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LWS1H90A4

Public Made by Adom

by adom

Lewa Micro MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LWS1H90A4

Lewa Micro · MOSFETs · TO-252

LWS1H90A4 from Lewa Micro, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the P-channel MOSFET, with a maximum gate-to-source voltage of ±20 V.
2 D passive Drain; rated for a drain-to-source voltage of -100 V and a continuous drain current of -25 A at TC=25℃.
3 S passive Source; body diode is connected between drain and source, with a forward voltage of -1.2 V maximum at IS=-10A.

Key specifications

Parameter Value
Manufacturer Lewa Micro
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS -100 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Pulsed Drain Current IDM -100 A 1
Single pulse avalanche energy EAS 200 mJ 1
Power Dissipation PD 80 W 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Maximum Temperature for Soldering TL 260 °C 1
Thermal Resistance, Junction-to-Case RθJC 1.56 °C/W 1
Drain to Source Breakdown Voltage V(BR)DSS -100 V VGS=0V, ID=-250µA 2
Drain to Source Leakage Current IDSS -1 µA VDS=-100V, VGS=0V 2
Gate to Source Forward Leakage IGSS(F) -100 nA VGS=-20V, VDS=0V 2
Gate to Source Reverse Leakage IGSS(R) 100 nA VGS=+20V, VDS=0V 2
Gate Threshold Voltage VGS(TH) -1.5 -2 -2.5 V VDS=VGS, ID=-250µA 2
Diode Forward Voltage VSD -1.2 V IS=-10A, VGS=0V 2
Diode Forward Current IS -25 A TC=25 °C 2

CAD (KiCad official)

  • Symbol: LWS1H90A4
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: lws1h90a4-etched.step / lws1h90a4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lws1h90a4.step / lws1h90a4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Lewa Micro datasheet (10 pp, sha256 227e216e5315e9f2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF