# HUF75345P3

**onsemi** · MOSFETs · TO-220-3

HUF75345P3 from onsemi, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; gate-to-source voltage is rated ±20 V (VGS). |
| 2 | D | passive | Drain terminal, rated 55 V drain-to-source (VDSS) and 75 A continuous drain current (ID); the drain is also connected to the metal tab. |
| 3 | S | passive | Source terminal; the source-to-drain diode voltage is 1.25 V at ISD = 75 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TO-220-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to Source Voltage | VDSS |  |  | 55 | V | Note 1: TJ = 25°C to 150°C | 2 |
| Drain to Gate Voltage | VDGR |  |  | 55 | V | RGS = 20 k (Note 1) | 2 |
| Gate to Source Voltage | VGS | -20 |  | 20 | V |  | 2 |
| Drain Current - Continuous | ID |  |  | 75 | A | Figure 2 | 2 |
| Power Dissipation | PD |  |  | 325 | W | TC = 25°C | 2 |
| Power Dissipation Derating above 25°C | PD |  |  | 2.17 | W/°C | Derate above 25°C | 2 |
| Operating and Storage Temperature | TJ, TSTG | -55 |  | 175 | °C |  | 2 |
| Maximum Temperature for Soldering Leads | TL |  |  | 300 | °C | 0.063 in (1.6 mm) from case for 10 s | 2 |
| Maximum Temperature for Soldering Leads Package Body | Tpkg |  |  | 260 | °C | Package body for 10 s | 2 |
| Drain to Source Breakdown Voltage | BVDSS | 55 |  |  | V | ID = 250 A, VGS = 0 V (Figure 11) | 3 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | A | VDS = 50 V, VGS = 0 V | 3 |
| Zero Gate Voltage Drain Current at TC = 150C | IDSS |  |  | 250 | A | VDS = 45 V, VGS = 0 V, TC = 150C | 3 |
| Gate to Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS = ±20 V | 3 |
| Gate to Source Threshold Voltage | VGS(TH) | 2 |  | 4 | V | VGS = VDS, ID = 250 A (Figure 10) | 3 |
| Drain to Source On Resistance | RDS(ON) |  | 0.006 | 0.007 | Ω | ID = 75 A, VGS = 10 V (Figure 9) | 3 |
| Source to Drain Diode Voltage | VSD |  |  | 1.25 | V | ISD = 75 A | 3 |
| Thermal Resistance Junction to Case | RθJC |  |  | 0.46 | °C/W | Figure 3 | 3 |
| Thermal Resistance Junction to Ambient TO-220, D2PAK | RθJA |  |  | 62 | °C/W |  | 3 |
| Total Gate Charge | Qg(tot) |  | 220 | 275 | nC | VGS = 0 V to 20 V, VDD = 30 V, ID = 75 A, RL = 0.4 Ω, Ig(REF) = 1.0 mA (Figure 13) | 3 |
| Gate Charge at 10 V | Qg(10) |  | 125 | 165 | nC | VGS = 0 V to 10 V, VDD = 30 V, ID = 75 A, RL = 0.4 Ω, Ig(REF) = 1.0 mA (Figure 13) | 3 |
| Threshold Gate Charge | Qg(th) |  | 6.8 | 10 | nC | VGS = 0 V to 2 V, VDD = 30 V, ID = 75 A, RL = 0.4 Ω, Ig(REF) = 1.0 mA (Figure 13) | 3 |
| Gate to Source Gate Charge | Qgs |  | 14 |  | nC | VDD = 30 V, ID = 75 A, RL = 0.4 Ω, Ig(REF) = 1.0 mA (Figure 13) | 3 |
| Gate to Drain Miller Charge | Qgd |  | 58 |  | nC |  | 3 |
| Input Capacitance | Ciss |  | 4000 |  | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz (Figure 12) | 3 |
| Output Capacitance | Coss |  | 1450 |  | pF |  | 3 |
| Reverse Transfer Capacitance | Crss |  | 450 |  | pF |  | 3 |
| Reverse Recovery Time | trr |  | 55 |  | ns | ISD = 75 A, dlSD/dt = 100 A/s | 3 |
| Reverse Recovered Charge | QRR |  | 80 |  | nC | ISD = 75 A, dlSD/dt = 100 A/s | 3 |
| Turn-On Time | tON |  | 195 |  | ns | VDD = 30 V, ID = 75 A, RL = 0.4 Ω, VGS = 10 V, RGS = 2.5 Ω | 3 |
| Turn-On Delay Time | td(ON) |  | 14 |  | ns | VGS = 10 V | 3 |
| Rise Time | tr |  | 118 |  | ns | VGS = 10 V | 3 |
| Turn-Off Delay Time | td(OFF) |  | 42 |  | ns | VGS = 10 V | 3 |
| Fall Time | tf |  | 26 |  | ns | VGS = 10 V | 3 |
| Turn-Off Time | tOFF |  | 98 |  | ns | VGS = 10 V | 3 |

## CAD (KiCad official)

- Symbol: `HUF75345P3`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220-3 (KiCad packages3D, STEP)
- 3D model files: `huf75345p3-etched.step` / `huf75345p3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `huf75345p3.step` / `huf75345p3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/huf75345p3-d.pdf) (16 pp, sha256 `a6bc3ce811f838ac`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/huf75345p3-datasheet.pdf)