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TPA751DGNR

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Texas Instruments Audio Amplifiers, HVSSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TPA751DGNR

Texas Instruments · Audio Amplifiers · HVSSOP-8-EP

TPA751DGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHUTDOWN input SHUTDOWN places the entire device in shutdown mode when held low (IDD = 1.5 nA); the high-level input is 0.9VDD minimum and the low-level input is 0.1VDD maximum.
2 BYPASS input BYPASS is the tap to the voltage divider for internal mid-supply bias and should be connected to a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier.
3 IN+ input IN+ is the noninverting input and is typically tied to the BYPASS terminal for single-ended (SE) input.
4 IN− input IN− is the inverting input and is typically used as the audio input terminal.
5 VO+ output VO+ is the positive bridge-tied load (BTL) audio output.
6 VDD power_in VDD is the supply voltage terminal, with a recommended operating range of 2.5 V to 5.5 V and an absolute maximum of 6 V.
7 GND power_in GND is the ground connection.
8 VO− output VO− is the negative bridge-tied load (BTL) audio output.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8-EP
Category Amplifiers/Comparators
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, VDD VDD 2.5 5.5 V 3
Operating free-air temperature, TA TA -40 85 °C 3
Supply voltage, VDD VDD 6 V 2
Input voltage, VI VI -0.3 V Upper limit printed as VDD + 0.3 V (not a numeric value) 2
Operating free-air temperature range, TA TA -40 85 °C 2
Operating junction temperature range, TJ TJ -40 150 °C 2
Storage temperature range, Tstg Tstg -65 150 °C 2
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 2
Supply current IDD 1.25 2.5 mA VDD = 3.3 V; SHUTDOWN = VDD, RF = 10 kΩ 3
Supply current, shutdown mode IDD(SD) 1.5 1000 nA VDD = 3.3 V; SHUTDOWN = 0 V, RF = 10 kΩ 3
SHUTDOWN input current high /IIH/ 1 µA VDD = 3.3 V; SHUTDOWN, Vi = VDD 3
SHUTDOWN input current low /IIL/ 1 µA VDD = 3.3 V; SHUTDOWN, Vi = 0 V 3
Output offset voltage (measured differentially) /VOS/ 20 mV VDD = 3.3 V; SHUTDOWN = VDD, RL = 8 Ω, RF = 10 kΩ 3
Power supply rejection ratio PSRR 85 dB VDD = 3.2 V to 3.4 V 3
Output power PO 250 mW VDD = 3.3 V, RL = 8 Ω; THD = 0.2%, See Figure 9 3
Total harmonic distortion plus noise THD+N 0.55 % VDD = 3.3 V; PO = 250 mW, f = 200 Hz to 4 kHz, See Figure 7 3
Maximum output power bandwidth BOM 20 kHz VDD = 3.3 V; AV = −2 V/V, THD = 2%, See Figure 7 3
Unity-gain bandwidth B1 1.4 MHz VDD = 3.3 V; Open loop, See Figure 15 3
Supply ripple rejection ratio kSVR 79 dB VDD = 3.3 V; f = 1 kHz, CB = 1 µF, See Figure 2 3
Noise output voltage Vn 17 µV(rms) VDD = 3.3 V; AV = −1 V/V, CB = 0.1 µF, See Figure 19 3
Power supply rejection ratio PSRR 78 dB VDD = 4.9 V to 5.1 V 3
Supply current IDD 1.45 2.5 mA VDD = 5 V; SHUTDOWN = VDD, RF = 10 kΩ 3
Supply current, shutdown mode IDD(SD) 5 1500 nA VDD = 5 V; SHUTDOWN = 0 V, RF = 10 kΩ 3
Output power PO 700 mW VDD = 5 V, RL = 8 Ω; THD = 0.5%, See Figure 13 3
Total harmonic distortion plus noise THD+N 0.5 % VDD = 5 V; PO = 250 mW, f = 200 Hz to 4 kHz, See Figure 11 3
Supply ripple rejection ratio kSVR 80 dB VDD = 5 V; f = 1 kHz, CB = 1 µF, See Figure 2 3
Continuous total power dissipation (DGN package) 2.14 W DGN package, TA = 25°C 2
DGN derating factor 17.1 mW/°C 2
Continuous total power dissipation (DGN package) 1.37 W DGN package, TA = 70°C 2
Continuous total power dissipation (DGN package) 1.11 W DGN package, TA = 85°C 2

CAD (KiCad official)

  • Symbol: TPA751DGNR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tpa751dgnr-etched.step / tpa751dgnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa751dgnr.step / tpa751dgnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 64a5df28bb743dbd, retrieved 2026-10-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF