VL53L5CX
Public Made by Adomby adom
ST VL53L5CX Time-of-Flight 8x8 multizone ranging sensor, 400 cm, 63 deg diagonal FoV, I2C, optical LGA-16 6.4 x 3.0 x 1.5 mm. Pinout extracted from the datasheet, KiCad symbol with chip outline, footprint, Fusion library, manufacturer STEP (Z-up, FoV on/off, side-etched MPN) and provenance.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownVL53L5CX
STMicroelectronics · Time-of-Flight 8x8 multizone ranging sensor · Optical LGA-16 with liner, 6.4 x 3.0 x 1.5 mm
The VL53L5CX is ST's FlightSense direct Time-of-Flight ranging sensor that returns absolute distance for up to 8 x 8 zones (64 zones, or 4 x 4) across a 63 degree diagonal square field of view, up to 400 cm, at up to 60 Hz. One reflowable module integrates the 940 nm VCSEL emitter with its driver, diffractive optics on both emitter and receiver, the SPAD receiver array and a microcontroller running ST's firmware, so the host only talks I2C. Histogram processing gives multitarget detection per zone and immunity to cover-glass crosstalk beyond 60 cm; an autonomous low-power mode wakes the host on a programmable distance threshold. Runs from a single 2.8 V or 3.3 V supply, or with a separate 1.8 V IOVDD.
Order code VL53L5CXV0GC/1 (tape and reel, 3600 pcs minimum, DS13754 Rev 5 (December 2021) page 32). Datasheet: DS13754 Rev 5 (December 2021) (local copy: docs/vl53l5cx-datasheet.pdf). Product page: st.com.
Manufacturer and resources
Everything on this page traces back to STMicroelectronics. Start here for the original documents, software and CAD.
| Resource | Link | Why you need it |
|---|---|---|
| Product page (STMicroelectronics) | open | manufacturer authority: lifecycle, documentation, tools and the CAD Resources tab |
| Datasheet DS13754 | open | the source of every pin, spec and drawing on this page |
| User manual UM2884 (ULD driver and API) | open | how to talk to the sensor from firmware |
| Application note AN5657 (module integration, cover glass, reflow) | open | mechanical and optical integration rules |
| STSW-IMG023 ultra-lite driver (ULD) | open | ST's C driver package for this sensor |
| Evaluation kits SATEL-VL53L5CX and X-NUCLEO-53L5A1 | open | breakout and Nucleo expansion boards from ST |
| CAD Resources tab (SamacSys and Ultra Librarian widgets) | open | where ST hosts the symbol, footprint and 3D model downloads |
| SamacSys entry for this part (Component Search Engine) | open | free CSE account; partID 15569520, 3D download is ga/model.php?fmt3d=stp&partID=15569520 |
Evaluation-kit and software part numbers are ST's names as listed with this product; the links are st.com searches so they stay valid when ST moves a document. Kept locally: the datasheet in docs/, the manufacturer 3D model in vendor/ (untouched bytes, sha256 in provenance/file-hashes.json).
Pinout
Source: DS13754 Rev 5 (December 2021) Table 3, page 6. Pad A1 is bottom-right in the top view (outline drawing); the footprint marks it with the chamfered corner and dot.
| Pad | Name | Type | Function |
|---|---|---|---|
| A1 | I2C_RST | input | I2C interface reset, active high. Toggle 0 to 1 to 0 to reset the I2C slave (does not reset the sensor, see UM2884). Connect to GND through 47 kOhm. |
| A2 | RSVD4 | passive | Reserved. Connect to ground. |
| A3 | INT | open_collector | Interrupt output, defaults to open-drain (tristate); 47 kOhm pull-up to IOVDD required. |
| A4 | IOVDD | power_in | 1.8 V, 2.8 V or 3.3 V supply for the digital core and I/O. All digital signals are driven at IOVDD level. |
| A5 | LPn | input | Comms enable. Logic 0 disables I2C communication in low-power mode, logic 1 enables it; used to change the I2C address in multi-device systems. 47 kOhm pull-up to IOVDD required. |
| A6 | RSVD1 | passive | Reserved. Connect to ground. |
| A7 | RSVD2 | passive | Reserved. Connect to ground. |
| B1 | AVDD | power_in | 2.8 V or 3.3 V analog and VCSEL supply. |
| B4 | THERMALPAD | power_in | Thermal pad. Connect to a ground plane for thermal conduction (AN5657). |
| B7 | AVDD | power_in | 2.8 V or 3.3 V analog and VCSEL supply. |
| C1 | GND | power_in | Ground. |
| C2 | RSVD6 | bidirectional | Reserved general-purpose I/O, defaults to open-drain (tristate); 47 kOhm pull-up to IOVDD required. |
| C3 | SDA | bidirectional | I2C data (bidirectional); 2.2 kOhm pull-up to IOVDD required. |
| C4 | SCL | input | I2C clock (input); 2.2 kOhm pull-up to IOVDD required. |
| C5 | RSVD5 | unconnected | Reserved. Do not connect. |
| C6 | RSVD3 | passive | Reserved. Connect to ground. |
| C7 | GND | power_in | Ground. |
Key specifications
| Parameter | Value | Source |
|---|---|---|
| Zones | 4 x 4 or 8 x 8 (64 zones), per-zone multitarget detection and motion indicator | DS13754 Rev 5 (December 2021) page 1 |
| Ranging distance | up to 400 cm | DS13754 Rev 5 (December 2021) page 1 |
| Field of view | 63 degree diagonal, square (diffractive optics on emitter and receiver) | DS13754 Rev 5 (December 2021) page 1 |
| Frame rate | up to 60 Hz | DS13754 Rev 5 (December 2021) page 1 |
| Emitter | 940 nm VCSEL with integrated driver, invisible, eye-safe Class 1 | DS13754 Rev 5 (December 2021) pages 1 to 2 |
| Interface | I2C, 400 kHz to 1 MHz (Fast mode plus), 7-bit address 0x52 (programmable via LPn) | DS13754 Rev 5 (December 2021) Table 7, page 13 |
| AVDD | 2.8 V or 3.3 V analog and VCSEL supply (independent of IOVDD) | DS13754 Rev 5 (December 2021) Table 10, page 15 |
| IOVDD | 1.8 V, 2.8 V or 3.3 V digital core and I/O supply | DS13754 Rev 5 (December 2021) page 1; Table 10, page 15 |
| Operating temperature | -30 to 85 degrees C ambient | DS13754 Rev 5 (December 2021) Table 10, page 15 |
| Package | Optical LGA-16 with liner, 6.4 x 3.0 x 1.5 mm, single reflowable component | DS13754 Rev 5 (December 2021) page 1; outline drawing, pages 24 to 27 |
| Moisture sensitivity | MSL 3 (IPC/JEDEC J-STD-020) | DS13754 Rev 5 (December 2021) page 31 |
Sourcing
Snapshot 2026-09-18 (single-unit price, stock at that moment; re-check before ordering).
| Distributor | Part | Price @1 | Stock | Link |
|---|---|---|---|---|
| Mouser | 511-VL53L5CXV0GC/1 | $7.92 | 4,672 | open |
| DigiKey | 497-VL53L5CXV0GC/1-ND | see link | see link | open |
Packaging, handling and marking
- Tape and reel, EIA-481 carrier tape; orientation and pocket drawing on DS13754 Rev 5 (December 2021) page 32.
- Moisture sensitivity level 3 (IPC/JEDEC J-STD-020), DS13754 Rev 5 (December 2021) page 31. Handle with non-marring ESD-safe tweezers; never touch the optical windows.
- Device marking and the marking area on the cap: DS13754 Rev 5 (December 2021) page 28 to 29.
- Recommended solder pattern (the footprint here follows it pad for pad): DS13754 Rev 5 (December 2021) page 31.
- Reflow and cover-glass guidance: AN5657 (module integration, cover glass) and UM2884 (driver and API).
CAD
Everything below is Adom-authored from the datasheet and the manufacturer CAD, licensed CC-BY-4.0; the manufacturer's own files keep ST's and SamacSys's terms.
