# UCC21710DWR

**Texas Instruments** · Isolators - Gate Drivers · SOIC-16-300mil

UCC21710DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AIN | input | Isolated analog sensing input with small parallel capacitor to COM recommended for noise immunity. |
| 2 | OC | input | Over-current detection input supporting SenseFET, DESAT, and shunt resistor sensing methods. |
| 3 | COM | power_in | Common ground reference connected to IGBT emitter or SiC-MOSFET source. |
| 4 | OUTH | output | Gate driver high-side output with ±10A peak pull-up current capability. |
| 5 | VDD | power_in | Positive supply rail (13V to 33V) for isolated gate drive voltage stage. |
| 6 | OUTL | output | Gate driver low-side output with ±10A peak pull-down current capability. |
| 7 | CLMPI | output | Internal active Miller clamp output (4A maximum) connected to power transistor gate. |
| 8 | VEE | power_in | Negative supply rail for isolated gate drive voltage stage. |
| 9 | GND | power_in | Input-side ground reference for power and control logic. |
| 10 | IN+ | input | Non-inverting gate driver control input with logic thresholds 0 to 0.3×VCC (low) and 0.7×VCC to VCC (high). |
| 11 | IN- | input | Inverting gate driver control input with logic thresholds 0 to 0.3×VCC (low) and 0.7×VCC to VCC (high). |
| 12 | RDY | output | Power-good output indicating VCC-GND and VDD-COM readiness in open-drain configuration. |
| 13 | FLT | output | Active-low fault alarm output for over-current or short-circuit conditions in open-drain configuration. |
| 14 | RST/EN | input | Reset/Enable input providing output shutdown and fault reset with 1000ns minimum pulse width. |
| 15 | VCC | power_in | Input-side power supply (3V to 5.5V) for control logic stage. |
| 16 | APWM | output | Isolated analog-to-PWM sensing output for temperature or voltage conversion. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Power Management (PMIC) |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `UCC21710DWR`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files: `ucc21710dwr-etched.step` / `ucc21710dwr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ucc21710dwr.step` / `ucc21710dwr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ucc21710) (55 pp, sha256 `c020d4f4b287e499`, retrieved 2026-10-07, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ucc21710dwr-datasheet.pdf)