main
History Download
Ray stb80nf10t4: specified limits as data (metadata.characteristics, 23 rows from the datasheet) 7ce8b92 25d ago

STB80NF10T4

STMicroelectronics · MOSFETs · D2PAK

STB80NF10T4 from STMicroelectronics, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate control terminal with ±20 V maximum gate-source voltage rating and 2-4 V gate threshold voltage
2 Drain passive Drain terminal rated for 80 A continuous drain current at 25 °C and 100 °C and maximum 100 V drain-source voltage
3 Source passive Source return terminal with integrated body diode having 1.3 V forward on-voltage at 80 A source-drain current

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package D2PAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage (VGS = 0) VDS 100 V VGS = 0 3
Gate-source voltage VGS -20 20 V 3
Drain current (continuous) ID 80 A TC = 25 °C; limited by package 3
Drain current (pulsed) IDM 320 A Pulse width limited by safe operating area 3
Total dissipation PTOT 300 W TC = 25 °C 3
Derating factor 2 W/°C 3
Peak diode recovery voltage slope dv/dt 7 V/ns ISD < 80 A, di/dt < 300 A/µs, VDD = 80% V(BR)DSS 3
Single pulse avalanche energy EAS 350 mJ Starting Tj = 25 °C, ID = 40 A, VDD = 50 V 3
Storage temperature Tstg -55 175 °C Shared value with Tj as printed: -55 to 175 3
Operating junction temperature Tj -55 175 °C Shared value with Tstg as printed: -55 to 175 3
Thermal resistance junction-case Rthj-case 0.5 °C/W 3
Thermal resistance junction-ambient Rthj-amb 62.5 °C/W 3
Maximum lead temperature for soldering Tl 300 °C For soldering purpose 3
Drain-source breakdown voltage V(BR)DSS 100 V ID = 250 µA, VGS = 0 4
Zero gate voltage drain current IDSS 500 nA VDS = Max rating 4
Zero gate voltage drain current IDSS 10 µA VDS = Max rating @125 °C 4
Gate-body leakage current IGSS -100 100 nA VDS = 0, VGS = ±20 V 4
Gate threshold voltage VGS(th) 2 3 4 V VDS = VGS, ID = 250 µA 4
Static drain-source on resistance RDS(on) 0.012 0.015 Ω VGS = 10 V, ID = 40 A 4
Total gate charge Qg 135 182 nC VDD = 50 V, ID = 80 A, VGS = 10 V 4
Source-drain current ISD 80 A 5
Source-drain current (pulsed) ISDM 320 A Pulse width limited by safe operating area 5
Forward on voltage VSD 1.3 V ISD = 80 A, VGS = 0; pulse duration = 300 µs, duty cycle 1.5% 5

CAD (KiCad official)

  • Symbol: STB80NF10T4
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: D2PAK (KiCad packages3D, STEP)
  • 3D model files: stb80nf10t4-etched.step / stb80nf10t4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stb80nf10t4.step / stb80nf10t4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (14 pp, sha256 d005f383bd70a5eb, retrieved 2026-09-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF