# TPA751DGNR

**Texas Instruments** · Audio Amplifiers · HVSSOP-8-EP

TPA751DGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | SHUTDOWN places the entire device in shutdown mode when held low (IDD = 1.5 nA); the high-level input is 0.9VDD minimum and the low-level input is 0.1VDD maximum. |
| 2 | BYPASS | input | BYPASS is the tap to the voltage divider for internal mid-supply bias and should be connected to a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier. |
| 3 | IN+ | input | IN+ is the noninverting input and is typically tied to the BYPASS terminal for single-ended (SE) input. |
| 4 | IN− | input | IN− is the inverting input and is typically used as the audio input terminal. |
| 5 | VO+ | output | VO+ is the positive bridge-tied load (BTL) audio output. |
| 6 | VDD | power_in | VDD is the supply voltage terminal, with a recommended operating range of 2.5 V to 5.5 V and an absolute maximum of 6 V. |
| 7 | GND | power_in | GND is the ground connection. |
| 8 | VO− | output | VO− is the negative bridge-tied load (BTL) audio output. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8-EP |
| Category | Amplifiers/Comparators |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, VDD | VDD | 2.5 |  | 5.5 | V |  | 3 |
| Operating free-air temperature, TA | TA | -40 |  | 85 | °C |  | 3 |
| Supply voltage, VDD | VDD |  |  | 6 | V |  | 2 |
| Input voltage, VI | VI | -0.3 |  |  | V | Upper limit printed as VDD + 0.3 V (not a numeric value) | 2 |
| Operating free-air temperature range, TA | TA | -40 |  | 85 | °C |  | 2 |
| Operating junction temperature range, TJ | TJ | -40 |  | 150 | °C |  | 2 |
| Storage temperature range, Tstg | Tstg | -65 |  | 150 | °C |  | 2 |
| Lead temperature |  |  |  | 260 | °C | 1,6 mm (1/16 inch) from case for 10 seconds | 2 |
| Supply current | IDD |  | 1.25 | 2.5 | mA | VDD = 3.3 V; SHUTDOWN = VDD, RF = 10 kΩ | 3 |
| Supply current, shutdown mode | IDD(SD) |  | 1.5 | 1000 | nA | VDD = 3.3 V; SHUTDOWN = 0 V, RF = 10 kΩ | 3 |
| SHUTDOWN input current high | /IIH/ |  |  | 1 | µA | VDD = 3.3 V; SHUTDOWN, Vi = VDD | 3 |
| SHUTDOWN input current low | /IIL/ |  |  | 1 | µA | VDD = 3.3 V; SHUTDOWN, Vi = 0 V | 3 |
| Output offset voltage (measured differentially) | /VOS/ |  |  | 20 | mV | VDD = 3.3 V; SHUTDOWN = VDD, RL = 8 Ω, RF = 10 kΩ | 3 |
| Power supply rejection ratio | PSRR |  | 85 |  | dB | VDD = 3.2 V to 3.4 V | 3 |
| Output power | PO |  | 250 |  | mW | VDD = 3.3 V, RL = 8 Ω; THD = 0.2%, See Figure 9 | 3 |
| Total harmonic distortion plus noise | THD+N |  | 0.55 |  | % | VDD = 3.3 V; PO = 250 mW, f = 200 Hz to 4 kHz, See Figure 7 | 3 |
| Maximum output power bandwidth | BOM |  | 20 |  | kHz | VDD = 3.3 V; AV = −2 V/V, THD = 2%, See Figure 7 | 3 |
| Unity-gain bandwidth | B1 |  | 1.4 |  | MHz | VDD = 3.3 V; Open loop, See Figure 15 | 3 |
| Supply ripple rejection ratio | kSVR |  | 79 |  | dB | VDD = 3.3 V; f = 1 kHz, CB = 1 µF, See Figure 2 | 3 |
| Noise output voltage | Vn |  | 17 |  | µV(rms) | VDD = 3.3 V; AV = −1 V/V, CB = 0.1 µF, See Figure 19 | 3 |
| Power supply rejection ratio | PSRR |  | 78 |  | dB | VDD = 4.9 V to 5.1 V | 3 |
| Supply current | IDD |  | 1.45 | 2.5 | mA | VDD = 5 V; SHUTDOWN = VDD, RF = 10 kΩ | 3 |
| Supply current, shutdown mode | IDD(SD) |  | 5 | 1500 | nA | VDD = 5 V; SHUTDOWN = 0 V, RF = 10 kΩ | 3 |
| Output power | PO |  | 700 |  | mW | VDD = 5 V, RL = 8 Ω; THD = 0.5%, See Figure 13 | 3 |
| Total harmonic distortion plus noise | THD+N |  | 0.5 |  | % | VDD = 5 V; PO = 250 mW, f = 200 Hz to 4 kHz, See Figure 11 | 3 |
| Supply ripple rejection ratio | kSVR |  | 80 |  | dB | VDD = 5 V; f = 1 kHz, CB = 1 µF, See Figure 2 | 3 |
| Continuous total power dissipation (DGN package) |  |  | 2.14 |  | W | DGN package, TA = 25°C | 2 |
| DGN derating factor |  |  | 17.1 |  | mW/°C |  | 2 |
| Continuous total power dissipation (DGN package) |  |  | 1.37 |  | W | DGN package, TA = 70°C | 2 |
| Continuous total power dissipation (DGN package) |  |  | 1.11 |  | W | DGN package, TA = 85°C | 2 |

## CAD (KiCad official)

- Symbol: `TPA751DGNR`
- Footprint: `Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm`
- 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tpa751dgnr-etched.step` / `tpa751dgnr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpa751dgnr.step` / `tpa751dgnr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tpa751) (32 pp, sha256 `64a5df28bb743dbd`, retrieved 2026-10-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tpa751dgnr-datasheet.pdf)