| File | What it is |
|---|---|
vl53l5cx.kicad_sym |
KiCad symbol, two-column layout with intelligent pin groups (Power, Ground, I2C, Control, Reserved) and the chip outline of this exact part baked in the body (adom-symbol 1.2.0). The MPN in the outline is on the side wall, the top face carries the emitter and receiver windows. |
vl53l5cx.kicad_mod |
KiCad footprint from the datasheet solder pattern (2 x 7 pads on 0.75 mm pitch, two side pads, thermal pad). Verified pad-by-pad against the SamacSys land pattern: provenance/footprint-vs-samacsys.json. |
vl53l5cx.lbr |
Fusion 360 / EAGLE library (symbol + package + device). |
altium/Adom_ToF.SchLib, altium/Adom_ToF.PcbLib |
Native Altium Designer libraries holding all three VL53Lx parts (adom-lbr assemble-altium, then the etched STEP bodies attached and the symbol-to-footprint links set through the Altium bridge in Altium Designer itself); altium/VL53L5CX.fp.spec is the kicad2altium footprint spec, altium/VL53L5CX.adom-lbr.json the canonical hub record. |
altium/tof-8x8-sensors.SchDoc, altium/tof-8x8-sensors.PcbDoc |
Altium example: the three sensors on one sheet (U1..U3) and one 39 x 14 mm board, placed by the Altium bridge (altium_place_on_sch / altium_test_board with a ';' list, altium-bridge 0.2.13). |
vl53l5cx-etched.step / .glb |
Library model. Manufacturer body, Adom Z-up, seated on z = 0, field-of-view cones removed, virtual MPN inlay on the +Y side wall. |
vl53l5cx.step / .glb |
Same body, no marking. |
vl53l5cx-fov.step / .glb, vl53l5cx-fov-etched.step / .glb |
The manufacturer's field-of-view cones kept as separate solids so you can switch them on when you want to see the coverage and off when you place the part. |
vl53l5cx-hero.glb |
Page hero: the etched chip plus teal dashed copper-pad outlines (50 % opacity), silkscreen (30 %), pad signal labels (50 %) and the field-of-view cones as a hidden layer. Open the viewer's Layers panel (left edge) and switch Field of view on to see the coverage; Chip, MPN etch, Pad outlines, Silkscreen and Pad labels are toggles too. The model idles with a gentle yaw. Reference artwork only, never put it on a board. |
vendor/VL53L5CX-cse-original.step |
Manufacturer STEP exactly as downloaded from the st.com CAD Resources tab (SamacSys), Y-up, sha256 35dc56b6bc50f44b. |
vl53l5cx-adom-datasheet-model.step |
Adom-authored coloured model built from the datasheet outline drawing (CadQuery), used before the manufacturer STEP was fetched. |
artwork/ |
chip-thumbnailer outline cache (11 styles) and shaded iso render of the etched model; VL53L5CX-thumbs.json is the manifest. |
The 3D transforms (Y-up to Z-up rotation, yaw, seating translation, which solids were dropped, etch placement) are recorded per file in provenance/*.step.json.
Provenance
| Data | Source | Reference | Evidence |
|---|---|---|---|
| Identity, features | DS13754 Rev 5 (December 2021) | page 1 | datasheet copy in docs/ |
| Pin functions | DS13754 Rev 5 (December 2021) Table 3 | page 6 | table above quotes the datasheet |
| Package size | DS13754 Rev 5 (December 2021) outline drawing | page 24 to 27 | body bbox measured on the manufacturer STEP in provenance/vl53l5cx.step.json |
| Land pattern | DS13754 Rev 5 (December 2021) recommended solder pattern | page 31 | provenance/footprint-vs-samacsys.json |
| 3D model | st.com CAD Resources tab (SamacSys), CSE partID 15569520 | fetched 2026-09-19 | sha256 in page.json and provenance/file-hashes.json |
| Price and stock | DigiKey, Mouser | 2026-09-18 | links above |
Cited datasheet pages
Page images rendered from the DS13754 Rev 5 (December 2021) copy in docs/ (click to enlarge).
| Page | What it shows |
|---|---|
| page 6 | Pin description (Table 3) |
| page 15 | Recommended operating conditions (Table 10) |
| page 24 | Outline drawing (Figure 21) |
| page 31 | Recommended solder pattern |
| page 32 | Tape and reel, order codes |
Related
- VL53L7CX - pin-to-pin and driver compatible sibling with a 90 degree FoV (350 cm).
- VL53L8CX - newer generation with SPI, 1.8 V core and better ambient-light performance (different pinout).
- VL53L5CX molecule (v11) - a reusable sub-circuit built around this sensor.
Thermal pad
B4 is the exposed thermal pad (Optical LGA-16 with liner); the datasheet requires it on the ground plane for heat conduction. The array below is the standard thermal-via rule for a pad this size; the application note is the authority for your stack-up.
Chip outline cache
Family
JSON ↗Template revision 1.0.0 from family.json. Every recorded child is on the current revision.