# PMV30UN2R

**Nexperia** · MOSFETs · SOT-23

PMV30UN2R from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel Trench MOSFET; the gate-source voltage is rated -12 V to 12 V (Table 5). |
| 2 | S | passive | Source terminal of the MOSFET; the source-drain diode source current is rated at 0.9 A at Tamb = 25 °C (Table 5). |
| 3 | D | passive | Drain terminal of the MOSFET; the drain-source voltage is rated 20 V maximum and the drain current 5.4 A maximum at VGS = 4.5 V, Tamb = 25 °C, t ≤ 5 s (Table 5). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS |  |  | 20 | V |  | 3 |
| Gate-source voltage | VGS | -12 |  | 12 | V | Tj = 25 °C | 3 |
| Drain current | ID |  |  | 5.4 | A | VGS = 4.5 V; Tamb = 25 °C; t ≤ 5 s [1] | 3 |
| Drain current | ID |  |  | 4.2 | A | VGS = 4.5 V; Tamb = 25 °C [1] | 3 |
| Drain current | ID |  |  | 2.7 | A | VGS = 4.5 V; Tamb = 100 °C [1] | 3 |
| Peak drain current | IDM |  |  | 18 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| Total power dissipation | Ptot |  |  | 490 | mW | Tamb = 25 °C [2] | 3 |
| Total power dissipation | Ptot |  |  | 1000 | mW | [1] | 3 |
| Total power dissipation | Ptot |  |  | 5000 | mW | Tsp = 25 °C | 3 |
| Junction temperature | Tj | -55 |  | 150 | °C |  | 3 |
| Ambient temperature | Tamb | -55 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Source current (source-drain diode) | IS |  |  | 0.9 | A | Tamb = 25 °C [1] | 3 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 217 | 255 | K/W | in free air [1]; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 105 | 124 | K/W | [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 | 4 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 73 | 86 | K/W | t ≤ 5 s [2] | 4 |
| Thermal resistance from junction to solder point | Rth(j-sp) |  | 20 | 25 | K/W |  | 5 |
| Drain-source breakdown voltage | V(BR)DSS | 20 |  |  | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 |
| Gate-source threshold voltage | VGSth | 0.4 | 0.65 | 0.9 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS |  |  | 1 | µA | VDS = 20 V; VGS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | 100 | nA | VGS = 12 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | -100 | nA | VGS = -12 V; VDS = 0 V; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 24 | 32 | mΩ | VGS = 4.5 V; ID = 4.2 A; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 37 | 50 | mΩ | VGS = 4.5 V; ID = 4.2 A; Tj = 150 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 30 | 43 | mΩ | VGS = 2.5 V; ID = 3.7 A; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 40 | 59 | mΩ | VGS = 1.8 V; ID = 1.0 A; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 56 | 100 | mΩ | VGS = 1.5 V; ID = 0.1 A; Tj = 25 °C | 6 |
| Total gate charge | QG(tot) |  | 6.2 | 11 | nC | VDS = 10 V; ID = 4.2 A; VGS = 4.5 V; Tj = 25 °C (shared test block) | 6 |
| Source-drain voltage | VSD |  | 0.7 | 1.2 | V | IS = 0.9 A; VGS = 0 V; Tj = 25 °C | 6 |

## CAD (KiCad official)

- Symbol: `PMV30UN2R`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `pmv30un2r-etched.step` / `pmv30un2r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `pmv30un2r.step` / `pmv30un2r.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8564411157659209728) (15 pp, sha256 `d74a8cbfb67de8bc`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/pmv30un2r-datasheet.pdf)