component
HNVH4L040N120SC1
Public Made by Adomby adom
HXY MOSFET Silicon Carbide Field Effect Transistor (MOSFET), TO-247-4L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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HNVH4L040N120SC1
HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L
HNVH4L040N120SC1 from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Drain | passive | Drain terminal, shown as Pin 1 and TAB on the datasheet; the device is rated VDS 1200 V (V(BR)DSS, VGS = 0 V, ID = 100 μA). |
| 2 | Power Source | passive | Power source terminal carrying the main drain current; continuous ID is 78 A at VGS = 15 V, TC = 25 ˚C, and 57 A at TC = 100 ˚C. |
| 3 | Driver Source | passive | Separate driver source terminal, provided so the gate drive return is kept apart from the power source pin per the datasheet's 'separate driver source pin' package feature. |
| 4 | Gate | input | Gate terminal; static VGS is limited to -5/+20 V and dynamic (AC, f > 1 Hz) VGS to -10/+25 V, per the Maximum Ratings table. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-247-4L |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain - Source Voltage | VDSmax | 1200 | V | VGS = 0 V, ID = 100 μA | 1 | ||
| Gate - Source Voltage (dynamic) | VGSmax | -10 | 25 | V | AC (f >1 Hz) | 1 | |
| Gate - Source Voltage (static) | VGSop | -5 | 20 | V | Static | 1 | |
| Continuous Drain Current | ID | 78 | A | VGS = 15 V, TC = 25˚C | 1 | ||
| Continuous Drain Current | ID | 57 | A | VGS = 15 V, TC = 100˚C | 1 | ||
| Power Dissipation | PD | 405 | W | TC = 25˚C, TJ = 175 ˚C | 1 | ||
| Operating Junction and Storage Temperature | TJ, Tstg | -40 | 175 | ˚C | 1 | ||
| Solder Temperature | TL | 260 | ˚C | 1.6mm (0.063”) from case for 10s | 1 | ||
| Drain-Source Breakdown Voltage | V(BR)DSS | 1200 | V | VGS = 0 V, ID = 100 μA | 2 | ||
| Gate Threshold Voltage | VGS(th) | 2 | 2.5 | 4 | V | VDS = VGS, ID = 10 mA | 2 |
| Gate Threshold Voltage | VGS(th) | 1.5 | V | VDS = VGS, ID = 10 mA, TJ = 175ºC | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | 50 | μA | VDS = 1200 V, VGS = 0 V | 2 | |
| Gate-Source Leakage Current | IGSS | 10 | 200 | nA | VGS = 20 V, VDS = 0 V | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 40 | 50 | mΩ | VGS = 20 V, ID = 40 A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 59 | mΩ | VGS = 20 V, ID = 40 A, TJ = 175ºC | 2 | ||
| Transconductance | gfs | 10.4 | S | VDS = 20 V, IDS = 40 A | 2 | ||
| Transconductance | gfs | 7.7 | S | VDS = 20 V, IDS = 40 A, TJ = 175ºC | 2 | ||
| Input Capacitance | Ciss | 2101 | pF | VGS = 0 V, VDS = 1000 V, f = 100kHz, VAC = 25 mV | 2 | ||
| Output Capacitance | Coss | 161 | pF | VGS = 0 V, VDS = 1000 V, f = 100kHz, VAC = 25 mV | 2 | ||
| Reverse Transfer Capacitance | Crss | 14 | pF | VGS = 0 V, VDS = 1000 V, f = 100kHz, VAC = 25 mV | 2 | ||
| Coss Stored Energy | Eoss | 90 | μJ | 2 | |||
| Turn-On Switching Energy (SiC Diode FWD) | EON | 1100 | μJ | VDS = 800 V, VGS = -5 V/+20 V, ID = 40A, RG(ext) = 2.5Ω, L = 100 μH, Tj = 175ºC | 2 | ||
| Turn Off Switching Energy (SiC Diode FWD) | EOFF | 900 | μJ | VDS = 800 V, VGS = -5 V/+20 V, ID = 40A, RG(ext) = 2.5Ω, L = 100 μH, Tj = 175ºC | 2 | ||
| Turn-On Delay Time | td(on) | 22 | ns | VDD = 800 V, VGS = -5 V/20 V, RG(ext) = 2.5 Ω, ID = 40 A | 2 | ||
| Rise Time | tr | 49 | ns | VDD = 800 V, VGS = -5 V/20 V, RG(ext) = 2.5 Ω, ID = 40 A | 2 | ||
| Turn-Off Delay Time | td(off) | 71 | ns | VDD = 800 V, VGS = -5 V/20 V, RG(ext) = 2.5 Ω, ID = 40 A | 2 | ||
| Fall Time | tf | 23 | ns | VDD = 800 V, VGS = -5 V/20 V, RG(ext) = 2.5 Ω, ID = 40 A | 2 | ||
| Internal Gate Resistance | RG(int) | 1.7 | Ω | f = 1 MHz, VAC = 25 mV | 2 | ||
| Gate to Source Charge | Qgs | 33 | nC | VDS = 800 V, VGS = -5 V/20 V, ID = 40 A | 2 | ||
| Gate to Drain Charge | Qgd | 51 | nC | VDS = 800 V, VGS = -5 V/20 V, ID = 40 A | 2 | ||
| Total Gate Charge | Qg | 131 | nC | VDS = 800 V, VGS = -5 V/20 V, ID = 40 A | 2 | ||
| Diode Forward Voltage | VSD | 4.1 | V | VGS = -5 V, ISD = 20 A, TJ = 25 °C | 2 | ||
| Diode Forward Voltage | VSD | 3.5 | V | VGS = -5 V, ISD = 20 A, TJ = 175 °C | 2 | ||
| Continuous Diode Forward Current | IS | 83 | A | VGS = -4 V, TC = 25˚C | 2 | ||
| Reverse Recover Time | trr | 56 | ns | VGS = -5 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C | 2 | ||
| Reverse Recovery Charge | Qrr | 508 | nC | VGS = -5 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C | 2 | ||
| Peak Reverse Recovery Current | Irrm | 18 | A | VGS = -5 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C | 2 | ||
| Thermal Resistance from Junction to Case | RθJC | 0.25 | °C/W | 2 | |||
| Thermal Resistance From Junction to Ambient | RθJA | 40 | °C/W | 2 |
CAD (KiCad official)
- Symbol:
HNVH4L040N120SC1 - Footprint:
Package_TO_SOT_THT:TO-247-4_Vertical - 3D model: TO-247-4L (KiCad packages3D, STEP)
- 3D model files:
hnvh4l040n120sc1-etched.step/hnvh4l040n120sc1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hnvh4l040n120sc1.step/hnvh4l040n120sc1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (9 pp, sha256
0ad1663438b5ae9a, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).