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LMK00301SQX

Texas Instruments · Clock Buffers, Drivers · WQFN-48-EP(7x7)

LMK00301SQX from Texas Instruments, in a WQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CLKoutA0 output Differential clock output A0 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
2 CLKoutA0* output Complementary differential clock output A0* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
3 CLKoutA1 output Differential clock output A1 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
4 CLKoutA1* output Complementary differential clock output A1* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
5 VCCOA power_in Output buffer supply for bank A, operating at 3.3 V or 2.5 V (±5%); VCCOA pins are internally connected and must not exceed VCC.
6 CLKoutA2 output Differential clock output A2 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
7 CLKoutA2* output Complementary differential clock output A2* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
8 VCCOA power_in Output buffer supply for bank A, operating at 3.3 V or 2.5 V (±5%); VCCOA pins are internally connected and must not exceed VCC.
9 CLKoutA3 output Differential clock output A3 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
10 CLKoutA3* output Complementary differential clock output A3* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
11 CLKoutA4 output Differential clock output A4 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
12 CLKoutA4* output Complementary differential clock output A4* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutA_TYPE pins.
13 GND power_in Ground pin.
14 CLKoutA_TYPE0 input CMOS control input with internal pull-down that selects the bank A output buffer type together with CLKoutA_TYPE1.
15 VCC power_in Core and input buffer block supply, operating at 3.3 V; bypass with a 0.1 µF low-ESR capacitor placed close to each VCC pin.
16 OSCin input Crystal input, which can also be driven by an XO, TCXO, or other external single-ended clock (up to 250 MHz).
17 OSCout output Crystal output; leave floating when OSCin is driven by a single-ended clock.
18 GND power_in Ground pin.
19 CLKin_SEL0 input CMOS clock input select control with internal pull-down that selects CLKin0, CLKin1, or OSCin together with CLKin_SEL1.
20 CLKin0 input Universal clock input 0, accepting differential or single-ended signals and operating up to 3.1 GHz.
21 CLKin0* input Complementary universal clock input 0*, used with CLKin0 for differential operation or biased externally for single-ended operation.
22 CLKin_SEL1 input CMOS clock input select control with internal pull-down that selects CLKin0, CLKin1, or OSCin together with CLKin_SEL0.
23 CLKoutB_TYPE0 input CMOS control input with internal pull-down that selects the bank B output buffer type together with CLKoutB_TYPE1.
24 GND power_in Ground pin.
25 CLKoutB4* output Complementary differential clock output B4* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
26 CLKoutB4 output Differential clock output B4 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
27 CLKoutB3* output Complementary differential clock output B3* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
28 CLKoutB3 output Differential clock output B3 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
29 VCCOB power_in Output buffer supply for bank B, operating at 3.3 V or 2.5 V (±5%); VCCOB pins are internally connected and must not exceed VCC.
30 CLKoutB2* output Complementary differential clock output B2* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
31 CLKoutB2 output Differential clock output B2 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
32 VCCOB power_in Output buffer supply for bank B, operating at 3.3 V or 2.5 V (±5%); VCCOB pins are internally connected and must not exceed VCC.
33 CLKoutB1* output Complementary differential clock output B1* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
34 CLKoutB1 output Differential clock output B1 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
35 CLKoutB0* output Complementary differential clock output B0* (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
36 CLKoutB0 output Differential clock output B0 (LVPECL, LVDS, HCSL, or high-Z), with the type set by the CLKoutB_TYPE pins.
37 GND power_in Ground pin.
38 NC unconnected Internally not connected; may be left floating, grounded, or tied to any potential within the absolute maximum supply voltage range.
39 CLKoutB_TYPE1 input CMOS control input with internal pull-down that selects the bank B output buffer type together with CLKoutB_TYPE0.
40 CLKin1 input Universal clock input 1, accepting differential or single-ended signals and operating up to 3.1 GHz.
41 CLKin1* input Complementary universal clock input 1*, used with CLKin1 for differential operation or biased externally for single-ended operation.
42 VCC power_in Core and input buffer block supply, operating at 3.3 V; bypass with a 0.1 µF low-ESR capacitor placed close to each VCC pin.
43 GND power_in Ground pin.
44 REFout output LVCMOS reference output referenced to VCCOC, enabled by pulling REFout_EN high and disabled (high-Z) when REFout_EN is low.
45 VCCOC power_in Output buffer supply for the REFout output, operating at 3.3 V or 2.5 V (±5%).
46 REFout_EN input CMOS REFout enable input with internal pull-down, synchronized internally to the selected input clock to avoid glitches.
47 CLKoutA_TYPE1 input CMOS control input with internal pull-down that selects the bank A output buffer type together with CLKoutA_TYPE0.
48 GND power_in Ground pin.
49 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-48-EP(7x7)
Category RTC/Clock Chip
Pins 49

CAD (KiCad official)

  • Symbol: LMK00301SQX
  • Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: WQFN-48-EP(7x7) (KiCad packages3D, STEP)
  • 3D model files: lmk00301sqx-etched.step / lmk00301sqx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmk00301sqx.step / lmk00301sqx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 6962bb9414ac1c54, retrieved 2026-10-07, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF