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DRV8714SQRVJRQ1

Texas Instruments · Gate Drivers · VQFN-56(8x8)

DRV8714SQRVJRQ1 from Texas Instruments, in a VQFN-56(8x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SCLK input Serial clock input; SPI data is shifted out and captured on the corresponding rising and falling edges of this pin, with an internal pull-down.
2 SDI input Serial data input, captured on the falling edge of SCLK, with an internal pull-down.
3 SDO output Serial data output, shifted out on the rising edge of SCLK; push-pull output referenced to the DVDD input.
4 IN1/EN1 input Half-bridge and H-bridge control input (IN1 or EN1 depending on mode, see section 7.3.3), with an internal pull-down.
5 IN2/PH1 input Half-bridge and H-bridge control input (IN2 or PH1 depending on mode, see section 7.3.3), with an internal pull-down.
6 IN3/EN2 input Half-bridge and H-bridge control input (IN3 or EN2 depending on mode, see section 7.3.3), with an internal pull-down.
7 IN4/PH2 input Half-bridge and H-bridge control input (IN4 or PH2 depending on mode, see section 7.3.3), with an internal pull-down.
8 nSLEEP input Device enable pin; driving it to logic low shuts the device down into sleep mode, with an internal pull-down.
9 DRVOFF/nFLT bidirectional Multi-function pin: DRVOFF global gate driver disable input (logic high disables the drivers) or nFLT open-drain fault indicator output that requires an external pull-up; internal pull-down.
10 AREF power_in External voltage reference and supply for the current shunt amplifiers; a 0.1 µF, 6.3 V ceramic capacitor to AGND is recommended, with AREF specified at 3 V to 5.5 V.
11 AGND power_in Device ground for the shunt amplifier section; connect to system ground.
12 SO1 output Current shunt amplifier 1 output, clamped to the AREF voltage to protect the controller ADC input.
13 SO2 output Current shunt amplifier 2 output, clamped to the AREF voltage to protect the controller ADC input.
14 BRAKE input Power-off braking pin; driving it high during low-power sleep mode enables the low-side gate drivers, with an internal pull-down, and it must be tied to GND if the feature is unused.
15 SP1 input Shunt amplifier 1 non-inverting input; connect to the positive terminal of the shunt resistor.
16 SN1 input Shunt amplifier 1 inverting input; connect to the negative terminal of the shunt resistor.
17 SP2 input Shunt amplifier 2 non-inverting input; connect to the positive terminal of the shunt resistor.
18 SN2 input Shunt amplifier 2 inverting input; connect to the negative terminal of the shunt resistor.
19 NC unconnected No connection on the DRV8714S-Q1 (this position is GL1 on the DRV8718S-Q1); leave unconnected.
20 NC unconnected No connection on the DRV8714S-Q1 (this position is SH1 on the DRV8718S-Q1); leave unconnected.
21 NC unconnected No connection on the DRV8714S-Q1 (this position is GH1 on the DRV8718S-Q1); leave unconnected.
22 GH1 output High-side gate driver output for half-bridge 1; connects to the gate of the high-side MOSFET.
23 SH1 input High-side source sense input for half-bridge 1; connects to the high-side MOSFET source.
24 GL1 output Low-side gate driver output for half-bridge 1; connects to the gate of the low-side MOSFET.
25 PGND1 power_in Low-side MOSFET gate driver 1-4 sense and power return; connect to system ground close to the device and half-bridges 1-4.
26 GL2 output Low-side gate driver output for half-bridge 2; connects to the gate of the low-side MOSFET.
27 SH2 input High-side source sense input for half-bridge 2; connects to the high-side MOSFET source.
28 GH2 output High-side gate driver output for half-bridge 2; connects to the gate of the high-side MOSFET.
29 NC unconnected No connection on the DRV8714S-Q1 (this position is GH4 on the DRV8718S-Q1); leave unconnected.
30 NC unconnected No connection on the DRV8714S-Q1 (this position is SH4 on the DRV8718S-Q1); leave unconnected.
31 NC unconnected No connection on the DRV8714S-Q1 (this position is GL4 on the DRV8718S-Q1); leave unconnected.
32 GND power_in Device ground; connect to system ground.
33 CP2L bidirectional Charge pump 2 switching node; connect a 100 nF ceramic capacitor rated for PVDD between CP2H and CP2L.
34 CP2H bidirectional Charge pump 2 switching node; connect a 100 nF ceramic capacitor rated for PVDD between CP2H and CP2L.
35 CP1L bidirectional Charge pump 1 switching node; connect a 100 nF ceramic capacitor rated for PVDD between CP1H and CP1L.
36 CP1H bidirectional Charge pump 1 switching node; connect a 100 nF ceramic capacitor rated for PVDD between CP1H and CP1L.
37 VCP bidirectional Charge pump output; connect a 1 µF, 16 V ceramic capacitor between VCP and PVDD.
38 PVDD power_in Gate driver supply input connected to the bridge supply; requires a 0.1 µF PVDD-rated ceramic capacitor and at least 10 µF bulk capacitance to GND, with a recommended operating range of 4.9 V to 37 V (40 V absolute maximum).
39 DRAIN input Bridge MOSFET drain voltage sense pin; connect to the common point of the high-side MOSFET drains.
40 NC unconnected No connection.
41 NC unconnected No connection on the DRV8714S-Q1 (this position is GL5 on the DRV8718S-Q1); leave unconnected.
42 NC unconnected No connection on the DRV8714S-Q1 (this position is SH5 on the DRV8718S-Q1); leave unconnected.
43 NC unconnected No connection on the DRV8714S-Q1 (this position is GH5 on the DRV8718S-Q1); leave unconnected.
44 GH3 output High-side gate driver output for half-bridge 3; connects to the gate of the high-side MOSFET.
45 SH3 input High-side source sense input for half-bridge 3; connects to the high-side MOSFET source.
46 GL3 output Low-side gate driver output for half-bridge 3; connects to the gate of the low-side MOSFET.
47 PGND2 power_in Low-side MOSFET gate driver sense and power return for the second group of gate drivers (listed as 5-8 in the RVJ table); connect to system ground close to the device and half-bridges.
48 GL4 output Low-side gate driver output for half-bridge 4; connects to the gate of the low-side MOSFET.
49 SH4 input High-side source sense input for half-bridge 4; connects to the high-side MOSFET source.
50 GH4 output High-side gate driver output for half-bridge 4; connects to the gate of the high-side MOSFET.
51 NC unconnected No connection on the DRV8714S-Q1 (this position is GH8 on the DRV8718S-Q1); leave unconnected.
52 NC unconnected No connection on the DRV8714S-Q1 (this position is SH8 on the DRV8718S-Q1); leave unconnected.
53 NC unconnected No connection on the DRV8714S-Q1 (this position is GL8 on the DRV8718S-Q1); leave unconnected.
54 DGND power_in Device ground for the digital logic; connect to system ground.
55 DVDD power_in Device logic and digital output supply input, operating from 3 V to 5.5 V; connect a 1.0 µF, 6.3 V ceramic capacitor between DVDD and GND.
56 nSCS input Serial chip select; logic low enables SPI communication, with an internal pull-up.
57 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-56(8x8)
Category Motor Driver ICs
Pins 57

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver supply voltage PVDD VPVDD 4.9 37 V 在工作温度范围内(除非另有说明) 23
High-side average gate drive current GHx IHS 0 15 mA 在工作温度范围内(除非另有说明) 23
Low-side average gate drive current GLx ILS 0 15 mA 在工作温度范围内(除非另有说明) 23
Digital supply voltage DVDD VDVDD 3 5.5 V 在工作温度范围内(除非另有说明) 23
Digital input voltage (BRAKE, DRVOFF/nFLT, INx/ENx, INx/PHx, nSLEEP, nSCS, SCLK, SDI) VDIN 0 5.5 V 在工作温度范围内(除非另有说明) 23
Digital output current SDO IDOUT 0 5 mA 在工作温度范围内(除非另有说明) 23
Open-drain pull-up voltage DRVOFF/nFLT VOD 0 5.5 V 在工作温度范围内(除非另有说明) 23
Open-drain output current DRVOFF/nFLT IOD 0 5 mA 在工作温度范围内(除非另有说明) 23
Brake input voltage BRAKE VBRAKE 0 V 在工作温度范围内(除非另有说明);printed maximum is PVDD 23
Amplifier reference supply voltage AREF VAREF 3 5.5 V 在工作温度范围内(除非另有说明) 23
Shunt amplifier output current SOx ISO 0 5 mA 在工作温度范围内(除非另有说明) 23
Operating ambient temperature TA -40 125 °C 23
Operating junction temperature TJ -40 150 °C 23
PVDD sleep current (BRAKE = 0V) IPVDDQ 2.25 3.5 µA VPVDD、VDRAIN = 13.5V,nSLEEP = 0V,BRAKE = 0V,-40 ≤ TJ ≤ 85°C 24
PVDD sleep current (BRAKE = 5V) IPVDDQ 10 15 µA VPVDD、VDRAIN = 13.5V,nSLEEP = 0V,BRAKE = 5V,-40 ≤ TJ ≤ 85°C 24
DRAIN sleep current IDRAINQ 1.25 2 µA VPVDD,VDRAIN = 13.5V,nSLEEP = 0V,-40 ≤ TJ ≤ 85°C 24
DVDD sleep current IDVDDQ 1.25 3 µA VPVDD,VDRAIN = 13.5V,nSLEEP = 0V,-40 ≤ TJ ≤ 85°C 24
PVDD active mode current IPVDD 13.5 15.5 mA VPVDD,VDRAIN = 13.5V,nSLEEP = 5V 24
DRAIN active mode current IDRAIN 1 1.65 mA VPVDD、VDRAIN = 13.5V,nSLEEP = 5V,VDS_LVL ≤ 500mV 24
DVDD active mode current IDVDD 8 10 mA VDVDD = 5V,SDO = 0V 24
Charge pump regulator voltage relative to PVDD, triple mode VVCP 9.5 10.5 11 V 三倍频模式,VPVDD ≥ 9V,IVCP ≤ 30mA 24
Charge pump regulator voltage relative to PVDD, triple mode VVCP 8.5 9 11 V 三倍频模式,VPVDD = 7V,IVCP ≤ 25mA 24
Charge pump regulator voltage relative to PVDD, triple mode VVCP 7 7.5 11 V 三倍频模式,VPVDD = 4.9V,IVCP ≤ 12mA 24
Charge pump regulator voltage relative to PVDD, doubling mode VVCP 9.5 10.5 11 V 二倍频模式,VPVDD ≥ 13V,IVCP ≤ 25mA 24
Charge pump regulator voltage relative to PVDD, doubling mode VVCP 7 8 11 V 二倍频模式,VPVDD = 9V,IVCP ≤ 13.5mA 24
Charge pump regulator voltage relative to PVDD, doubling mode VVCP 5.4 6 11 V 二倍频模式,VPVDD = 7V,IVCP ≤ 10mA 24
Input logic low voltage (DRVOFF/nFLT, INx/ENx, INx/PHx, nSLEEP, SCLK, SDI) VIL 0 V 24
Input logic low voltage BRAKE VIL 0 0.6 V BRAKE 24
Input logic high voltage (DRVOFF/nFLT, INx/ENx, INx/PHx, nSLEEP, SCLK, SDI) VIH 5.5 V 24
Input logic high voltage BRAKE VIH 1.8 5.5 V BRAKE 24
