component
HSCTWA60N12G24AG
Public Made by Adomby adom
HXY MOSFET Silicon Carbide Field Effect Transistor (MOSFET), TO-247-4L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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HSCTWA60N12G24AG
HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L
HSCTWA60N12G24AG from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Drain | passive | Drain terminal, also the metal tab; rated VDSmax 1200 V at VGS = 0 V and ID = 100 μA, with continuous ID of 63 A at VGS = 15 V and TC = 25 ˚C. |
| 2 | Power Source | passive | Power source terminal carrying the main switching current, kept separate from the driver source pin per the package feature list. |
| 3 | Driver Source | passive | Separate driver source pin for the gate drive return, provided to reduce switching losses and minimize gate ringing. |
| 4 | Gate | input | Gate input with static limits of -4/+15 V (MOSFET can also safely operate at 0/+15 V) and dynamic limits of -8/+19 V for AC f > 1 Hz, or -4/+19 V when using the body diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-247-4L |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSmax | 1200 | V | VGS = 0 V, ID = 100 μA | 1 | ||
| Gate-Source Voltage (dynamic) | VGSmax | -8 | 19 | V | AC (f >1 Hz) Note 1 | 1 | |
| Gate-Source Voltage (static) | VGSop | -4 | 15 | V | Static Note 2 | 1 | |
| Continuous Drain Current | ID | 63 | A | VGS = 15 V, TC = 25˚C | 1 | ||
| Continuous Drain Current | ID | 48 | A | VGS = 15 V, TC = 100˚C | 1 | ||
| Pulsed Drain Current | ID(pulse) | 120 | A | Pulse width tP limited by Tjmax | 1 | ||
| Power Dissipation | PD | 283 | W | TC =25˚C, TJ = 175 ˚C | 1 | ||
| Operating Junction and Storage Temperature | TJ, Tstg | -40 | 175 | ˚C | 1 | ||
| Solder Temperature | TL | 260 | ˚C | 1.6mm (0.063”) from case for 10s | 1 | ||
| Drain-Source Breakdown Voltage | V(BR)DSS | 1200 | V | VGS = 0 V, ID = 100 μA | 2 | ||
| Gate Threshold Voltage | VGS(th) | 1.8 | 2.5 | 3.6 | V | VDS = VGS, ID = 11.5 mA | 2 |
| Gate Threshold Voltage (TJ = 175ºC) | VGS(th) | 2 | V | VDS = VGS, ID = 11.5 mA, TJ = 175ºC | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | 50 | μA | VDS = 1200 V, VGS = 0 V | 2 | |
| Gate-Source Leakage Current | IGSS | 10 | 250 | nA | VGS = 15 V, VDS = 0 V | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 23 | 32 | 43 | mΩ | VGS = 15 V, ID = 40 A | 2 |
| Drain-Source On-State Resistance (TJ = 175ºC) | RDS(on) | 57.6 | mΩ | VGS = 15 V, ID = 40 A, TJ = 175ºC | 2 | ||
| Transconductance | gfs | 27 | S | VDS= 20 V, IDS= 40 A | 2 | ||
| Transconductance (TJ = 175ºC) | gfs | 22 | S | VDS= 20 V, IDS= 40 A, TJ = 175ºC | 2 | ||
| Input Capacitance | Ciss | 3357 | pF | VGS = 0 V, VDS = 1000 V, f=100kHz, VAC = 25 mV | 2 | ||
| Output Capacitance | Coss | 129 | pF | VGS = 0 V, VDS = 1000 V, f=100kHz, VAC = 25 mV | 2 | ||
| Reverse Transfer Capacitance | Crss | 8 | pF | VGS = 0 V, VDS = 1000 V, f=100kHz, VAC = 25 mV | 2 | ||
| Coss Stored Energy | Eoss | 76 | μJ | Fig. 16 | 2 | ||
| Turn-On Switching Energy (SiC Diode FWD) | EON | 367 | μJ | VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC | 2 | ||
| Turn Off Switching Energy (SiC Diode FWD) | EOFF | 123 | μJ | VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC | 2 | ||
| Turn-On Switching Energy (Body Diode FWD) | EON | 955 | μJ | VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC | 2 | ||
| Turn Off Switching Energy (Body Diode FWD) | EOFF | 107 | μJ | VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC | 2 | ||
| Turn-On Delay Time | td(on) | 25 | ns | VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7 μH, inductive load | 2 | ||
| Rise Time | tr | 18 | ns | VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7 μH, inductive load | 2 | ||
| Turn-Off Delay Time | td(off) | 32 | ns | VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7 μH, inductive load | 2 | ||
| Fall Time | tf | 9 | ns | VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7 μH, inductive load | 2 | ||
| Internal Gate Resistance | RG(int) | 1.7 | Ω | f = 1 MHz, VAC = 25 mV | 2 | ||
| Gate to Source Charge | Qgs | 40 | nC | VDS = 800 V, VGS = -4 V/15 V, ID = 40 A | 2 | ||
| Gate to Drain Charge | Qgd | 34 | nC | VDS = 800 V, VGS = -4 V/15 V, ID = 40 A | 2 | ||
| Total Gate Charge | Qg | 118 | nC | VDS = 800 V, VGS = -4 V/15 V, ID = 40 A | 2 | ||
| Diode Forward Voltage (TJ = 25 °C) | VSD | 4.6 | V | VGS = -4 V, ISD = 20 A, TJ = 25 °C | 2 | ||
| Diode Forward Voltage (TJ = 175 °C) | VSD | 4.2 | V | VGS = -4 V, ISD = 20 A, TJ = 175 °C | 2 | ||
| Continuous Diode Forward Current | IS | 62 | A | VGS = -4 V, TC = 25˚C | 2 | ||
| Diode Pulse Current | IS, pulse | 120 | A | VGS = -4 V, pulse width tP limited by Tjmax | 2 | ||
| Reverse Recovery Time | trr | 27 | ns | VGS = -4 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C | 2 | ||
| Reverse Recovery Charge | Qrr | 478 | nC | VGS = -4 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C | 2 | ||
| Peak Reverse Recovery Current | Irrm | 27 | A | VGS = -4 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C | 2 | ||
| Thermal Resistance from Junction to Case | RθJC | 0.45 | °C/W | Fig. 21 | 2 | ||
| Thermal Resistance From Junction to Ambient | RθJA | 40 | °C/W | 2 |
CAD (KiCad official)
- Symbol:
HSCTWA60N12G24AG - Footprint:
Package_TO_SOT_THT:TO-247-4_Vertical - 3D model: TO-247-4L (KiCad packages3D, STEP)
- 3D model files:
hsctwa60n12g24ag-etched.step/hsctwa60n12g24ag-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsctwa60n12g24ag.step/hsctwa60n12g24ag.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (11 pp, sha256
3f54410f0dd08f7c, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).