component

ISL3177EIBZ-T

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsisl3177eibz-tfactory-2.0.0extractor-text

Verified ISL3177EIBZ-T

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: ISL3177EIBZ-T · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 24-page datasheet
  • ✓distributor: lcsc C2671869, digikey 20-ISL3177EIBZ-TTR-ND, mouser 968-ISL3177EIBZ-T
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-ge2qk9zp/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ isl3177eibz-t.kicad_sym✓ isl3177eibz-t.kicad_mod✓ isl3177eibz-t.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 10d ago
viewers isl3177eibz-t: viewers · Ray 10d ago
isl3177eibz-t-etched.glb Publish 0.1.0 · Ray 10d ago
isl3177eibz-t-etched.step isl3177eibz-t: factory component page (tier=mfr) · Ray 10d ago
isl3177eibz-t-hero.glb isl3177eibz-t: hero GLB from the etched model (keeps the MPN mark) · Ray 10d ago
isl3177eibz-t-hero.overlay.json Publish 0.1.0 · Ray 10d ago
isl3177eibz-t.glb Publish 0.1.0 · Ray 10d ago
isl3177eibz-t.kicad_mod Publish 0.1.0 · Ray 10d ago
isl3177eibz-t.kicad_sym Publish 0.1.0 · Ray 10d ago
isl3177eibz-t.lbr Publish 0.1.0 · Ray 10d ago
isl3177eibz-t.step Publish 0.1.0 · Ray 10d ago
package.json Publish 0.1.0 · Ray 10d ago
page.json Set visibility: public · Ray 10d ago
README.md Publish 0.1.0 · Ray 10d ago
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray 10d ago

ISL3177EIBZ-T

RENESAS · Pre-ordered Chips · SOIC-8

ISL3177EIBZ-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in System power supply input, 3.0V to 3.6V.
2 RO output Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if A and B are floating or shorted.
3 DI input Driver input: a low forces Y low and Z high, a high forces Y high and Z low.
4 GND power_in Ground connection.
5 Y output ±15kV IEC61000 ESD protected RS-485/422 level noninverting driver output.
6 Z output ±15kV IEC61000 ESD protected RS-485/422 level inverting driver output.
7 B input ±15kV IEC61000 ESD protected RS-485/422 level inverting receiver input.
8 A input ±15kV IEC61000 ESD protected RS-485/422 level noninverting receiver input.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (test conditions VCC range) VCC 3 3.6 V Test conditions: VCC = 3.0V to 3.6V; unless otherwise specified 7
Operating temperature range TA -40 85 °C Temperature Range 7
VCC to GND VCC 7 V 7
Input voltage DI DI -0.3 7 V 7
Input voltage DE, RE DE, RE -0.3 7 V Note 20 7
Input/output voltage A, B, Y, Z A, B, Y, Z -8 13 V 7
Input/output voltage RO RO -0.3 V to (VCC +0.3V) 7
Maximum junction temperature (plastic package) TJ 150 °C 7
Maximum storage temperature range TSTG -65 150 °C 7
Thermal resistance, 8 Ld SOIC package JA 105 °C/W Typical, Note 4; measured on high-effective thermal conductivity test board in free air 7
Driver differential VOUT (RS-422) VOD 2 2.3 V RL = 100Ω (RS-422) (Figure 4A, Note 16) 7
Driver differential VOUT (RS-485) VOD 1.5 2 V RL = 54Ω (RS-485) (Figure 4A) 7
Driver differential VOUT (RL = 60Ω) VOD 1.5 2.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B) 7
Change in magnitude of driver differential VOUT for complementary output states VOD 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) 7
Driver common-mode VOUT VOC 2 3 V RL = 54Ω or 100Ω (Figure 4A) 7
Change in magnitude of driver common-mode VOUT for complementary output states VOC 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) 7
Logic input high voltage VIH 2 V DI, DE, RE 7
Logic input low voltage VIL 0.8 V DI, DE, RE 7
Logic input current IIN1 -2 2 µA DI = DE = RE = 0V or VCC (Note 18) 7
Input current (A, B, A/Y, B/Z) IIN2 80 125 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 7
Input current (A, B, A/Y, B/Z) IIN2 -100 -50 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 7
Driver short-circuit current, VO = High or Low IOSD1 -250 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) 7
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 7
Receiver output low voltage VOL 0.17 0.4 V IO = -4mA, VID = -200mV 8
Receiver input resistance RIN 96 150 kΩ -7V ≤ VCM ≤ 12V 8
Receiver short-circuit current IOSR -7 30 60 mA 0V ≤ VO ≤ VCC 8
No-load supply current ICC 510 800 µA DI = 0V or VCC; DE = VCC, RE = 0V or VCC (Note 6) 8
No-load supply current ICC 480 700 µA DE = 0V, RE = 0V 8
Maximum data rate (20Mbps driver) fMAX 20 28 Mbps VOD = ±1.5V, CD = 350pF (Figure 7, Note 17) 9
Driver differential output delay tDD 27 40 ns RDIFF = 54Ω, CD = 50pF (Figure 5) 9
Driver differential output skew tSKEW 1 3 ns RDIFF = 54Ω, CD = 50pF (Figure 5) 9
Driver output skew, part-to-part tDSKEW 11 ns RDIFF = 54Ω, CD = 50pF (Figure 5, Note 14) 9
Driver differential rise or fall time tR, tF 9 15 ns RDIFF = 54Ω, CD = 50pF (Figure 5) 9
Maximum data rate (receiver, ISL3176E-78E) fMAX 20 35 Mbps VID = ±1.5V (Note 17) 9
Receiver input to output delay tPLH, tPHL 25 33 60 ns (Figure 8) 9
Receiver skew /tPLH - tPHL/ tSKD 1.5 4 ns (Figure 8) 9
Receiver skew, part-to-part tRSKEW 15 ns (Figure 8, Note 14) 9

CAD (KiCad official)

  • Symbol: ISL3177EIBZ-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl3177eibz-t-etched.step / isl3177eibz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3177eibz-t.step / isl3177eibz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (24 pp, sha256 345b690163a956f6, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF