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CDCF5801ADBQR

Texas Instruments · Clock Generators / Frequency Synthesizers / PLL · SSOP-24-150mil

CDCF5801ADBQR from Texas Instruments, in a SSOP-24-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDREF power_in Reference voltage for REFCLK; it may be set to any value between 1.2 V and VDD and directly sets the REFCLK input trigger voltage.
2 REFCLK input Single-ended reference input clock with an input frequency of 12.5 MHz to 240 MHz and an input duty cycle of 40% to 60%.
3 VDDP power_in VDD for the PLL and input buffer, specified at 3 V minimum, 3.3 V typical and 3.6 V maximum.
4 GNDP power_in Ground for the PLL.
5 GND power_in Ground for VDDREF and VDDPD.
6 LEADLAG input Controls whether CLKOUT/CLKOUTB is delayed or advanced relative to REFCLK; allowable frequency up to 280 MHz with duty cycle of 25% to 75%.
7 DLYCTRL input Each rising edge delays or advances CLKOUT/CLKOUTB by 1/768 of the CLKOUT period (1.3 mUI); allowable frequency up to 240 MHz with duty cycle of 25% to 75%.
8 GNDPA power_in Ground for the phase aligner, digital logic, and inputs P[0:2], MULT[0:1], STOPB and PWRDNB.
9 VDDPA power_in VDD for the phase aligner, digital logic, and inputs P[0:2], MULT[0:1] and STOPB.
10 VDDPD power_in Reference voltage for inputs LEADLAG and DLYCTRL, with an input reference voltage of 1.2 V to VDD.
11 STOPB input Active-low output disabler: when 0, CLKOUT and CLKOUTB go to a dc value per Table 2 while the PLL and phase aligner keep running; 1 is normal operation.
12 PWRDNB input Active-low power-down: when 0 the IC is in power-down and CLKOUT/CLKOUTB go low; 1 is normal operation.
13 P2 input Post-divider control; together with P1 it selects the post divider (P[1:2] = 11 div2, 10 div4, 01 div8) per Table 1.
14 MULT1 input PLL multiplication factor select, used with MULT0; the terminal table lists MULT[0:1] = 00 as x4, 01 as x2, 11 as x8 and 10 as x16.
15 MULT0 input PLL multiplication factor select, used with MULT1 per Table 1 of the datasheet.
16 VDDO power_in VDD for the output pins (CLKOUT, CLKOUTB) and the power-down circuit.
17 GNDO power_in Ground for the output pins CLKOUT and CLKOUTB.
18 CLKOUTB output Complementary low-noise CMOS output clock, with output frequency range of 25 MHz to 280 MHz.
19 NC unconnected Not connected; leave floating or tie to GND.
20 CLKOUT output Low-noise CMOS output clock, with output frequency range of 25 MHz to 280 MHz.
21 GNDO power_in Ground for the output pins CLKOUT and CLKOUTB.
22 VDDO power_in VDD for the output pins CLKOUT and CLKOUTB and the power-down circuit.
23 P1 input Post-divider control; together with P2 it selects the post divider (P[1:2] = 11 div2, 10 div4, 01 div8) per Table 1.
24 P0 input Mode control: 0 selects normal operation and 1 selects high-Z outputs and other special settings.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SSOP-24-150mil
Category RTC/Clock Chip
Pins 24

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VDDP, VDDPA, VDDO) VDDP, VDDPA, VDDO 3 3.3 3.6 V 6
Operating free-air temperature TA -40 85 °C 6
High-level output current IOH -16 mA 6
Low-level output current IOL 16 mA 6
Input duty cycle on REFCLK 40 60 % 6
Input frequency on REFCLK 12.5 240 MHz 6
Output frequency on CLKOUT and CLKOUTB 25 280 MHz 6
Allowable frequency on DLYCTRL 240 MHz 6
Allowable frequency on LEADLAG 280 MHz 7
Allowable duty cycle on DLYCTRL and LEADLAG pins 25 75 % 7
Input slew rate SR 1 4 V/ns 6
Input frequency of modulation (if driven by SSC CLKIN) Fmod 33 kHz if driven by SSC CLKIN 6
Modulation index, nonlinear 0.5 0.6 % maximum 6
Supply voltage range VDDx -0.5 4 V 6
Storage temperature range Tstg -65 150 °C 6
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 6
Power rating 830 mW TA ≤ 25°C, DBQ 6
VO(STOP) Output voltage during Clkstop mode VO(STOP) 1.1 2 V See Figure 1 7
Output voltage swing (VOH - VOL) VO 1.7 2.9 V See Figure 1 7
Input clamp voltage VIK -1.2 V VDD = 3 V, II = -18 mA 7
High-level output voltage VOH 2 2.5 V VDD = 3 to 3.6 V, See Figure 1 7
High-level output voltage VOH 2.2 V VDD = 3 V, IOH = -16 mA 7
Low-level output voltage VOL 0.4 0.6 V VDD = 3 to 3.6 V, See Figure 1 7
Low-level output voltage VOL 0.5 V VDD = 3 V, IOH = 16 mA 7
High-level output current IOH -32 -52 mA VDD = 3.135 V, VO = 1 V 7
High-level output current IOH -51 mA VDD = 3.3 V, VO = 1.65 V 7
High-level output current IOH -14.5 -21 mA VDD = 3.465 V, VO = 3.135 V 7
Low-level output current IOL 43 61.5 mA VDD = 3.135 V, VO = 1.95 V 7
Low-level output current IOL 65 mA VDD = 3.3 V, VO = 1.65 V 7
Low-level output current IOL 25.5 40 mA VDD = 3.465 V, VO = 0.4 V 7
High-impedance-state output current IOZ -10 10 µA P0 = 1, P1 = P2 = 0 7
High-impedance-state output current during Clk Stop IOZ(STOP) -100 100 µA Stop = 0, VO = GND or VDD 7
High-impedance-state output current in power-down state IOZ(PD) -10 100 µA PWRDNB = 0, VO = GND or VDD 7
High-level input current IIH 10 µA REFCLK; STOPB; PWRDNB; P[0:2]; MULT[0:1]; VDD = 3.6 V, VI = VDD 7
Low-level input current IIL -10 µA DLYCTRL; LEADLAG; VDD = 3.6 V, VI = 0 7
Output high state impedance (single ended) ZO 15 35 50 Ω RI at IO -14.5 mA to -16.5 mA 7
Output low state impedance (single ended) ZO 10 17 35 Ω RI at IO 14.5 mA to 16.5 mA 7
Reference current VDDREF; VDDPD IREF 50 µA PWRDNB = 0, VDD = 3.6 V 7
Reference current VDDREF; VDDPD IREF 0.5 mA PWRDNB = 1, VDD = 3.6 V 7
Supply current in power-down state IDD(PD) 4 mA REFCLK = 0 MHz to 280 MHz; PWRDNB = 0; STOPB = 1 7
Supply current in CLK stop state IDD(CLKSTOP) 44 mA BUSCLK configured for 280 MHz 7
Supply current (normal operation mode) IDD(NORMAL) 75 mA BUSCLK 280 MHz, MULT[0:1] = 10; P[0:2] = 011; Load, See Figure 1 7
Output duty cycle over 1000 cycles t(DC) 42 58 % See Figure 3 9
Output rise and fall times (20%-80% of output voltage) tr, tf 150 250 350 ps See Figure 5 9
Delay time, PWRDNB↑ to CLKOUT/CLKOUTB settled (power up) t(powerup) 3 ms Power down to Normal; See Figure 6 9
MULT0 and MULT1 change to CLKOUT output resettled t(MULT) 1 ms Normal to Normal; See Figure 7 10
STOPB↑ to CLKOUT glitch-free clock edges t(CLKON) 10 ns CLK stop to Normal; See Figure 8 10
STOPB↑ to CLKOUT output settled within 50 ps of the phase before CLK stop t(CLKSETL) 20 cycles Normal; See Figure 8 10
STOPB↓ to CLKOUT output disabled t(CLKOFF) 5 ns Normal to CLK stop; See Figure 8 10
Delay time, PWRDNB↓ to device in power-down mode t(powerdown) 1 ms Normal to Power down; See Figure 6 10
Maximum time in CLKSTOP (STOPB = 0) before reentering normal mode t(STOP) 100 µs STOPB Normal; See Figure 8 10
Minimum time in normal mode (STOPB = 1) before reentering CLKSTOP t(ON) 100 ms Normal to CLK stop; See Figure 8 10
Period rms (1-sigma jitter, full frequency band), REFCLK 25 MHz / CLKOUT 25 MHz t(jitter) 20 48 ps REFCLK 25 MHz, CLKOUT 25 MHz, MULT[0:1] 11, P[0:2] 001 8
Period rms (1-sigma jitter, full frequency band), REFCLK 50 MHz / CLKOUT 50 MHz t(jitter) 7 15 ps REFCLK 50 MHz, CLKOUT 50 MHz, MULT[0:1] 11, P[0:2] 001 8
Period rms (1-sigma jitter, full frequency band), REFCLK 100 MHz / CLKOUT 100 MHz t(jitter) 5 14 ps REFCLK 100 MHz, CLKOUT 100 MHz, MULT[0:1] 00, P[0:2] 010; phase aligner running 8
Period rms (1-sigma jitter, full frequency band), REFCLK 156 MHz / CLKOUT 156 MHz t(jitter) 4 8 ps REFCLK 156 MHz, CLKOUT 156 MHz, MULT[0:1] 00, P[0:2] 010 8
Period rms (1-sigma jitter, full frequency band), REFCLK 200 MHz / CLKOUT 200 MHz t(jitter) 8 15 ps REFCLK 200 MHz, CLKOUT 200 MHz, MULT[0:1] 01, P[0:2] 011 8
Period rms (1-sigma jitter, full frequency band), REFCLK 25 MHz / CLKOUT 200 MHz t(jitter) 4 11 ps REFCLK 25 MHz, CLKOUT 200 MHz, MULT[0:1] 10, P[0:2] 011 9
Input capacitance CI 2 pF VI = VDD or GND 7

CAD (KiCad official)

  • Symbol: CDCF5801ADBQR
  • Footprint: Package_SO:SSOP-24_3.9x8.7mm_P0.635mm
  • 3D model: SSOP-24-150mil (KiCad packages3D, STEP)
  • 3D model files: cdcf5801adbqr-etched.step / cdcf5801adbqr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cdcf5801adbqr.step / cdcf5801adbqr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (20 pp, sha256 680cbe8e952bcb05, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF