TMC2262

{
 "mpn": "TMC2262AFV+",
 "package": "30L FC2QFN (6x6)",
 "ep": {
  "w_mm": 1.45,
  "h_mm": 4.05,
  "number": "EP",
  "name": "GND"
 },
 "via": {
  "drill_mm": 0.3,
  "pitch_mm": 0.7,
  "ring_mm": 0.15,
  "tented": true,
  "count": 10,
  "positions": [
   {
    "x_mm": -0.35,
    "y_mm": 1.4,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": 0.35,
    "y_mm": 1.4,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": -0.35,
    "y_mm": 0.7,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": 0.35,
    "y_mm": 0.7,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": -0.35,
    "y_mm": 0.0,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": 0.35,
    "y_mm": 0.0,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": -0.35,
    "y_mm": -0.7,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": 0.35,
    "y_mm": -0.7,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": -0.35,
    "y_mm": -1.4,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   },
   {
    "x_mm": 0.35,
    "y_mm": -1.4,
    "dia_mm": 0.6,
    "drill_mm": 0.3
   }
  ],
  "in_footprint": "plated thru_hole pads numbered EP (KiCad pad_prop_heatsink); adom-lbr carries them to Altium and Fusion",
  "hero_glb": {
   "layer": "vias",
   "node": "Adom.HeatsinkVias",
   "board_mm": 1.6,
   "alpha": 0.35
  }
 },
 "note": "The exposed die pad is GND for the power stage and internal circuitry; the data sheet asks for as many vias to the GND plane as possible (Pin Descriptions, page 16). The array shown follows the Adom heatsink-via rule (0.3 mm drill, tented) on a 0.7 mm grid so two columns fit the 1.45 mm pad; it is not an ADI figure; theta-JA 23 C/W assumes a four-layer board (page 15)."
}