← Commit history

footprint + symbol: give this part its thermal pad. It shipped SOIC-8_3.9x4.9mm_P1.27mm, which has no exposed pad at all - datasheet lists 9 pads against 8 leads, so the ninth is the thermal pad, and the page's own package string is SOP-8-EP-150mil; TI's own SO PowerPAD-8 land. Swapping the land alone would have left pad 9 floating, so the symbol gets a pin on it and page.json is renumbered from "PAD" to match. The 3D body is unchanged: the leads and package outline are identical, only the underside pad is added.

Ray ·519084563d · ·parent 5f8a3c4
5 files changed +398−388
pads.json+78−54
@@ -1,23 +1,23 @@ {  "schema": "adom.pads/1",  "slug": "tps54335addar",- "footprint": "SOIC-8_3.9x4.9mm_P1.27mm",+ "footprint": "TI_SO-PowerPAD-8",  "generated_from": {-  "footprint": "SOIC-8_3.9x4.9mm_P1.27mm@sha256:074ecb2092b24fa4",+  "footprint": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404",   "pins": "page.json:component.pins",   "overrides": null  },  "pin1": {   "pad": "1",   "at": [-   -2.475,+   -2.78,    -1.905   ],   "corner": "top-left",   "source": "silk-marker",-  "derived_from": "SOIC-8_3.9x4.9mm_P1.27mm@sha256:074ecb2092b24fa4"+  "derived_from": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404"  },- "pad_count": 8,+ "pad_count": 9,  "symbol_pins": [   "1",   "2",@@ -26,30 +26,24 @@   "5",   "6",   "7",-  "8"+  "8",+  "9"  ],  "paste_apertures": 0,- "issues": [-  {-   "kind": "pin-not-in-symbol",-   "pin": "PAD",-   "name": "PowerPAD",-   "detail": "page.json describes pin \"PAD\" (PowerPAD) from the datasheet, but the symbol has no such pin, so nothing can connect to it"-  }- ],+ "issues": [],  "pads": [   {    "pad": "1",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    -2.475,+    -2.78,     -1.905    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -63,7 +57,7 @@    "description": "Bootstrap capacitor node for the high-side MOSFET gate driver. A bootstrap capacitor is required between BOOT and PH. If the BOOT-PH voltage falls below the BOOT-PH UVLO (~2.1-3 V), switching is inhibited until the capacitor is refreshed.",    "is_pin1": true,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -71,15 +65,15 @@   {    "pad": "2",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    -2.475,+    -2.78,     -0.635    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -93,7 +87,7 @@    "description": "Supply input voltage, 4.5 V to 28 V (30 V abs max). Bypass with a low-ESR ceramic capacitor placed close to the VIN and GND pins.",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -101,15 +95,15 @@   {    "pad": "3",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    -2.475,+    -2.78,     0.635    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -123,7 +117,7 @@    "description": "Switch node (source of the internal high-side power MOSFET / drain of the low-side MOSFET). Connect to the output inductor and to the low side of the bootstrap capacitor. Rated -1 V to 30 V (-3.5 V for 10 ns transients).",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -131,15 +125,15 @@   {    "pad": "4",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    -2.475,+    -2.78,     1.905    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -153,7 +147,7 @@    "description": "Device ground. Must be tied to the exposed PowerPAD for proper operation and thermal performance.",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -161,15 +155,15 @@   {    "pad": "5",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    2.475,+    2.78,     1.905    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -183,7 +177,7 @@    "description": "Inverting input of the transconductance (gm) error amplifier. Connect to the feedback resistor divider from VOUT; the internal reference is 0.8 V (±0.8%).",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -191,15 +185,15 @@   {    "pad": "6",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    2.475,+    2.78,     0.635    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -213,7 +207,7 @@    "description": "Error-amplifier output and input to the output switch current comparator. Connect frequency-compensation network (R-C, optional C) to GND to set loop response.",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -221,15 +215,15 @@   {    "pad": "7",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    2.475,+    2.78,     -0.635    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -243,7 +237,7 @@    "description": "Enable input. Float to enable (internal pull-up). Enable threshold typ 1.21 V rising / 1.17 V falling. Can be driven by a resistor divider from VIN to program a precision input UVLO.",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }@@ -251,15 +245,15 @@   {    "pad": "8",    "kind": "smd",-   "shape": "roundrect",+   "shape": "rect",    "at": [-    2.475,+    2.78,     -1.905    ],    "rot": 0.0,    "size": [-    1.95,-    0.6+    1.91,+    0.61    ],    "layers": [     "F.Cu",@@ -273,7 +267,37 @@    "description": "Switching-frequency programming pin. Connect an external resistor from RT to GND to set the switching frequency (50 kHz to 1.5 MHz; e.g. ~480 kHz with 100 kΩ).",    "is_pin1": false,    "source": {-    "geometry": "SOIC-8_3.9x4.9mm_P1.27mm.kicad_mod",+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",+    "meaning": "page.json:component.pins",+    "correspondence": "kicad: symbol pin number == pad name"+   }+  },+  {+   "pad": "9",+   "kind": "smd",+   "shape": "rect",+   "at": [+    -0.6025,+    -0.775+   ],+   "rot": 0.0,+   "size": [+    1.205,+    1.55+   ],+   "layers": [+    "F.Cu",+    "F.Mask",+    "F.Paste"+   ],+   "thermal": false,+   "pin": "9",+   "name": "PowerPAD",+   "type": "power_in",+   "description": "Exposed thermal pad on the underside of the package. Must be soldered to the PCB and connected to GND (pin 4) with multiple thermal vias to a ground plane for correct operation and thermal dissipation.",+   "is_pin1": false,+   "source": {+    "geometry": "TI_SO-PowerPAD-8.kicad_mod",     "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }
page.json+1−1
@@ -79,7 +79,7 @@         "description": "Switching-frequency programming pin. Connect an external resistor from RT to GND to set the switching frequency (50 kHz to 1.5 MHz; e.g. ~480 kHz with 100 k\u03a9)."       },       {-        "number": "PAD",+        "number": "9",         "name": "PowerPAD",         "type": "power_in",         "description": "Exposed thermal pad on the underside of the package. Must be soldered to the PCB and connected to GND (pin 4) with multiple thermal vias to a ground plane for correct operation and thermal dissipation."
tps54335addar.kicad_mod+280−300
@@ -1,300 +1,280 @@-(footprint "SOIC-8_3.9x4.9mm_P1.27mm"-	(version 20260206)-	(generator "kicad-footprint-generator")-	(layer "F.Cu")-	(descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)")-	(tags "SOIC SO")-	(property "Reference" "REF**"-		(at 0 -3.4 0)-		(layer "F.SilkS")-		(effects-			(font-				(size 1 1)-				(thickness 0.15)-			)-		)-	)-	(property "Value" "SOIC-8_3.9x4.9mm_P1.27mm"-		(at 0 3.4 0)-		(layer "F.Fab")-		(effects-			(font-				(size 1 1)-				(thickness 0.15)-			)-		)-	)-	(property "KiLib_Generator" "package/gullwing"-		(at 0 0 0)-		(layer "F.SilkS")-		(hide yes)-		(effects-			(font-				(size 1 1)-				(thickness 0.15)-			)-		)-	)-	(attr smd)-	(duplicate_pad_numbers_are_jumpers no)-	(fp_line-		(start -2.06 -2.56)-		(end 2.06 -2.56)-		(stroke-			(width 0.12)-			(type solid)-		)-		(layer "F.SilkS")-	)-	(fp_line-		(start -2.06 -2.465)-		(end -2.06 -2.56)-		(stroke-			(width 0.12)-			(type solid)-		)-		(layer "F.SilkS")-	)-	(fp_line-		(start -2.06 2.56)-		(end -2.06 2.465)-		(stroke-			(width 0.12)-			(type solid)-		)-		(layer "F.SilkS")-	)-	(fp_line-		(start 2.06 -2.56)-		(end 2.06 -2.465)-		(stroke-			(width 0.12)-			(type solid)-		)-		(layer "F.SilkS")-	)-	(fp_line-		(start 2.06 2.465)-		(end 2.06 2.56)-		(stroke-			(width 0.12)-			(type solid)-		)-		(layer "F.SilkS")-	)-	(fp_line-		(start 2.06 2.56)-		(end -2.06 2.56)-		(stroke-			(width 0.12)-			(type solid)-		)-		(layer "F.SilkS")-	)-	(fp_poly-		(pts-			(xy -2.6 -2.47)-			(xy -2.84 -2.8)-			(xy -2.36 -2.8)-		)-		(stroke-			(width 0.12)-			(type solid)-		)-		(fill yes)-		(layer "F.SilkS")-	)-	(fp_line-		(start -3.7 -2.46)-		(end -2.2 -2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start -3.7 2.46)-		(end -3.7 -2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start -2.2 -2.7)-		(end 2.2 -2.7)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start -2.2 -2.46)-		(end -2.2 -2.7)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start -2.2 2.46)-		(end -3.7 2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start -2.2 2.7)-		(end -2.2 2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start 2.2 -2.7)-		(end 2.2 -2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start 2.2 -2.46)-		(end 3.7 -2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start 2.2 2.46)-		(end 2.2 2.7)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start 2.2 2.7)-		(end -2.2 2.7)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start 3.7 -2.46)-		(end 3.7 2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_line-		(start 3.7 2.46)-		(end 2.2 2.46)-		(stroke-			(width 0.05)-			(type solid)-		)-		(layer "F.CrtYd")-	)-	(fp_poly-		(pts-			(xy -0.975 -2.45)-			(xy 1.95 -2.45)-			(xy 1.95 2.45)-			(xy -1.95 2.45)-			(xy -1.95 -1.475)-		)-		(stroke-			(width 0.1)-			(type solid)-		)-		(fill no)-		(layer "F.Fab")-	)-	(fp_text user "${REFERENCE}"-		(at 0 0 90)-		(layer "F.Fab")-		(effects-			(font-				(size 1 1)-				(thickness 0.15)-			)-		)-	)-	(pad "1" smd roundrect-		(at -2.475 -1.905)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "2" smd roundrect-		(at -2.475 -0.635)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "3" smd roundrect-		(at -2.475 0.635)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "4" smd roundrect-		(at -2.475 1.905)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "5" smd roundrect-		(at 2.475 1.905)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "6" smd roundrect-		(at 2.475 0.635)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "7" smd roundrect-		(at 2.475 -0.635)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(pad "8" smd roundrect-		(at 2.475 -1.905)-		(size 1.95 0.6)-		(layers "F.Cu" "F.Mask" "F.Paste")-		(roundrect_rratio 0.25)-	)-	(embedded_fonts no)-	(model "${KICAD10_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.step"-		(offset-			(xyz 0 0 0)-		)-		(scale-			(xyz 1 1 1)-		)-		(rotate-			(xyz 0 0 0)-		)-	)-)+(footprint "TI_SO-PowerPAD-8"
+	(version 20260206)
+	(generator "pcbnew")
+	(generator_version "10.0")
+	(layer "F.Cu")
+	(descr "8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)")
+	(tags "SSOP 0.50 exposed pad")
+	(property "Reference" "REF**"
+		(at 0 -3.3 0)
+		(layer "F.SilkS")
+		(uuid "76dfc6c2-dfba-41cf-b88f-87c5ccaab587")
+		(effects
+			(font
+				(size 1 1)
+				(thickness 0.15)
+			)
+		)
+	)
+	(property "Value" "TI_SO-PowerPAD-8"
+		(at 0 3.4 0)
+		(layer "F.Fab")
+		(uuid "4b0263c7-71f9-47e7-ba94-03b8e537a06b")
+		(effects
+			(font
+				(size 1 1)
+				(thickness 0.15)
+			)
+		)
+	)
+	(property "Datasheet" ""
+		(at 0 0 0)
+		(unlocked yes)
+		(layer "F.Fab")
+		(hide yes)
+		(uuid "533fa938-d50a-4260-91b6-4a55c8157fff")
+		(effects
+			(font
+				(size 1.27 1.27)
+				(thickness 0.15)
+			)
+		)
+	)
+	(property "Description" ""
+		(at 0 0 0)
+		(unlocked yes)
+		(layer "F.Fab")
+		(hide yes)
+		(uuid "28160df4-76fa-4b39-9c76-594622ad081d")
+		(effects
+			(font
+				(size 1.27 1.27)
+				(thickness 0.15)
+			)
+		)
+	)
+	(clearance 0.2)
+	(attr smd)
+	(duplicate_pad_numbers_are_jumpers no)
+	(fp_line
+		(start -2.075 -2.575)
+		(end 2.075 -2.575)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.SilkS")
+		(uuid "952a71c7-019c-40f7-bf87-f24eae523d67")
+	)
+	(fp_line
+		(start -2.075 2.575)
+		(end 2.075 2.575)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.SilkS")
+		(uuid "6b05a05d-1e24-4f64-af17-b31d94eb6a2f")
+	)
+	(fp_poly
+		(pts
+			(xy -2.5 -2.5) (xy -2.74 -2.83) (xy -2.26 -2.83) (xy -2.5 -2.5)
+		)
+		(stroke
+			(width 0.12)
+			(type solid)
+		)
+		(fill yes)
+		(layer "F.SilkS")
+		(uuid "e764276f-5831-4407-be23-fb8585d473c2")
+	)
+	(fp_line
+		(start -4 -2.7)
+		(end -4 2.7)
+		(stroke
+			(width 0.05)
+			(type solid)
+		)
+		(layer "F.CrtYd")
+		(uuid "468b4d46-891a-4ac2-be39-645979c5658a")
+	)
+	(fp_line
+		(start -4 -2.7)
+		(end 4 -2.7)
+		(stroke
+			(width 0.05)
+			(type solid)
+		)
+		(layer "F.CrtYd")
+		(uuid "09958cc5-9034-4eb0-8bf6-bb2c27be24c4")
+	)
+	(fp_line
+		(start -4 2.7)
+		(end 4 2.7)
+		(stroke
+			(width 0.05)
+			(type solid)
+		)
+		(layer "F.CrtYd")
+		(uuid "14497c76-5084-479d-903a-be55f3e82e9e")
+	)
+	(fp_line
+		(start 4 -2.7)
+		(end 4 2.7)
+		(stroke
+			(width 0.05)
+			(type solid)
+		)
+		(layer "F.CrtYd")
+		(uuid "d15c6388-0087-4858-97af-c09a653e939d")
+	)
+	(fp_line
+		(start -1.95 -1.45)
+		(end -0.95 -2.45)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.Fab")
+		(uuid "3bc1ea76-3cdc-4a8a-815b-9a529ecae57c")
+	)
+	(fp_line
+		(start -1.95 2.45)
+		(end -1.95 -1.45)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.Fab")
+		(uuid "3091f91f-77fa-49ba-b835-9237e3dcd2a6")
+	)
+	(fp_line
+		(start -0.95 -2.45)
+		(end 1.95 -2.45)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.Fab")
+		(uuid "9002ccf2-8a60-45dc-972f-12aa0bd077fb")
+	)
+	(fp_line
+		(start 1.95 -2.45)
+		(end 1.95 2.45)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.Fab")
+		(uuid "4de21e3c-3f89-4f09-8840-613afff96693")
+	)
+	(fp_line
+		(start 1.95 2.45)
+		(end -1.95 2.45)
+		(stroke
+			(width 0.15)
+			(type solid)
+		)
+		(layer "F.Fab")
+		(uuid "66022c8a-1ea6-4c46-bf25-f418961567a0")
+	)
+	(fp_text user "${REFERENCE}"
+		(at 0 0 0)
+		(layer "F.Fab")
+		(uuid "3771af48-88aa-43ef-9adf-0247ae1807cc")
+		(effects
+			(font
+				(size 1 1)
+				(thickness 0.15)
+			)
+		)
+	)
+	(pad "1" smd rect
+		(at -2.78 -1.905)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "87aefb81-aa1b-47a5-87be-b6ac3fc76547")
+	)
+	(pad "2" smd rect
+		(at -2.78 -0.635)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "2f750416-bf17-4e39-b3bb-f85aa440fd50")
+	)
+	(pad "3" smd rect
+		(at -2.78 0.635)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "36f210d4-850a-42fb-b0e1-65ec6930f597")
+	)
+	(pad "4" smd rect
+		(at -2.78 1.905)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "2d2d8909-917d-4c80-a158-fe3311de7da1")
+	)
+	(pad "5" smd rect
+		(at 2.78 1.905)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "ef9095bf-950e-419f-8852-21dca4fa715a")
+	)
+	(pad "6" smd rect
+		(at 2.78 0.635)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "1a4a214d-2061-4619-b7c0-31242f4641e8")
+	)
+	(pad "7" smd rect
+		(at 2.78 -0.635)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "0cee3308-3b50-4aaa-9e72-edc792efa845")
+	)
+	(pad "8" smd rect
+		(at 2.78 -1.905)
+		(size 1.91 0.61)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(uuid "6ada3559-739a-4e69-8922-5f46c3837109")
+	)
+	(pad "9" smd rect
+		(at -0.6025 -0.775)
+		(size 1.205 1.55)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(solder_paste_margin_ratio -0.2)
+		(uuid "3dea7421-f9dd-424c-a2f4-f2900864096f")
+	)
+	(pad "9" smd rect
+		(at -0.6025 0.775)
+		(size 1.205 1.55)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(solder_paste_margin_ratio -0.2)
+		(uuid "73b9759e-a7a0-4881-8dc1-dcebc919dddd")
+	)
+	(pad "9" smd rect
+		(at 0.6025 -0.775)
+		(size 1.205 1.55)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(solder_paste_margin_ratio -0.2)
+		(uuid "6bd4be4a-30c5-4811-8705-2d3173d4b547")
+	)
+	(pad "9" smd rect
+		(at 0.6025 0.775)
+		(size 1.205 1.55)
+		(layers "F.Cu" "F.Mask" "F.Paste")
+		(solder_paste_margin_ratio -0.2)
+		(uuid "c56f497b-0492-4bef-93d8-3e34169b3252")
+	)
+	(embedded_fonts no)
+	(model "${KICAD10_3DMODEL_DIR}/Package_SO.3dshapes/TI_SO-PowerPAD-8.step"
+		(offset
+			(xyz 0 0 0)
+		)
+		(scale
+			(xyz 1 1 1)
+		)
+		(rotate
+			(xyz 0 0 0)
+		)
+	)
+)
tps54335addar.kicad_sym+4
@@ -40,6 +40,10 @@       (name "VSENSE" (effects (font (size 1.27 1.27))))       (number "5" (effects (font (size 1.27 1.27))))     )+			(pin power_in line (at -17.78 -7.62 0) (length 5.08)+				(name "PowerPAD" (effects (font (size 1.27 1.27))))+				(number "9" (effects (font (size 1.27 1.27))))+			)     )   ) )
tps54335addar.lbr+35−33
@@ -50,48 +50,48 @@ <layer number="98" name="Guide" color="6" fill="1" visible="yes" active="yes"/> </layers> <library>-<description></description>+<description>Texas Instruments DC-DC Converters, SOP-8-EP-150mil</description> <packages>-<package name="TPS54335ADDAR">-  <description>TPS54335ADDAR</description>-  <smd name="1" x="-2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="2" x="-2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="3" x="-2.4750" y="-0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="4" x="-2.4750" y="-1.9050" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="5" x="2.4750" y="-1.9050" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="6" x="2.4750" y="-0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="7" x="2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="8" x="2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1"/>+<package name="TI_SO-PowerPAD-8">+  <description>12 pads, 7.5 x 4.4 mm. 8-Lead Plastic PSOP, Exposed Die Pad</description>+  <smd name="1" x="-2.7800" y="1.9050" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="2" x="-2.7800" y="0.6350" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="3" x="-2.7800" y="-0.6350" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="4" x="-2.7800" y="-1.9050" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="5" x="2.7800" y="-1.9050" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="6" x="2.7800" y="-0.6350" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="7" x="2.7800" y="0.6350" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="8" x="2.7800" y="1.9050" dx="1.9100" dy="0.6100" layer="1"/>+  <smd name="9" x="-0.6025" y="0.7750" dx="1.2050" dy="1.5500" layer="1"/>+  <smd name="9@2" x="-0.6025" y="-0.7750" dx="1.2050" dy="1.5500" layer="1"/>+  <smd name="9@3" x="0.6025" y="0.7750" dx="1.2050" dy="1.5500" layer="1"/>+  <smd name="9@4" x="0.6025" y="-0.7750" dx="1.2050" dy="1.5500" layer="1"/>   <polygon width="0.1200" layer="21">-    <vertex x="-2.6000" y="2.4700"/>-    <vertex x="-2.8400" y="2.8000"/>-    <vertex x="-2.3600" y="2.8000"/>+    <vertex x="-2.5000" y="2.5000"/>+    <vertex x="-2.7400" y="2.8300"/>+    <vertex x="-2.2600" y="2.8300"/>+    <vertex x="-2.5000" y="2.5000"/>   </polygon>-  <polygon width="0.1000" layer="51">-    <vertex x="-0.9750" y="2.4500"/>-    <vertex x="1.9500" y="2.4500"/>-    <vertex x="1.9500" y="-2.4500"/>-    <vertex x="-1.9500" y="-2.4500"/>-    <vertex x="-1.9500" y="1.4750"/>-  </polygon>-  <wire x1="-2.0600" y1="2.5600" x2="2.0600" y2="2.5600" width="0.1200" layer="21"/>-  <wire x1="-2.0600" y1="2.4650" x2="-2.0600" y2="2.5600" width="0.1200" layer="21"/>-  <wire x1="-2.0600" y1="-2.5600" x2="-2.0600" y2="-2.4650" width="0.1200" layer="21"/>-  <wire x1="2.0600" y1="2.5600" x2="2.0600" y2="2.4650" width="0.1200" layer="21"/>-  <wire x1="2.0600" y1="-2.4650" x2="2.0600" y2="-2.5600" width="0.1200" layer="21"/>-  <wire x1="2.0600" y1="-2.5600" x2="-2.0600" y2="-2.5600" width="0.1200" layer="21"/>-  <text x="0" y="3.480" size="1.27" layer="25" align="bottom-center">&gt;NAME</text>-  <text x="0" y="-3.480" size="1.27" layer="27" align="top-center">&gt;VALUE</text>+  <wire x1="-2.0750" y1="2.5750" x2="2.0750" y2="2.5750" width="0.1500" layer="21"/>+  <wire x1="-2.0750" y1="-2.5750" x2="2.0750" y2="-2.5750" width="0.1500" layer="21"/>+  <wire x1="-1.9500" y1="1.4500" x2="-0.9500" y2="2.4500" width="0.1500" layer="51"/>+  <wire x1="-1.9500" y1="-2.4500" x2="-1.9500" y2="1.4500" width="0.1500" layer="51"/>+  <wire x1="-0.9500" y1="2.4500" x2="1.9500" y2="2.4500" width="0.1500" layer="51"/>+  <wire x1="1.9500" y1="2.4500" x2="1.9500" y2="-2.4500" width="0.1500" layer="51"/>+  <wire x1="1.9500" y1="-2.4500" x2="-1.9500" y2="-2.4500" width="0.1500" layer="51"/>+  <text x="0" y="3.460" size="1.27" layer="25" align="bottom-center">&gt;NAME</text>+  <text x="0" y="-3.460" size="1.27" layer="27" align="top-center">&gt;VALUE</text> </package> </packages> <symbols> <symbol name="TPS54335ADDAR">+  <description>Texas Instruments DC-DC Converters, SOP-8-EP-150mil</description>   <wire x1="-12.7" y1="5.08" x2="12.7" y2="5.08" width="0.254" layer="94"/>   <wire x1="12.7" y1="5.08" x2="12.7" y2="-7.62" width="0.254" layer="94"/>   <wire x1="12.7" y1="-7.62" x2="-12.7" y2="-7.62" width="0.254" layer="94"/>   <wire x1="-12.7" y1="-7.62" x2="-12.7" y2="5.08" width="0.254" layer="94"/>-  <text x="0" y="7.62" size="1.27" layer="95" align="bottom-center">&gt;NAME</text>-  <text x="0" y="-10.16" size="1.27" layer="96" align="top-center">&gt;VALUE</text>+  <text x="0.0000" y="7.6200" size="1.27" layer="95" align="center">&gt;NAME</text>+  <text x="0.0000" y="-10.1600" size="1.27" layer="96" align="center">&gt;VALUE</text>   <pin name="BOOT" x="-17.78" y="2.54" length="middle" direction="out"/>   <pin name="VIN" x="-17.78" y="0" length="middle" direction="pwr"/>   <pin name="PH" x="-17.78" y="-2.54" length="middle" direction="out"/>@@ -100,16 +100,17 @@   <pin name="EN" x="17.78" y="0" length="middle" direction="in" rot="R180"/>   <pin name="COMP" x="17.78" y="-2.54" length="middle" direction="out" rot="R180"/>   <pin name="VSENSE" x="17.78" y="-5.08" length="middle" direction="in" rot="R180"/>+  <pin name="PowerPAD" x="-17.78" y="-7.62" length="middle" direction="pwr"/> </symbol> </symbols> <devicesets> <deviceset name="TPS54335ADDAR" prefix="U">-  <description></description>+  <description>Texas Instruments DC-DC Converters, SOP-8-EP-150mil</description>   <gates>     <gate name="G$1" symbol="TPS54335ADDAR" x="0" y="0"/>   </gates>   <devices>-    <device name="" package="TPS54335ADDAR">+    <device name="" package="TI_SO-PowerPAD-8">       <connects>         <connect gate="G$1" pin="BOOT" pad="1"/>         <connect gate="G$1" pin="VIN" pad="2"/>@@ -119,6 +120,7 @@         <connect gate="G$1" pin="EN" pad="7"/>         <connect gate="G$1" pin="COMP" pad="6"/>         <connect gate="G$1" pin="VSENSE" pad="5"/>+        <connect gate="G$1" pin="PowerPAD" pad="9 9@2 9@3 9@4"/>       </connects>       <technologies>         <technology name="">