TPS54335ADDAR

{
 "schema": "adom.pads/1",
 "slug": "tps54335addar",
 "footprint": "TI_SO-PowerPAD-8",
 "generated_from": {
  "footprint": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.78,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 0,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "BOOT",
   "type": "output",
   "description": "Bootstrap capacitor node for the high-side MOSFET gate driver. A bootstrap capacitor is required between BOOT and PH. If the BOOT-PH voltage falls below the BOOT-PH UVLO (~2.1-3 V), switching is inhibited until the capacitor is refreshed.",
   "is_pin1": true,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "VIN",
   "type": "power_in",
   "description": "Supply input voltage, 4.5 V to 28 V (30 V abs max). Bypass with a low-ESR ceramic capacitor placed close to the VIN and GND pins.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "PH",
   "type": "output",
   "description": "Switch node (source of the internal high-side power MOSFET / drain of the low-side MOSFET). Connect to the output inductor and to the low side of the bootstrap capacitor. Rated -1 V to 30 V (-3.5 V for 10 ns transients).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "GND",
   "type": "power_in",
   "description": "Device ground. Must be tied to the exposed PowerPAD for proper operation and thermal performance.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "VSENSE",
   "type": "input",
   "description": "Inverting input of the transconductance (gm) error amplifier. Connect to the feedback resistor divider from VOUT; the internal reference is 0.8 V (±0.8%).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "COMP",
   "type": "output",
   "description": "Error-amplifier output and input to the output switch current comparator. Connect frequency-compensation network (R-C, optional C) to GND to set loop response.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "EN",
   "type": "input",
   "description": "Enable input. Float to enable (internal pull-up). Enable threshold typ 1.21 V rising / 1.17 V falling. Can be driven by a resistor divider from VIN to program a precision input UVLO.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "RT",
   "type": "input",
   "description": "Switching-frequency programming pin. Connect an external resistor from RT to GND to set the switching frequency (50 kHz to 1.5 MHz; e.g. ~480 kHz with 100 kΩ).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -0.6025,
    -0.775
   ],
   "rot": 0.0,
   "size": [
    1.205,
    1.55
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "9",
   "name": "PowerPAD",
   "type": "power_in",
   "description": "Exposed thermal pad on the underside of the package. Must be soldered to the PCB and connected to GND (pin 4) with multiple thermal vias to a ground plane for correct operation and thermal dissipation.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}