="-1.9500" y="-2.4500"/>+    <vertex x="-1.9500" y="1.4750"/>+  </polygon>   <wire x1="-2.0600" y1="2.5600" x2="2.0600" y2="2.5600" width="0.1200" layer="21"/>   <wire x1="-2.0600" y1="2.4650" x2="-2.0600" y2="2.5600" width="0.1200" layer="21"/>   <wire x1="-2.0600" y1="-2.5600" x2="-2.0600" y2="-2.4650" width="0.1200" layer="21"/>@@ -71,7 +83,7 @@   <wire x1="2.0600" y1="-2.5600" x2="-2.0600" y2="-2.5600" width="0.1200" layer="21"/>   <text x="0" y="3.480" size="1.27" layer="25" align="bottom-center">&gt;NAME</text>   <text x="0" y="-3.480" size="1.27" layer="27" align="top-center">&gt;VALUE</text>-<!--adom-pin1--><polygon width="0.0500" layer="21"><vertex x="-2.6000" y="2.4700"/><vertex x="-2.8400" y="2.8000"/><vertex x="-2.3600" y="2.8000"/></polygon></package>+</package> </packages> <symbols> <symbol name="RT7257BHZSP">@@ -107,7 +119,13 @@         <connect gate="G$1" pin="EN" pad="7"/>         <connect gate="G$1" pin="COMP" pad="6"/>       </connects>-      <technologies><technology name=""/></technologies>+      <technologies>+        <technology name="">+          <attribute name="MPN" value="RT7257BHZSP" constant="no"/>+          <attribute name="MANUFACTURER" value="Richtek Tech" constant="no"/>+          <attribute name="LCSC_PN" value="C27998" constant="no"/>+        </technology>+      </technologies>     </device>   </devices> </deviceset>