ISL3177EIBZ-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC	power_in	System power supply input, 3.0V to 3.6V.
2	RO	output	Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if A and B are floating or shorted.
3	DI	input	Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
4	GND	power_in	Ground connection.
5	Y	output	±15kV IEC61000 ESD protected RS-485/422 level noninverting driver output.
6	Z	output	±15kV IEC61000 ESD protected RS-485/422 level inverting driver output.
7	B	input	±15kV IEC61000 ESD protected RS-485/422 level inverting receiver input.
8	A	input	±15kV IEC61000 ESD protected RS-485/422 level noninverting receiver input.

Key specifications

Parameter	Value
Manufacturer	RENESAS
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage (test conditions VCC range)	VCC	3		3.6	V	Test conditions: VCC = 3.0V to 3.6V; unless otherwise specified	7
Operating temperature range	TA	-40		85	°C	Temperature Range	7
VCC to GND	VCC			7	V		7
Input voltage DI	DI	-0.3		7	V		7
Input voltage DE, RE	DE, RE	-0.3		7	V	Note 20	7
Input/output voltage A, B, Y, Z	A, B, Y, Z	-8		13	V		7
Input/output voltage RO	RO	-0.3			V	to (VCC +0.3V)	7
Maximum junction temperature (plastic package)	TJ			150	°C		7
Maximum storage temperature range	TSTG	-65		150	°C		7
Thermal resistance, 8 Ld SOIC package	JA		105		°C/W	Typical, Note 4; measured on high-effective thermal conductivity test board in free air	7
Driver differential VOUT (RS-422)	VOD	2	2.3		V	RL = 100Ω (RS-422) (Figure 4A, Note 16)	7
Driver differential VOUT (RS-485)	VOD	1.5	2		V	RL = 54Ω (RS-485) (Figure 4A)	7
Driver differential VOUT (RL = 60Ω)	VOD	1.5	2.2		V	RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B)	7
Change in magnitude of driver differential VOUT for complementary output states	VOD		0.01	0.2	V	RL = 54Ω or 100Ω (Figure 4A)	7
Driver common-mode VOUT	VOC		2	3	V	RL = 54Ω or 100Ω (Figure 4A)	7
Change in magnitude of driver common-mode VOUT for complementary output states	VOC		0.01	0.2	V	RL = 54Ω or 100Ω (Figure 4A)	7
Logic input high voltage	VIH	2			V	DI, DE, RE	7
Logic input low voltage	VIL			0.8	V	DI, DE, RE	7
Logic input current	IIN1	-2		2	µA	DI = DE = RE = 0V or VCC (Note 18)	7
Input current (A, B, A/Y, B/Z)	IIN2		80	125	µA	DE = 0V, VCC = 0V or 3.6V, VIN = 12V	7
Input current (A, B, A/Y, B/Z)	IIN2	-100	-50		µA	DE = 0V, VCC = 0V or 3.6V, VIN = -7V	7
Driver short-circuit current, VO = High or Low	IOSD1	-250		250	mA	DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7)	7
Receiver differential threshold voltage	VTH	-200	-125	-50	mV	-7V ≤ VCM ≤ 12V	7
Receiver output low voltage	VOL		0.17	0.4	V	IO = -4mA, VID = -200mV	8
Receiver input resistance	RIN	96	150		kΩ	-7V ≤ VCM ≤ 12V	8
Receiver short-circuit current	IOSR	-7	30	60	mA	0V ≤ VO ≤ VCC	8
No-load supply current	ICC		510	800	µA	DI = 0V or VCC; DE = VCC, RE = 0V or VCC (Note 6)	8
No-load supply current	ICC		480	700	µA	DE = 0V, RE = 0V	8
Maximum data rate (20Mbps driver)	fMAX	20	28		Mbps	VOD = ±1.5V, CD = 350pF (Figure 7, Note 17)	9
Driver differential output delay	tDD		27	40	ns	RDIFF = 54Ω, CD = 50pF (Figure 5)	9
Driver differential output skew	tSKEW		1	3	ns	RDIFF = 54Ω, CD = 50pF (Figure 5)	9
Driver output skew, part-to-part	tDSKEW			11	ns	RDIFF = 54Ω, CD = 50pF (Figure 5, Note 14)	9
Driver differential rise or fall time	tR, tF		9	15	ns	RDIFF = 54Ω, CD = 50pF (Figure 5)	9
Maximum data rate (receiver, ISL3176E-78E)	fMAX	20	35		Mbps	VID = ±1.5V (Note 17)	9
Receiver input to output delay	tPLH, tPHL	25	33	60	ns	(Figure 8)	9
Receiver skew /tPLH - tPHL/	tSKD		1.5	4	ns	(Figure 8)	9
Receiver skew, part-to-part	tRSKEW			15	ns	(Figure 8, Note 14)	9

CAD (KiCad official)

Symbol: ISL3177EIBZ-T
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: isl3177eibz-t-etched.step / isl3177eibz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3177eibz-t.step / isl3177eibz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: RENESAS datasheet (24 pp, sha256 345b690163a956f6, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ISL3177EIBZ-T

Verified ISL3177EIBZ-T

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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