Input logic low current IIL -5 5 µA VDIN = 0V,BRAKE、DRVOFF/nFLT、INx/ENx、INx/PHx、nSLEEP、SCLK、SDI 25
Input logic low current nSCS IIL 50 100 µA VDIN = 0V,nSCS 25
Input logic high current IIH 50 100 µA VDIN = 5V,DRVOFF/nFLT、INx/ENx、INx/PHx、nSLEEP、SCLK、SDI 25
Input logic high current BRAKE (nSLEEP = 0V) IIH 5 10 µA VDIN = 5V,nSLEEP = 0V,BRAKE 25
Input logic high current BRAKE (nSLEEP = 5V) IIH 35 100 µA VDIN = 5V,nSLEEP = 5V,BRAKE 25
Input logic high current nSCS IIH -5 5 µA VDIN = 5V,VDVDD = 5V,nSCS 25
Input pull-down resistance RPD 50 100 150 kΩ 至 GND:DRVOFF/nFLT、INx/ENx、INx/PHx、nSLEEP、SCLK、SDI 25
BRAKE pull-down resistance (nSLEEP = 0V) RPD 500 1000 1500 kΩ BRAKE 至 GND,nSLEEP = 0V,BRAKE ≤ 2 V,4.9V ≤ VPVDD ≤ VPOB_OV 25
BRAKE pull-down resistance (nSLEEP = 5V) RPD 50 136 200 kΩ BRAKE 至 GND,nSLEEP = 5V,BRAKE ≤ 2 V,4.9V ≤ VPVDD ≤ VPOB_OV 25
Input pull-up resistance nSCS RPU 50 100 150 kΩ 至 DVDD,nSCS 25
Four-level input 1 voltage (GAIN, MODE) VQI1 0 V 通过电压设置为电平 1 25
Four-level input 2 resistance to GND (GAIN, MODE) RQI2 44.65 47 49.35 kΩ 通过连接至 GND 的电阻设置为电平 2 25
Four-level input 4 voltage (GAIN, MODE) VQI4 5.5 V 电压连接至所设置的电平 4 25
Six-level input 2 resistance to GND (IDRIVE, VDS) RSI2 28.5 30 31.5 kΩ GND 电阻连接至所设置的电平 2 25
Six-level input 3 resistance to GND (IDRIVE, VDS) RSI3 95 100 105 kΩ GND 电阻连接至所设置的电平 3 25
Six-level input 5 resistance to DVDD (IDRIVE, VDS) RSI5 58.9 62 65.1 kΩ DVDD 电阻连接至所设置的电平 5 25
Six-level input 1 voltage (IDRIVE, VDS) VSI1 0 V 电压连接至所设置的电平 1 25
Six-level input 6 voltage (IDRIVE, VDS) RSI6 5.5 V 电压连接至所设置的电平 6 25
Output logic low voltage (DRVOFF/nFLT, SDO) VOL 0.5 V IDOUT = 5mA 25
Junction-to-ambient thermal resistance (VQFN 56-pin RVJ, DRV8714-Q1 column) RθJA 24.7 °C/W 23
Junction-to-case (top) thermal resistance (VQFN 56-pin RVJ, DRV8714-Q1 column) RθJC(top) 14.1 °C/W 23
Junction-to-board thermal resistance (VQFN 56-pin RVJ, DRV8714-Q1 column) RθJB 9 °C/W 23
Junction-to-top characterization parameter (VQFN 56-pin RVJ, DRV8714-Q1 column) ΨJT 0.2 °C/W 23
Junction-to-board characterization parameter (VQFN 56-pin RVJ, DRV8714-Q1 column) ΨJB 9 °C/W 23
Junction-to-case (bottom) thermal resistance (VQFN 56-pin RVJ, DRV8714-Q1 column) RθJC(bot) 2.3 °C/W 23

CAD (KiCad official)

  • Symbol: DRV8714SQRVJRQ1
  • Footprint: Package_DFN_QFN:QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm
  • 3D model: VQFN-56(8x8) (KiCad packages3D, STEP)
  • 3D model files: drv8714sqrvjrq1-etched.step / drv8714sqrvjrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8714sqrvjrq1.step / drv8714sqrvjrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (193 pp, sha256 a2520e0a5afb2156, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF