# DMN6040SSD-13

**Diodes Incorporated** · MOSFETs · SO-8

DMN6040SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of MOSFET 1 (N-channel); body diode forward current IS max 2.5A. |
| 2 | G1 | input | Gate of MOSFET 1; VGSS rated ±20V with threshold VGS(TH) of 1V min to 3V max. |
| 3 | S2 | passive | Source of MOSFET 2 (N-channel); body diode forward current IS max 2.5A. |
| 4 | G2 | input | Gate of MOSFET 2; VGSS rated ±20V with threshold VGS(TH) of 1V min to 3V max. |
| 5 | D2 | passive | Drain of MOSFET 2, tied internally with pin 6; VDSS 60V and continuous ID 5.0A at TA=+25°C. |
| 6 | D2 | passive | Drain of MOSFET 2, tied internally with pin 5; VDSS 60V and continuous ID 5.0A at TA=+25°C. |
| 7 | D1 | passive | Drain of MOSFET 1, tied internally with pin 8; VDSS 60V and continuous ID 5.0A at TA=+25°C. |
| 8 | D1 | passive | Drain of MOSFET 1, tied internally with pin 7; VDSS 60V and continuous ID 5.0A at TA=+25°C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zero Gate Voltage Drain Current | IDSS |  |  | 100 | nA | VDS = 60V, VGS = 0V | 2 |
| Gate-Source Leakage | IGSS |  |  | 100 | nA | VGS = ±20V, VDS = 0V | 2 |
| Gate Threshold Voltage | VGS(TH) | 1 |  | 3 | V | VDS = VGS, ID = 250µA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 30 | 40 | mΩ | VGS = 10V, ID = 4.5A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 35 | 55 | mΩ | VGS = 4.5V, ID = 3.5A | 2 |
| Diode Forward Voltage | VSD |  | 0.7 | 1.2 | V | VGS = 0V, IS = 1A | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 60 |  |  | V | VGS = 0V, ID = 250µA | 2 |
| Drain-Source Voltage | VDSS |  |  | 60 | V |  | 2 |
| Gate-Source Voltage | VGSS | -20 |  | 20 | V |  | 2 |
| Continuous Drain Current (steady state) | ID |  |  | 5 | A | VGS = 10V, steady state, TA = +25°C (Note 6) | 2 |
| Continuous Drain Current (steady state) | ID |  |  | 4.1 | A | VGS = 10V, steady state, TA = +70°C (Note 6) | 2 |
| Continuous Drain Current (t<10s) | ID |  |  | 6.6 | A | VGS = 10V, t<10s, TA = +25°C (Note 6) | 2 |
| Continuous Drain Current (t<10s) | ID |  |  | 5.3 | A | VGS = 10V, t<10s, TA = +70°C (Note 6) | 2 |
| Maximum Body Diode Forward Current | IS |  |  | 2.5 | A | Note 6 | 2 |
| Pulsed Drain Current | IDM |  |  | 30 | A | 10µs pulse, duty cycle = 1% | 2 |
| Pulsed Body Diode Forward Current | ISM |  |  | 30 | A | 10μs pulse, duty cycle = 1% | 2 |
| Avalanche Current | IAS |  |  | 14.2 | A | L = 0.1mH (Note 7) | 2 |
| Avalanche Energy | EAS |  |  | 10 | mJ | L = 0.1mH (Note 7) | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 |  | 150 | °C |  | 2 |
| Total Power Dissipation | PD |  |  | 1.3 | W | TA = +25°C (Note 5) | 2 |
| Total Power Dissipation | PD |  |  | 0.8 | W | TA = +70°C (Note 5) | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 102 | °C/W | Steady state (Note 5) | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 61 | °C/W | t<10s (Note 5) | 2 |
| Total Power Dissipation | PD |  |  | 1.7 | W | TA = +25°C (Note 6) | 2 |
| Total Power Dissipation | PD |  |  | 1.1 | W | TA = +70°C (Note 6) | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 75 | °C/W | Steady state (Note 6) | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 50 | °C/W | t<10s (Note 6) | 2 |
| Thermal Resistance, Junction to Case | RθJC |  |  | 14.5 | °C/W | Note 6 | 2 |

## CAD (KiCad official)

- Symbol: `DMN6040SSD-13`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `dmn6040ssd-13-etched.step` / `dmn6040ssd-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmn6040ssd-13.step` / `dmn6040ssd-13.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588879840800227328) (7 pp, sha256 `3fcce1302ca5bbe1`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/dmn6040ssd-13-datasheet.pdf)