VL53L8CX

STMicroelectronics · Time-of-Flight 8x8 multizone ranging sensor · Optical LGA-16 with liner, 6.4 x 3.0 x 1.75 mm

The VL53L8CX is the new-generation FlightSense multizone sensor: a higher-power 940 nm VCSEL and two metasurface lenses give up to 400 cm ranging over a 65 degree diagonal square field, with markedly better performance under ambient light and lower power than the VL53L5CX. It returns absolute distance for up to 8 x 8 zones at up to 60 Hz, with per-zone multitarget detection, motion indication and cover-glass crosstalk immunity above 60 cm, and can sit behind a dark cover glass. The host talks I2C (up to 1 MHz) or SPI (up to 3 MHz) for high frame rates and short boot; a 1.8 V core supply plus 3.3 V AVDD are required and IOVDD can be 1.2 V or 1.8 V. The pinout differs from the VL53L5CX/L7CX (SPI pins, SYNC, CORE_1V8), so it is not a drop-in replacement.

Order code VL53L8CXV0GC/1 (tape and reel, 3600 pcs minimum, DS14161 Rev 7 (August 2023) page 38). Datasheet: DS14161 Rev 7 (August 2023) (local copy: docs/vl53l8cx-datasheet.pdf). Product page: st.com.

Manufacturer and resources

Everything on this page traces back to STMicroelectronics. Start here for the original documents, software and CAD.

Evaluation-kit and software part numbers are ST's names as listed with this product; the links are st.com searches so they stay valid when ST moves a document. Kept locally: the datasheet in docs/, the manufacturer 3D model in vendor/ (untouched bytes, sha256 in provenance/file-hashes.json).

Pinout

Source: DS14161 Rev 7 (August 2023) Table 3, page 6 to 7. Pad A1 is bottom-right in the top view (outline drawing); the footprint marks it with the chamfered corner and dot.

Key specifications

Sourcing

Snapshot 2026-09-18 (single-unit price, stock at that moment; re-check before ordering).

Packaging, handling and marking

• Tape and reel, EIA-481 carrier tape; orientation and pocket drawing on DS14161 Rev 7 (August 2023) page 33 to 34.
• Moisture sensitivity level 3 (IPC/JEDEC J-STD-020), DS14161 Rev 7 (August 2023) page 36. Handle with non-marring ESD-safe tweezers; never touch the optical windows.
• Device marking and the marking area on the cap: DS14161 Rev 7 (August 2023) page 33.
• Recommended solder pattern (the footprint here follows it pad for pad): DS14161 Rev 7 (August 2023) page 35.
• Reflow and cover-glass guidance: AN5897 (module integration, cover glass) and UM3109 (driver and API).

CAD

Everything below is Adom-authored from the datasheet and the manufacturer CAD, licensed CC-BY-4.0; the manufacturer's own files keep ST's and SamacSys's terms.

The 3D transforms (Y-up to Z-up rotation, yaw, seating translation, which solids were dropped, etch placement) are recorded per file in provenance/*.step.json.

Provenance

Cited datasheet pages

Page images rendered from the DS14161 Rev 7 (August 2023) copy in docs/ (click to enlarge).

Datasheet figure crops

Figure crops from DS14161 Rev 7 (August 2023) that an earlier revision of this page extracted (kept at the repo root):

• pinout.png
• outline-drawing-1.png
• outline-drawing-2.png
• solder-pattern.png
• tape-and-reel.png
• fov-diagram.png
• block-diagram.png
• zone-mapping-8x8.png

Related

• VL53L5CX - previous generation, I2C only, 2.8/3.3 V single supply (different pinout).
• VL53L7CX - ultrawide 90 degree FoV member of the previous generation.

Thermal pad

B4 is the exposed thermal pad (Optical LGA-16 with liner); the datasheet requires it on the ground plane for heat conduction. The array below is the standard thermal-via rule for a pad this size; the application note is the authority for your stack-up.

Chip outline cache

• 3D model files: vl53l8cx-etched.step / vl53l8cx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); vl53l8cx.step / vl53l8cx.glb are the bare package body.