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100 nF Capacitor 0805 - Samsung CL21B104KBCNFNC

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0805 MLCC · 100 nF ±10% X7R · 50 V

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John Lauer Remove the product image: a marketing render, not a photo of the part be26848 17d ago

100 nF Capacitor 0805 - Samsung CL21B104KBCNFNC

Samsung Electro-Mechanics CL21B104KBCNFNC: 0805 MLCC, 100 nF ±10% X7R, 50 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Spec Datasheet
0805 multilayer ceramic chip capacitor, 2.00 × 1.25 × 0.85 mm body (±0.10 mm), 0.50 mm termination bands; Ni inner electrodes, Cu termination, 100% Sn Pb-free plating p.1
100 nF ±10%, rated 50 V, X7R (Class II) dielectric, code B p.1
X7R temperature characteristic: capacitance change within ±15% from −55 to +125 °C p.2
Part-number position 9 is code F, Samsung's Product for POWER application build of the CL21 series p.1
Dissipation factor 0.025 max at 1 kHz / 1.0 Vrms; insulation resistance 10,000 MΩ or 500 MΩ·µF, whichever is smaller p.2
Withstands 250% of rated voltage with no dielectric or mechanical breakdown; high-temperature life test runs at 200% of rated voltage for 1,000 h p.2
Class II dielectric, capacitance changes with applied DC and AC voltage; the product manual requires designing against the DC-bias characteristic p.11, p.14
Reflow soldering rated to a 260 +0/−5 °C peak, 10 s max p.2
Cardboard (paper) carrier tape, 4 mm pitch, 4,000 pcs per 7-inch (φ178 mm) reel p.1, p.4, p.5, p.7
Store at 0-40 °C and ≤70% RH; solderability shelf life 6 months from delivery p.33

Notes for designers

CL21B104KBCNFNC is Samsung's 0805 take on the most ordinary value in electronics: 100 nF, X7R, rated 50 V. (p.1) Two things set it apart from a generic 0805 0.1 µF. The body is the thin 0.85 mm C-thickness rather than the usual full-height brick, and position 9 of the part number is an F, Samsung's Product for POWER application build. (p.1)

The numbers you design against: ±10% initial tolerance, and X7R holds capacitance within ±15% from −55 to +125 °C. (p.1, p.2) Dissipation factor is specified at 0.025 max, four times tighter than the 0.1 limit on the high-capacitance X5R parts in this family, and insulation resistance is 10,000 MΩ or 500 MΩ·µF, whichever is smaller. The dielectric is proofed at 250% of rated voltage, and the high-temperature life test runs 1,000 h at 200% of rated voltage. (p.2)

It is still a Class II ceramic, so capacitance moves with applied DC and AC voltage, the product manual tells you to check the bias characteristic in-circuit rather than trust the label value. (p.14) Reflow is rated to a 260 +0/−5 °C peak for no more than 10 s, (p.2) and it ships on 4 mm-pitch cardboard tape, 4,000 to a 7-inch reel. (p.4)

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).

mm Datasheet KiCad standard (C_0805_2012Metric) Previous This page
Pad length (along the part) 0.75 to 0.8 1 1.05 0.775
Pad width 1.25 to 1.3 1.45 1.38 1.275
Gap between pads 0.7 to 0.75 0.9 0.726 0.725
Centre to centre 1.45 to 1.55 1.9 1.776 1.5
Overall 2.2 to 2.35 2.9 2.826 2.275
Corner radius not specified 0.25 (ratio 0.25) 0.1313 (ratio 0.125) square (as drawn)
Corners: square, as the datasheet draws them. The datasheet does not call for rounded corners, so the footprint does not add any.

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol, CL21B104KBCNFNC.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21B104KBCNFNC-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.

Ordering
MPN CL21B104KBCNFNC
Manufacturer Samsung Electro-Mechanics
Adom stock Adom Basic Part, stocked on reels for Adom's pick-and-place line; reel counts on pnp-inventory
Other sources adom-parts-search compares Mouser, DigiKey and JLCPCB

Downloads

File What it is
CL21B104KBCNFNC.kicad_sym KiCad symbol (standard symbol, the page default)
CL21B104KBCNFNC-outline.kicad_sym KiCad symbol with the 3D chip outline
CL21B104KBCNFNC.kicad_mod KiCad footprint (datasheet land pattern)
CL21B104KBCNFNC.step 3D STEP with the part number laser-etched (default)
CL21B104KBCNFNC-unetched.step 3D STEP, bare (no mark)
CL21B104KBCNFNC.glb 3D GLB of the etched model (board use)
CL21B104KBCNFNC-unetched.glb 3D GLB, bare
CL21B104KBCNFNC.lbr Fusion 360 / EAGLE library
CL21B104KBCNFNC.adom-lbr.json adom-lbr part (converts to Altium, KiCad, EAGLE)
CL21B104KBCNFNC-datasheet.pdf Datasheet (release asset)

Provenance

  • Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 85e70f1e33e415a7a24e0ae3d874fa7d
  • Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
  • 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).

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