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Ray fgl60n100bntdtu: specified limits as data (metadata.characteristics, 24 rows from the datasheet) 036ad9b 25d ago

FGL60N100BNTDTU

onsemi · IGBT Transistors / Modules · TO-264-3

FGL60N100BNTDTU from onsemi, in a TO-264-3. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate control terminal; Gate-to-Emitter voltage rated to 25 V maximum with threshold voltage of 5.0 V typical.
2 Collector passive Collector main power terminal; rated for 1000 V collector-emitter voltage with 60 A continuous collector current at 25°C case temperature.
3 Emitter passive Emitter main power terminal and gate return; includes built-in fast recovery diode with forward current rating of 15 A at 100°C.

Key specifications

Parameter Value
Manufacturer onsemi
Package TO-264-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector to Emitter Breakdown Voltage BVCES 1000 V VGE = 0 V, IC = 1 mA 3
Collector Cut-Off Current ICES 1 mA VCE = VCES, VGE = 0 V 3
G-E Leakage Current IGES -500 500 nA VGE = VGES, VCE = 0 V 3
G-E Threshold Voltage VGE(th) 4 5 7 V IC = 60 mA, VCE = VGE 3
Collector to Emitter Saturation Voltage VCE(sat) 1.5 1.8 V IC = 10 A, VGE = 15 V 3
Collector to Emitter Saturation Voltage VCE(sat) 2.5 2.9 V IC = 60 A, VGE = 15 V 3
Diode Forward Voltage VFM 1.2 1.7 V IF = 15 A 3
Diode Forward Voltage VFM 1.8 2.1 V IF = 60 A 3
Diode Reverse Recovery Time trr 1.2 1.5 us IF = 60 A, di/dt = 20 A/us 3
Instantaneous Reverse Current IR 0.05 2 uA VRRM = 1000 V 3
Collector to Emitter Voltage VCES 1000 V 2
Gate to Emitter Voltage VGES 25 V 2
Collector Current IC 60 A TC = 25oC 2
Collector Current IC 42 A TC = 100oC 2
Pulsed Collector Current ICM 200 A TC = 25oC 2
Diode Continuous Forward Current IF 15 A TC = 100oC 2
Maximum Power Dissipation PD 180 W TC = 25oC 2
Maximum Power Dissipation PD 72 W TC = 100oC 2
Operating Junction Temperature TJ -55 150 oC 2
Storage Temperature Range Tstg -55 150 oC 2
Maximum Lead Temp. for Soldering TL 300 oC 1/8 in from case for 5 seconds 2
Thermal Resistance, Junction to Case (IGBT) RJC(IGBT) 0.69 oC/W 2
Thermal Resistance, Junction to Case (Diode) RJC(Diode) 2.08 oC/W 2
Thermal Resistance, Junction to Ambient RJA 25 oC/W 2

CAD (KiCad official)

  • Symbol: FGL60N100BNTDTU
  • Footprint: Package_TO_SOT_THT:TO-264-3_Vertical
  • 3D model: TO-264-3 (KiCad packages3D, STEP)
  • 3D model files: fgl60n100bntdtu-etched.step / fgl60n100bntdtu-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fgl60n100bntdtu.step / fgl60n100bntdtu.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 f359f1e46617083b, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF