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NCP1632DR2G

onsemi · AC-DC Controllers And Regulators · SOIC-16

NCP1632DR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ZCD2 input Zero current detection input for phase 2 that monitors an auxiliary winding to detect inductor core reset and the MOSFET drain-source voltage valley, with a rising threshold of 0.50 V typical and an input clamp of 11 V typical at 5 mA.
2 FB input Receives a portion of the PFC stage output voltage for regulation and is also monitored by the dynamic response enhancer, which speeds up loop response when the output voltage drops below 95.5 % of the set level.
3 RT passive The resistor placed between this pin and ground sets the maximum on-time in both phases and therefore the maximum power the PFC stage can deliver.
4 OSC passive Oscillator pin that sets the maximum switching frequency, particularly in medium- and light-load conditions when frequency foldback is engaged.
5 VCONTROL passive Error amplifier output used for loop compensation, where the capacitor and resistor to ground set the regulation bandwidth, typically below 20 Hz, and the pin is grounded when the circuit is off for soft-start.
6 FFOLD passive Sources a current proportional to the input current, and a resistor and capacitor from this pin to GND produce the voltage representing line current magnitude used for frequency foldback.
7 BO input Brown-out input that receives an averaged portion of the input voltage; when VBO drops below 1 V (1.00 V typical threshold) the circuit stops pulsing after a 500 ms internal blanking delay and grounds the pfcOK pin.
8 OVP / UVP input The circuit turns off when this pin falls below VUVP (300 mV typical) and disables the drive when it exceeds VOVP (2.5 V typical).
9 CS input Monitors a negative voltage proportional to the input current to limit the maximum current in the phases and to prevent start-up during large in-rush currents.
10 Latch input Applying a voltage above VSTDWN (166 mV typical) latches the circuit off, and the device resets when the PFC stage is unplugged or when VCC falls below VCCRST (4 V typical).
11 DRV2 output Totem-pole gate drive output for phase 2 of the interleaved PFC stage, with +0.5 / -0.8 A high-current capability for high gate charge MOSFETs.
12 VCC power_in Positive supply pin that starts operation when VCC exceeds 12 V, turns off below 10 V (typical), and has an operating range of 10.5 V to 20 V after start-up.
13 GND power_in Connect this pin to the pre-converter ground.
14 DRV1 output Totem-pole gate drive output for phase 1 of the interleaved PFC stage, with +0.5 / -0.8 A high-current capability for high gate charge MOSFETs.
15 REF5V / pfcOK output Outputs a 5 V typical reference that is high in steady state to signal the downstream converter that the PFC stage is ready, with a current capability of 5 mA minimum (10 mA typical).
16 ZCD1 input Zero current detection input for phase 1 that monitors an auxiliary winding to detect inductor core reset and the MOSFET drain-source voltage valley, with a rising threshold of 0.50 V typical and an input clamp of 11 V typical at 5 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Power Management (PMIC)
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Power Supply Voltage (Continuous) VCC(MAX) -0.3 20 V Continuous 2
Maximum Input Voltage on Low Power Pins VMAX -0.3 9 V Pins 1, 2, 3, 4, 6, 7, 8, 9, 10, 15, 16 (Note 1) 2
VControl Pin Maximum Input Voltage VControl(MAX) -0.3 V Pin 5; upper limit printed as VControl(clamp) (Note 2), not a number 2
Maximum Power Dissipation PD 550 mW TA = 70°C 2
Operating Junction Temperature Range TJ -40 150 °C 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature Range TS(MAX) -65 150 °C 2
Lead Temperature (Soldering) TL(MAX) 300 °C Soldering, 10s 2
ESD Capability, HBM model ESD 3 kV HBM model (Note 3) 2
ESD Capability, Machine Model ESD 200 V Machine Model (Note 3) 2
ESD Capability, Charged Device Model ESD 1000 V Charged Device Model (Note 3) 2
Supply Voltage operating range after start-up VCC 10.5 20 V After start-up 7
Startup Threshold (VCC increasing) VCC(on) 11 12 13 V VCC increasing 4
Minimum Operating Voltage (VCC decreasing) VCC(off) 9.4 10 10.4 V VCC decreasing 4
Hysteresis VCC(on) - VCC(off) VCC(hyst) 1.5 2 V 4
Internal Logic Reset VCC(reset) 4 6 7.5 V VCC decreasing 4
Startup current ICC(start) 50 100 µA VCC = 9.4 V 4
Supply Current, device enabled/no output load on pin 6 ICC1 3.5 7 mA Fsw = 130 kHz (Note 5) 4
Charge Current ICH 126 140 154 µA Pin 6 open 4
Maximum Discharge Current IDISCH 94.5 105 115.5 µA Pin 6 open 4
Pin 6 source current IFFOLD30 28 30 32 µA ICS = 30 µA 4
Oscillator Lower Threshold VOSC(low) 3.6 4 4.4 V VFFOLD = 4.2 V, VFFOLD falling 4
Oscillator Lower Threshold VOSC(low) 2.7 3 3.3 V VFFOLD = 3.8 V, VFFOLD rising 4
Oscillator Lower Threshold VOSC(low) 1.8 2 2.2 V VFFOLD = 2.0 V, VFFOLD falling 4
Oscillator Lower Threshold VOSC(low) 0.8 1 1.1 V VFFOLD = 0.8 V, VFFOLD falling 4
Current Sense Voltage Offset VCS(TH100) -20 0 20 mV Ipin9 = 100 µA 4
Current Sense Protection Threshold IILIM1 202 210 226 µA TJ = 25°C 4
Current Sense Protection Threshold IILIM2 194 210 226 µA TJ = -40°C to 125°C 4
Threshold for In-rush Current Detection Iin-rush 11 14 17 µA 4
Drive Resistance DRV1 Sink RSNK1 7 15 Ω Ipin14 = 100 mA 4
Drive Resistance DRV1 Source RSRC1 15 25 Ω Ipin14 = -100 mA 4
Feedback Voltage Reference VREF 2.44 2.5 2.56 V 5
Error Amplifier Gain GEA 115 200 285 S 5
Pin 5 Source Current when Vout(low) Detect is activated IControl(boost) 175 220 265 µA pfcOK high 5
Pin 5 Source Current when Vout(low) Detect is activated IControl(boost) 55 70 85 µA pfcOK low 5
Ratio Vout(low) Detect Threshold / VREF Vout(low)/VREF 95 95.5 96 % FB falling 5
Duty Cycle in skip mode DMIN 0 % VFB = 3 V 5
Maximum DRV1 and DRV2 On-Time ton1 14.5 19.5 22.5 µs Vpin7 = 1.1 V, Ipin3 = 50 µA (Note 6) 5
Maximum DRV1 and DRV2 On-Time ton2 1.1 1.35 1.6 µs Vpin7 = 1.1 V, Ipin3 = 200 µA 5
Maximum DRV1 and DRV2 On-Time ton3 4 5 6 µs Vpin7 = 2.2 V, Ipin3 = 100 µA 5
Pin 3 voltage VRt1 1.068 1.096 1.126 V VBO = Vpin7 = 1.1 V, Ipin3 = 50 µA 5
Pin 3 voltage VRt3 2.165 2.196 2.228 V VBO = Vpin7 = 2.2 V, Ipin3 = 50 µA 5
Maximum Vton Voltage Vton(MAX) 5 V Not tested 5
Pin 3 Current Capability IRt(MAX) 1 mA 5
ZCD Threshold Voltage (increasing) VZCD(TH),H 0.4 0.5 0.6 V VZCD increasing 6
ZCD Threshold Voltage (falling) VZCD(TH),L 0.2 0.25 0.3 V VZCD falling 6
Input Clamp Voltage High State VZCD(high) 9 11 13 V Ipin1 = 5.0 mA 6
Input Clamp Voltage Low State VZCD(low) -1.1 -0.65 -0.1 V Ipin1 = -5.0 mA 6
ZCD Watchdog Delay tZCD 80 200 320 µs 6
Brown-Out Comparator Threshold VBO(TH) 0.97 1 1.03 V 6
Brown-Out Current Source IBO 6 7 8 µA 6
Brown-Out Blanking Time tBO(BLANK) 380 500 620 ms 6
Pin BO voltage when clamped by the PNP VBO(PNP) 0.35 0.7 0.9 V Ipin7 = -100 µA 6
Over-Voltage Protection Threshold VOVP 2.425 2.5 2.575 V 6
Ratio (VOVP / VREF) VOVP/VREF 99.2 99.7 100.2 % 6
Pin Latch Threshold for Shutdown VLatch 140 166 200 mV 6
Pin 15 Voltage High State VREF5V(high) 4.7 5 5.3 V Vpin7 = 0 V, Ipin15 = 5 mA 6
Thermal Shutdown Threshold TSHDN 130 140 150 °C 6
Thermal Resistance Junction-to-Air RJ-A 145 °C/W Junction-to-Air 2

CAD (KiCad official)

  • Symbol: NCP1632DR2G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: ncp1632dr2g-etched.step / ncp1632dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1632dr2g.step / ncp1632dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (27 pp, sha256 c6c004687695287d, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF