VL53L7CX
Public Made by Adomby adom
ST VL53L7CX Time-of-Flight 8x8 multizone ranging sensor with 90 deg diagonal FoV (60 x 60), 350 cm, I2C, pin-compatible with VL53L5CX, optical LGA-16 6.4 x 3.0 x 1.6 mm. Pinout extracted from the datasheet, KiCad symbol with chip outline, footprint, Fusion library, manufacturer STEP (Z-up, FoV on/off, side-etched MPN) and provenance.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownVL53L7CX
STMicroelectronics · Time-of-Flight 8x8 multizone ranging sensor · Optical LGA-16 with liner, 6.4 x 3.0 x 1.6 mm
The VL53L7CX is the ultrawide field-of-view member of ST's FlightSense multizone family: a metasurface lens on the 940 nm VCSEL projects a 60 x 60 degree square field (90 degree diagonal) and the SPAD receiver returns absolute distance for up to 8 x 8 zones at up to 60 Hz, up to 350 cm. It is derived from the VL53L5CX and shares its pinout and driver, so a VL53L5CX design migrates by swapping the part. Histogram processing gives per-zone multitarget detection and cover-glass crosstalk immunity beyond 60 cm; the autonomous low-power mode wakes the host on a programmable distance threshold. Three modules cover 180 x 60 degrees for smart speakers, vacuum robots (SLAM, wall tracking, cliff detection) and user-presence wake-up.
Order code VL53L7CXV0GC/1 (tape and reel, 3600 pcs minimum, DS13865 Rev 6 (March 2023) page 34). Datasheet: DS13865 Rev 6 (March 2023) (local copy: docs/vl53l7cx-datasheet.pdf). Product page: st.com.
Manufacturer and resources
Everything on this page traces back to STMicroelectronics. Start here for the original documents, software and CAD.
| Resource | Link | Why you need it |
|---|---|---|
| Product page (STMicroelectronics) | open | manufacturer authority: lifecycle, documentation, tools and the CAD Resources tab |
| Datasheet DS13865 | open | the source of every pin, spec and drawing on this page |
| User manual UM3038 (ULD driver and API) | open | how to talk to the sensor from firmware |
| Application note AN5853 (module integration, cover glass, reflow) | open | mechanical and optical integration rules |
| STSW-IMG036 ultra-lite driver (ULD) | open | ST's C driver package for this sensor |
| Evaluation kits SATEL-VL53L7CX and X-NUCLEO-53L7A1 | open | breakout and Nucleo expansion boards from ST |
| CAD Resources tab (SamacSys and Ultra Librarian widgets) | open | where ST hosts the symbol, footprint and 3D model downloads |
| SamacSys entry for this part (Component Search Engine) | open | free CSE account; partID 17168850, 3D download is ga/model.php?fmt3d=stp&partID=17168850 |
Evaluation-kit and software part numbers are ST's names as listed with this product; the links are st.com searches so they stay valid when ST moves a document. Kept locally: the datasheet in docs/, the manufacturer 3D model in vendor/ (untouched bytes, sha256 in provenance/file-hashes.json).
Pinout
Source: DS13865 Rev 6 (March 2023) Table 3, page 6. Pad A1 is bottom-right in the top view (outline drawing); the footprint marks it with the chamfered corner and dot.
| Pad | Name | Type | Function |
|---|---|---|---|
| A1 | I2C_RST | input | I2C interface reset, active high. Toggle 0 to 1 to 0 to reset the I2C slave (does not reset the sensor, see UM3038). Connect to GND through 47 kOhm. |
| A2 | RSVD4 | passive | Reserved. Connect to ground. |
| A3 | INT | open_collector | Interrupt output, defaults to open-drain (tristate); 47 kOhm pull-up to IOVDD required. |
| A4 | IOVDD | power_in | 1.8 V, 2.8 V or 3.3 V supply for the digital core and I/O. All digital signals are driven at IOVDD level. |
| A5 | LPn | input | Comms enable. Logic 0 disables I2C communication in low-power mode, logic 1 enables it; used to change the I2C address in multi-device systems. 47 kOhm pull-up to IOVDD required. |
| A6 | RSVD1 | passive | Reserved. Connect to ground. |
| A7 | RSVD2 | passive | Reserved. Connect to ground. |
| B1 | AVDD | power_in | 2.8 V or 3.3 V analog and VCSEL supply. |
| B4 | THERMALPAD | power_in | Thermal pad. Connect to a ground plane for thermal conduction (AN5853). |
| B7 | AVDD | power_in | 2.8 V or 3.3 V analog and VCSEL supply. |
| C1 | GND | power_in | Ground. |
| C2 | RSVD6 | bidirectional | Reserved general-purpose I/O, defaults to open-drain (tristate); 47 kOhm pull-up to IOVDD required. |
| C3 | SDA | bidirectional | I2C data (bidirectional); 2.2 kOhm pull-up to IOVDD required. |
| C4 | SCL | input | I2C clock (input); 2.2 kOhm pull-up to IOVDD required. |
| C5 | RSVD5 | unconnected | Reserved. Do not connect. |
| C6 | RSVD3 | passive | Reserved. Connect to ground. |
| C7 | GND | power_in | Ground. |
Key specifications
| Parameter | Value | Source |
|---|---|---|
| Zones | 4 x 4 or 8 x 8 (64 zones), per-zone multitarget detection and motion indicator | DS13865 Rev 6 (March 2023) page 1 |
| Ranging distance | up to 350 cm | DS13865 Rev 6 (March 2023) page 1 |
| Field of view | 90 degree diagonal, 60 x 60 degree square (metasurface DOE on emitter and receiver) | DS13865 Rev 6 (March 2023) page 1 |
| Frame rate | up to 60 Hz | DS13865 Rev 6 (March 2023) page 1 |
| Emitter | 940 nm VCSEL with integrated driver, invisible, eye-safe Class 1 | DS13865 Rev 6 (March 2023) pages 1 to 2 |
| Interface | I2C, up to 1 MHz (Fast mode plus), 7-bit address 0x52 (programmable via LPn) | DS13865 Rev 6 (March 2023) Table 7, page 13 |
| AVDD | 2.8 V or 3.3 V analog and VCSEL supply (independent of IOVDD) | DS13865 Rev 6 (March 2023) Table 10, page 15 |
| IOVDD | 1.8 V, 2.8 V or 3.3 V digital core and I/O supply | DS13865 Rev 6 (March 2023) page 1; Table 10, page 15 |
| Operating temperature | -30 to 85 degrees C ambient | DS13865 Rev 6 (March 2023) Table 10, page 15 |
| Compatibility | pin-to-pin and driver compatible with VL53L5CX | DS13865 Rev 6 (March 2023) page 1 |
| Package | Optical LGA-16 with liner, 6.4 x 3.0 x 1.6 mm, single reflowable component | DS13865 Rev 6 (March 2023) page 1; outline drawing, pages 25 to 28 |
| Moisture sensitivity | MSL 3 (IPC/JEDEC J-STD-020) | DS13865 Rev 6 (March 2023) page 33 |
Sourcing
Snapshot 2026-09-18 (single-unit price, stock at that moment; re-check before ordering).
| Distributor | Part | Price @1 | Stock | Link |
|---|---|---|---|---|
| Mouser | 511-VL53L7CXV0GC/1 | $7.94 | 28 | open |
| DigiKey | 497-VL53L7CXV0GC/1-ND | $8.80 | 4,507 | open |
Packaging, handling and marking
- Tape and reel, EIA-481 carrier tape; orientation and pocket drawing on DS13865 Rev 6 (March 2023) page 34.
- Moisture sensitivity level 3 (IPC/JEDEC J-STD-020), DS13865 Rev 6 (March 2023) page 33. Handle with non-marring ESD-safe tweezers; never touch the optical windows.
- Device marking and the marking area on the cap: DS13865 Rev 6 (March 2023) page 30 to 31.
- Recommended solder pattern (the footprint here follows it pad for pad): DS13865 Rev 6 (March 2023) page 33.
- Reflow and cover-glass guidance: AN5853 (module integration, cover glass) and UM3038 (driver and API).
CAD
Everything below is Adom-authored from the datasheet and the manufacturer CAD, licensed CC-BY-4.0; the manufacturer's own files keep ST's and SamacSys's terms.
| File | What it is |
|---|---|
vl53l7cx.kicad_sym |
KiCad symbol, two-column layout with intelligent pin groups (Power, Ground, I2C, Control, Reserved) and the chip outline of this exact part baked in the body (adom-symbol 1.2.0). The MPN in the outline is on the side wall, the top face carries the emitter and receiver windows. |
vl53l7cx.kicad_mod |
KiCad footprint from the datasheet solder pattern (2 x 7 pads on 0.75 mm pitch, two side pads, thermal pad). Verified pad-by-pad against the SamacSys land pattern: provenance/footprint-vs-samacsys.json. |
vl53l7cx.lbr |
Fusion 360 / EAGLE library (symbol + package + device). |
altium/Adom_ToF.SchLib, altium/Adom_ToF.PcbLib |
Native Altium Designer libraries holding all three VL53Lx parts (adom-lbr assemble-altium, then the etched STEP bodies attached and the symbol-to-footprint links set through the Altium bridge in Altium Designer itself); altium/VL53L7CX.fp.spec is the kicad2altium footprint spec, altium/VL53L7CX.adom-lbr.json the canonical hub record. |
altium/tof-8x8-sensors.SchDoc, altium/tof-8x8-sensors.PcbDoc |
Altium example: the three sensors on one sheet (U1..U3) and one 39 x 14 mm board, placed by the Altium bridge (altium_place_on_sch / altium_test_board with a ';' list, altium-bridge 0.2.13). |
vl53l7cx-etched.step / .glb |
Library model. Manufacturer body, Adom Z-up, seated on z = 0, field-of-view cones removed, virtual MPN inlay on the +Y side wall. |
vl53l7cx.step / .glb |
Same body, no marking. |
vl53l7cx-fov.step / .glb, vl53l7cx-fov-etched.step / .glb |
The manufacturer's field-of-view cones kept as separate solids so you can switch them on when you want to see the coverage and off when you place the part. |
vl53l7cx-hero.glb |
Page hero: the etched chip plus teal dashed copper-pad outlines (50 % opacity), silkscreen (30 %), pad signal labels (50 %) and the field-of-view cones as a hidden layer. Open the viewer's Layers panel (left edge) and switch Field of view on to see the coverage; Chip, MPN etch, Pad outlines, Silkscreen and Pad labels are toggles too. The model idles with a gentle yaw. Reference artwork only, never put it on a board. |
vendor/VL53L7CX-cse-original.step |
Manufacturer STEP exactly as downloaded from the st.com CAD Resources tab (SamacSys), Y-up, sha256 d6c8c84cf019d696. |
vl53l7cx-adom-datasheet-model.step |
Adom-authored coloured model built from the datasheet outline drawing (CadQuery), used before the manufacturer STEP was fetched. |
artwork/ |
chip-thumbnailer outline cache (11 styles) and shaded iso render of the etched model; VL53L7CX-thumbs.json is the manifest. |
The 3D transforms (Y-up to Z-up rotation, yaw, seating translation, which solids were dropped, etch placement) are recorded per file in provenance/*.step.json.
Provenance
| Data | Source | Reference | Evidence |
|---|---|---|---|
| Identity, features | DS13865 Rev 6 (March 2023) | page 1 | datasheet copy in docs/ |
| Pin functions | DS13865 Rev 6 (March 2023) Table 3 | page 6 | table above quotes the datasheet |
| Package size | DS13865 Rev 6 (March 2023) outline drawing | page 25 to 28 | body bbox measured on the manufacturer STEP in provenance/vl53l7cx.step.json |
| Land pattern | DS13865 Rev 6 (March 2023) recommended solder pattern | page 33 | provenance/footprint-vs-samacsys.json |
| 3D model | st.com CAD Resources tab (SamacSys), CSE partID 17168850 | fetched 2026-09-19 | sha256 in page.json and provenance/file-hashes.json |
| Price and stock | DigiKey, Mouser | 2026-09-18 | links above |
Cited datasheet pages
Page images rendered from the DS13865 Rev 6 (March 2023) copy in docs/ (click to enlarge).
| Page | What it shows |
|---|---|
| page 6 | Pin description (Table 3) |
| page 15 | Recommended operating conditions (Table 10) |
| page 25 | Outline drawing (Figure 21) |
| page 33 | Recommended solder pattern |
| page 34 | Tape and reel, order codes |
Related
- VL53L5CX - the 63 degree FoV, 400 cm sibling this part is derived from (same pinout and driver).
- VL53L8CX - newer generation with SPI, 1.8 V core and better ambient-light performance (different pinout).
Thermal pad
B4 is the exposed thermal pad (Optical LGA-16 with liner); the datasheet requires it on the ground plane for heat conduction. The array below is the standard thermal-via rule for a pad this size; the application note is the authority for your stack-up.
Chip outline cache
- 3D model files:
vl53l7cx-etched.step/vl53l7cx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);vl53l7cx.step/vl53l7cx.glbare the bare package body.
Family
- Built from VL53L5CX revision
1.0.0(as v0.1.0) current