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Contents

README

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MD7671B50SF4

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · ESOP-8

MD7671B50SF4 from Shanghai Mingda Microelectronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulator output pin. Delivers up to 1 A at the programmed output voltage (default 5 V, adjustable down to 0.7 V). Requires a 4.7 µF or larger low-ESR ceramic output capacitor placed close to the pin.
2 ADJ input Feedback / adjust pin. Connect to an external R1/R2 divider from VOUT to set VOUT = 0.7 V * (1 + R1/R2). Tie ADJ to GND to select the internal feedback resistors for the default 5 V output. Reference voltage at ADJ is 0.7 V typ (0.686-0.714 V); ADJ input current is 10 nA typ.
3 GND power_in Ground / signal return pin. Also serves as the reference return for the regulator; connect together with the exposed pad to a solid ground plane for best thermal and noise performance.
4 N.C. unconnected No internal connection. May be left floating or tied to GND.
5 EN input Enable input, active high. VEN >= 1.6 V turns the regulator on; VEN <= 0.4 V shuts the device down (shutdown current 10 nA typ). During shutdown an internal ~30 Ω path discharges COUT to GND. Do not leave floating.
6 N.C. unconnected No internal connection. May be left floating or tied to GND.
7 N.C. unconnected No internal connection. May be left floating or tied to GND.
8 VIN power_in Power input pin. Operating input range 2-6 V (absolute max 7 V). Must be decoupled to GND with a 4.7 µF or larger ceramic capacitor placed close to the pin; use >=10 µF for high transient loads (>500 mA).
EP GND (Exposed Pad) power_in Exposed thermal pad on the bottom of the ESOP-8 package. Must be connected to the GND plane to provide the primary thermal path (RθJB = 80 °C/W on a JEDEC 2s2p board).

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package ESOP-8
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • MD7671B50SF4
  • MD7671A50SF4
  • MD7671AXXSF4

CAD (KiCad official)

  • Symbol: MD7671B50SF4
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: md7671b50sf4-etched.step / md7671b50sf4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md7671b50sf4.step / md7671b50sf4.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
md7671b50sf4.step 125 KB You want the bare part, or you mark your own boards.
md7671b50sf4-etched.step 2.3 MB You want the part with MD7671B50SF4 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 581 faces against 152 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (10 pp, sha256 2d2f9d53083bf31d, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF