component
HSI1026XT1GE3
Public Made by Adomby adom
HXY MOSFET MOSFETs, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HSI1026XT1GE3
HXY MOSFET · MOSFETs · SOT-363
HSI1026XT1GE3 from HXY MOSFET, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
| 2 | G1 | input | Gate of MOSFET 1; maximum gate-source voltage ±20 V, threshold 1 V min to 2.5 V max at 250 µA. |
| 3 | D2 | passive | Drain of MOSFET 2 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
| 4 | S2 | passive | Source of MOSFET 2 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
| 5 | G2 | input | Gate of MOSFET 2; maximum gate-source voltage ±20 V, threshold 1 V min to 2.5 V max at 250 µA. |
| 6 | D1 | passive | Drain of MOSFET 1 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOT-363 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 60 | V | TC=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC=25℃ | 1 | |
| Drain Current-Continuous | ID | 0.115 | A | TC=25℃ | 1 | ||
| Maximum Power Dissipation | PD | 0.15 | W | TC=25℃ | 1 | ||
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | 150 | ℃ | TC=25℃ | 1 | |
| Thermal Resistance, Junction-to-Ambient | RθJA | 833 | ℃/W | Note 2 | 1 | ||
| Drain-source breakdown voltage | V(BR)DSS | 60 | V | VGS=0 V, ID=250 µA | 2 | ||
| Gate-threshold voltage | Vth(GS) | 1 | 1.6 | 2.5 | V | VDS=VGS, ID=250 µA | 2 |
| Gate-body leakage | IGSS | 80 | nA | VDS=0 V, VGS=±20 V | 2 | ||
| Zero gate voltage drain current | IDSS | 80 | nA | VDS=60 V, VGS=0 V | 2 | ||
| Drain-source on-resistance | RDS(on) | 1.3 | Ω | VGS=10 V, ID=115mA | 2 | ||
| Drain-source on-resistance | RDS(on) | 2 | 5 | Ω | VGS=4.5V, ID=50mA | 2 | |
| Forward transconductance | gfs | 80 | 500 | ms | VDS=10 V, ID=200mA | 2 | |
| Drain-source on-voltage | VDS(on) | 0.5 | 3.75 | V | VGS=10V, ID=500mA | 2 | |
| Drain-source on-voltage | VDS(on) | 0.05 | 0.375 | V | VGS=5V, ID=50mA | 2 | |
| Diode forward voltage | VSD | 0.55 | 1.2 | V | IS=115mA, VGS=0 V | 2 | |
| Gate-Source Breakdown Voltage | VGSO | -21.5 | -30 | V | IGS=±1mA(Open Drain) | 2 | |
| Input capacitance | Ciss | 50 | pF | VDS=25V, VGS=0V, f=1MHz | 2 | ||
| Output capacitance | Coss | 25 | pF | VDS=25V, VGS=0V, f=1MHz | 2 | ||
| Reverse transfer capacitance | Crss | 5 | pF | VDS=25V, VGS=0V, f=1MHz | 2 | ||
| Turn-on time | td(on) | 20 | ns | VDD=25 V, RL=50Ω, ID=500mA, VGEN=10V, G=25 Ω | 2 | ||
| Turn-off time | td(off) | 40 | ns | VDD=25 V, RL=50Ω, ID=500mA, VGEN=10V, G=25 Ω | 2 |
CAD (KiCad official)
- Symbol:
HSI1026XT1GE3 - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
hsi1026xt1ge3-etched.step/hsi1026xt1ge3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsi1026xt1ge3.step/hsi1026xt1ge3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (5 pp, sha256
db15c9b52aed7048, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HSI1026XT1GE3
**HXY MOSFET** · MOSFETs · SOT-363
HSI1026XT1GE3 from HXY MOSFET, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
| 2 | G1 | input | Gate of MOSFET 1; maximum gate-source voltage ±20 V, threshold 1 V min to 2.5 V max at 250 µA. |
| 3 | D2 | passive | Drain of MOSFET 2 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
| 4 | S2 | passive | Source of MOSFET 2 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
| 5 | G2 | input | Gate of MOSFET 2; maximum gate-source voltage ±20 V, threshold 1 V min to 2.5 V max at 250 µA. |
| 6 | D1 | passive | Drain of MOSFET 1 (N-channel); VDS rated 60 V, ID 0.115 A continuous. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOT-363 |
| Category | Transistors/Thyristors |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 60 | V | TC=25℃ | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | TC=25℃ | 1 |
| Drain Current-Continuous | ID | | | 0.115 | A | TC=25℃ | 1 |
| Maximum Power Dissipation | PD | | | 0.15 | W | TC=25℃ | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | | 150 | ℃ | TC=25℃ | 1 |
| Thermal Resistance, Junction-to-Ambient | RθJA | | | 833 | ℃/W | Note 2 | 1 |
| Drain-source breakdown voltage | V(BR)DSS | 60 | | | V | VGS=0 V, ID=250 µA | 2 |
| Gate-threshold voltage | Vth(GS) | 1 | 1.6 | 2.5 | V | VDS=VGS, ID=250 µA | 2 |
| Gate-body leakage | IGSS | | | 80 | nA | VDS=0 V, VGS=±20 V | 2 |
| Zero gate voltage drain current | IDSS | | | 80 | nA | VDS=60 V, VGS=0 V | 2 |
| Drain-source on-resistance | RDS(on) | | 1.3 | | Ω | VGS=10 V, ID=115mA | 2 |
| Drain-source on-resistance | RDS(on) | | 2 | 5 | Ω | VGS=4.5V, ID=50mA | 2 |
| Forward transconductance | gfs | 80 | | 500 | ms | VDS=10 V, ID=200mA | 2 |
| Drain-source on-voltage | VDS(on) | | 0.5 | 3.75 | V | VGS=10V, ID=500mA | 2 |
| Drain-source on-voltage | VDS(on) | | 0.05 | 0.375 | V | VGS=5V, ID=50mA | 2 |
| Diode forward voltage | VSD | | 0.55 | 1.2 | V | IS=115mA, VGS=0 V | 2 |
| Gate-Source Breakdown Voltage | VGSO | -21.5 | | -30 | V | IGS=±1mA(Open Drain) | 2 |
| Input capacitance | Ciss | | | 50 | pF | VDS=25V, VGS=0V, f=1MHz | 2 |
| Output capacitance | Coss | | | 25 | pF | VDS=25V, VGS=0V, f=1MHz | 2 |
| Reverse transfer capacitance | Crss | | | 5 | pF | VDS=25V, VGS=0V, f=1MHz | 2 |
| Turn-on time | td(on) | | | 20 | ns | VDD=25 V, RL=50Ω, ID=500mA, VGEN=10V, G=25 Ω | 2 |
| Turn-off time | td(off) | | | 40 | ns | VDD=25 V, RL=50Ω, ID=500mA, VGEN=10V, G=25 Ω | 2 |
## CAD (KiCad official)
- Symbol: `HSI1026XT1GE3`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files: `hsi1026xt1ge3-etched.step` / `hsi1026xt1ge3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hsi1026xt1ge3.step` / `hsi1026xt1ge3.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HXY MOSFET datasheet](docs/hsi1026xt1ge3-datasheet.pdf) (5 pp, sha256 `db15c9b52aed7048`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hsi1026xt1ge3-datasheet.pdf)