TPS54427DDAR

{
 "schema": "adom.pads/1",
 "slug": "tps54427ddar",
 "footprint": "TI_SO-PowerPAD-8",
 "generated_from": {
  "footprint": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.78,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 0,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "EN",
   "type": "input",
   "description": "Enable input control. Active high; must be pulled up to enable the device. VIH ≥ 1.6 V, VIL ≤ 0.6 V. Internal ~450 kΩ pull-down to GND (225-900 kΩ). Absolute max −0.3 to 20 V.",
   "is_pin1": true,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "VFB",
   "type": "input",
   "description": "Converter feedback input. Connect to the output voltage via a resistor divider to set VOUT. Internal reference (VFBTH) is 765 mV typ (757-773 mV at 25 °C). Input current ±0.1 µA max.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "VREG5",
   "type": "power_out",
   "description": "5.5 V internal LDO power supply output (5.2-5.7 V, up to 60 mA). Bypass with a ~1 µF capacitor to GND. Not active when EN is low. Also feeds internal gate drive.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "SS",
   "type": "input",
   "description": "Soft-start control. Connect an external capacitor from SS to GND to program the soft-start ramp time. Absolute max −0.3 to 6.5 V.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "GND",
   "type": "power_in",
   "description": "Ground pin. Power ground return for the switching circuit. Sensitive SS and VFB returns must be tied to GND at a single point.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "SW",
   "type": "power_out",
   "description": "Switch node between the high-side NFET (drain of low-side, source of high-side). Connect to the output inductor. Absolute max −2 to 20 V (−3 to 22 V for 10 ns transients).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "VBST",
   "type": "power_in",
   "description": "Bootstrap supply for the high-side FET gate driver. Connect a 0.1 µF capacitor between VBST and SW. An internal diode is connected between VREG5 and VBST for charging. VBST(vs SW) max 6 V.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "VIN",
   "type": "power_in",
   "description": "Input voltage supply pin. Operating range 4.5 V to 18 V (absolute max 20 V). Bypass with ceramic capacitance close to the pin.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -0.6025,
    -0.775
   ],
   "rot": 0.0,
   "size": [
    1.205,
    1.55
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "9",
   "name": "PowerPAD",
   "type": "power_in",
   "description": "Exposed thermal pad on the underside. Must be soldered to the PCB ground plane for proper thermal dissipation and must be electrically connected to GND.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}