# ISL3177EIBZ-T

**RENESAS** · Pre-ordered Chips · SOIC-8

ISL3177EIBZ-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | System power supply input, 3.0V to 3.6V. |
| 2 | RO | output | Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if A and B are floating or shorted. |
| 3 | DI | input | Driver input: a low forces Y low and Z high, a high forces Y high and Z low. |
| 4 | GND | power_in | Ground connection. |
| 5 | Y | output | ±15kV IEC61000 ESD protected RS-485/422 level noninverting driver output. |
| 6 | Z | output | ±15kV IEC61000 ESD protected RS-485/422 level inverting driver output. |
| 7 | B | input | ±15kV IEC61000 ESD protected RS-485/422 level inverting receiver input. |
| 8 | A | input | ±15kV IEC61000 ESD protected RS-485/422 level noninverting receiver input. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (test conditions VCC range) | VCC | 3 |  | 3.6 | V | Test conditions: VCC = 3.0V to 3.6V; unless otherwise specified | 7 |
| Operating temperature range | TA | -40 |  | 85 | °C | Temperature Range | 7 |
| VCC to GND | VCC |  |  | 7 | V |  | 7 |
| Input voltage DI | DI | -0.3 |  | 7 | V |  | 7 |
| Input voltage DE, RE | DE, RE | -0.3 |  | 7 | V | Note 20 | 7 |
| Input/output voltage A, B, Y, Z | A, B, Y, Z | -8 |  | 13 | V |  | 7 |
| Input/output voltage RO | RO | -0.3 |  |  | V | to (VCC +0.3V) | 7 |
| Maximum junction temperature (plastic package) | TJ |  |  | 150 | °C |  | 7 |
| Maximum storage temperature range | TSTG | -65 |  | 150 | °C |  | 7 |
| Thermal resistance, 8 Ld SOIC package | JA |  | 105 |  | °C/W | Typical, Note 4; measured on high-effective thermal conductivity test board in free air | 7 |
| Driver differential VOUT (RS-422) | VOD | 2 | 2.3 |  | V | RL = 100Ω (RS-422) (Figure 4A, Note 16) | 7 |
| Driver differential VOUT (RS-485) | VOD | 1.5 | 2 |  | V | RL = 54Ω (RS-485) (Figure 4A) | 7 |
| Driver differential VOUT (RL = 60Ω) | VOD | 1.5 | 2.2 |  | V | RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B) | 7 |
| Change in magnitude of driver differential VOUT for complementary output states | VOD |  | 0.01 | 0.2 | V | RL = 54Ω or 100Ω (Figure 4A) | 7 |
| Driver common-mode VOUT | VOC |  | 2 | 3 | V | RL = 54Ω or 100Ω (Figure 4A) | 7 |
| Change in magnitude of driver common-mode VOUT for complementary output states | VOC |  | 0.01 | 0.2 | V | RL = 54Ω or 100Ω (Figure 4A) | 7 |
| Logic input high voltage | VIH | 2 |  |  | V | DI, DE, RE | 7 |
| Logic input low voltage | VIL |  |  | 0.8 | V | DI, DE, RE | 7 |
| Logic input current | IIN1 | -2 |  | 2 | µA | DI = DE = RE = 0V or VCC (Note 18) | 7 |
| Input current (A, B, A/Y, B/Z) | IIN2 |  | 80 | 125 | µA | DE = 0V, VCC = 0V or 3.6V, VIN = 12V | 7 |
| Input current (A, B, A/Y, B/Z) | IIN2 | -100 | -50 |  | µA | DE = 0V, VCC = 0V or 3.6V, VIN = -7V | 7 |
| Driver short-circuit current, VO = High or Low | IOSD1 | -250 |  | 250 | mA | DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) | 7 |
| Receiver differential threshold voltage | VTH | -200 | -125 | -50 | mV | -7V ≤ VCM ≤ 12V | 7 |
| Receiver output low voltage | VOL |  | 0.17 | 0.4 | V | IO = -4mA, VID = -200mV | 8 |
| Receiver input resistance | RIN | 96 | 150 |  | kΩ | -7V ≤ VCM ≤ 12V | 8 |
| Receiver short-circuit current | IOSR | -7 | 30 | 60 | mA | 0V ≤ VO ≤ VCC | 8 |
| No-load supply current | ICC |  | 510 | 800 | µA | DI = 0V or VCC; DE = VCC, RE = 0V or VCC (Note 6) | 8 |
| No-load supply current | ICC |  | 480 | 700 | µA | DE = 0V, RE = 0V | 8 |
| Maximum data rate (20Mbps driver) | fMAX | 20 | 28 |  | Mbps | VOD = ±1.5V, CD = 350pF (Figure 7, Note 17) | 9 |
| Driver differential output delay | tDD |  | 27 | 40 | ns | RDIFF = 54Ω, CD = 50pF (Figure 5) | 9 |
| Driver differential output skew | tSKEW |  | 1 | 3 | ns | RDIFF = 54Ω, CD = 50pF (Figure 5) | 9 |
| Driver output skew, part-to-part | tDSKEW |  |  | 11 | ns | RDIFF = 54Ω, CD = 50pF (Figure 5, Note 14) | 9 |
| Driver differential rise or fall time | tR, tF |  | 9 | 15 | ns | RDIFF = 54Ω, CD = 50pF (Figure 5) | 9 |
| Maximum data rate (receiver, ISL3176E-78E) | fMAX | 20 | 35 |  | Mbps | VID = ±1.5V (Note 17) | 9 |
| Receiver input to output delay | tPLH, tPHL | 25 | 33 | 60 | ns | (Figure 8) | 9 |
| Receiver skew /tPLH - tPHL/ | tSKD |  | 1.5 | 4 | ns | (Figure 8) | 9 |
| Receiver skew, part-to-part | tRSKEW |  |  | 15 | ns | (Figure 8, Note 14) | 9 |

## CAD (KiCad official)

- Symbol: `ISL3177EIBZ-T`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `isl3177eibz-t-etched.step` / `isl3177eibz-t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isl3177eibz-t.step` / `isl3177eibz-t.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RENESAS datasheet](docs/isl3177eibz-t-datasheet.pdf) (24 pp, sha256 `345b690163a956f6`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/isl3177eibz-t-datasheet.pdf)