100 nF Capacitor 0805 - Samsung CL21B104KBCNFNC

Samsung Electro-Mechanics CL21B104KBCNFNC: 0805 MLCC, 100 nF ±10% X7R, 50 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Notes for designers

CL21B104KBCNFNC is Samsung's 0805 take on the most ordinary value in electronics: 100 nF, X7R, rated 50 V. (p.1) Two things set it apart from a generic 0805 0.1 µF. The body is the thin 0.85 mm C-thickness rather than the usual full-height brick, and position 9 of the part number is an F, Samsung's Product for POWER application build. (p.1)

The numbers you design against: ±10% initial tolerance, and X7R holds capacitance within ±15% from −55 to +125 °C. (p.1, p.2) Dissipation factor is specified at 0.025 max, four times tighter than the 0.1 limit on the high-capacitance X5R parts in this family, and insulation resistance is 10,000 MΩ or 500 MΩ·µF, whichever is smaller. The dielectric is proofed at 250% of rated voltage, and the high-temperature life test runs 1,000 h at 200% of rated voltage. (p.2)

It is still a Class II ceramic, so capacitance moves with applied DC and AC voltage, the product manual tells you to check the bias characteristic in-circuit rather than trust the label value. (p.14) Reflow is rated to a 260 +0/−5 °C peak for no more than 10 s, (p.2) and it ships on 4 mm-pitch cardboard tape, 4,000 to a 7-inch reel. (p.4)

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol, CL21B104KBCNFNC.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21B104KBCNFNC-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.

Ordering

Downloads

Provenance

• Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 85e70f1e33e415a7a24e0ae3d874fa7d
• Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
• 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).

More

• Datasheet pages: the 36 datasheet pages as images.
• Assembly animation: the part dropping onto its pads, and Adom's pick-and-place picking it from tape.