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Contents

README

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UCC21710DWR

Texas Instruments · Isolators - Gate Drivers · SOIC-16-300mil

UCC21710DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AIN input Isolated analog sensing input with small parallel capacitor to COM recommended for noise immunity.
2 OC input Over-current detection input supporting SenseFET, DESAT, and shunt resistor sensing methods.
3 COM power_in Common ground reference connected to IGBT emitter or SiC-MOSFET source.
4 OUTH output Gate driver high-side output with ±10A peak pull-up current capability.
5 VDD power_in Positive supply rail (13V to 33V) for isolated gate drive voltage stage.
6 OUTL output Gate driver low-side output with ±10A peak pull-down current capability.
7 CLMPI output Internal active Miller clamp output (4A maximum) connected to power transistor gate.
8 VEE power_in Negative supply rail for isolated gate drive voltage stage.
9 GND power_in Input-side ground reference for power and control logic.
10 IN+ input Non-inverting gate driver control input with logic thresholds 0 to 0.3×VCC (low) and 0.7×VCC to VCC (high).
11 IN- input Inverting gate driver control input with logic thresholds 0 to 0.3×VCC (low) and 0.7×VCC to VCC (high).
12 RDY output Power-good output indicating VCC-GND and VDD-COM readiness in open-drain configuration.
13 FLT output Active-low fault alarm output for over-current or short-circuit conditions in open-drain configuration.
14 RST/EN input Reset/Enable input providing output shutdown and fault reset with 1000ns minimum pulse width.
15 VCC power_in Input-side power supply (3V to 5.5V) for control logic stage.
16 APWM output Isolated analog-to-PWM sensing output for temperature or voltage conversion.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16-300mil
Category Power Management (PMIC)
Pins 16

CAD (KiCad official)

  • Symbol: UCC21710DWR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: ucc21710dwr-etched.step / ucc21710dwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ucc21710dwr.step / ucc21710dwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (55 pp, sha256 c020d4f4b287e499, retrieved 2026-10-07, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF