# CL21A226MPQNNNE: plain STEP posed Z-up (2026-10-07)

`CL21A226MPQNNNE-unetched.step` was still in the Samsung Y-up pose: its assembly placement turns the body so the height lands on -Y, and every OpenCascade reader (KiCad, step2glb, adom-fields) showed it on its side. It is now turned +90 degrees about X at the assembly's top-level placement (the body's own geometry untouched) and seated on Z = 0. `step2glb features` reads X -1.0..1.0, Y -0.625..0.625, Z 0..1.25 mm, matching the etched default `CL21A226MPQNNNE.step`. The pose record in `page.json` carries the new sha256.

# CL21A226MPQNNNE: MPN laser etch pass (2026-09-30)

John: chip-laser-etch every component we put on the wiki; the best STEP, with the etch, is the default.

## Files

- `CL21A226MPQNNNE.step`: now the etched model: the page STEP unchanged (same frame, colours, names) plus one flat `laser_etch` part, the virtual MPN on the top face, seated on the body. Default.
- `CL21A226MPQNNNE-unetched.step` (new): the STEP this page shipped before, byte for byte. Optional.
- `CL21A226MPQNNNE.glb`, `CL21A226MPQNNNE.insertion.glb`: only the part mesh swapped for the step2glb conversion of the etched STEP; board, pads, solder, silk, node names and the insertion animation kept (keyframes identical). The mark is a child node `Adom.LaserEtch.MPN` of the part node.
- `cl21a226mpqnnne-hero.glb` (new): etched part plus footprint reference art (teal dashed pad outlines 50 %, silkscreen 30 %, pad labels 50 %), the reviewed hero proposal.
- `screenshots/hero.png`: the hero card in the shared basic-part layout (COMPONENT kicker, title, MPN, spec, manufacturer, ADOM BASIC PART pill), etched part only.
- `page.json` `component.parts`: `step` / `model_3d_step` = `CL21A226MPQNNNE.step`, `model_3d_step_plain` = `CL21A226MPQNNNE-unetched.step`, `model_3d` = `cl21a226mpqnnne-hero.glb`, `model_3d_plain` = `CL21A226MPQNNNE.glb`; `viewer_3d.tooltips: authored`.
- `README.md` Downloads: etched STEP (default), unetched STEP (optional), hero GLB rows.
- `CL21A226MPQNNNE-fpview.html`: Solder button tooltip reworded ("250µm solder jet blobs for paste jetting at the 3rd party fab, which uses this placement data for its jetting sequence."), as on the LED pages.
- `provenance/`: pass provenance (hashes, sources, triangle counts), the hero provenance and pin map from the proposal, and the scripts used.

## GLBs

| File | Triangles before | after | Bytes before | after |
|---|---|---|---|---|
| `CL21A226MPQNNNE.glb` | 36 | 794 | 2936 | 30160 |
| `CL21A226MPQNNNE.insertion.glb` | 968 | 1726 | 28764 | 50388 |
| `cl21a226mpqnnne-hero.glb` (new) | | 794 | | 73020 |

## CL21A226MPQNNNE model note

The page STEP is the detailed Samsung 0805 body model (named CL21A105KACLNNC inside, Y-up). It was 0.95 mm tall; since pass 2 it is scaled to the CL21A226MPQNNNE datasheet thickness 1.25 mm, so the STEP, both page GLBs and the hero GLB all show 1.25 mm.

## Datasheet-true height (pass 2, 2026-09-30)

Boards use the STEP, so the STEP itself now has the datasheet thickness: 0.95 mm -> **1.25 mm** (Samsung CL21A226MPQNNNE specification p.1: T = 1.25 +- 0.15 mm).

- `CL21A226MPQNNNE-unetched.step`: the Samsung model scaled along its vertical axis only (the STEP is Y-up; factor 1.315789 about the seating plane; names and colours kept). It is **no longer byte-identical** to the file this page shipped; that file is kept as `provenance/CL21A226MPQNNNE-samsung-original.step`.
- `CL21A226MPQNNNE.step`: the top MPN mark re-applied on the scaled model (light, text 0.093 mm, seated on the ceramic between the terminations), so the glyphs are not stretched.
- `CL21A226MPQNNNE.glb`, `CL21A226MPQNNNE.insertion.glb`: rebuilt from the corrected STEP with no Z stretch (part node scale 1); insertion keyframes unchanged.
- `cl21a226mpqnnne-hero.glb` and `screenshots/hero.png`: rebuilt with the reviewed proposal's tools and settings; they now show 1.25 mm too.

## Worth knowing

- Footprint (old KiCad 5 format, CAPC2012X95N) has NO F.SilkS lines, only fab/courtyard: the hero GLB has pad outlines + pad labels but no silkscreen layer (by necessity).
- Vendor model bottom sits at z -0.004 mm (left as is).
- page.json has empty manufacturer/package; after-hero uses "Samsung Electro-Mechanics • 0805" from the README/page title.
- Ceramic body top is 25 um below the terminations; the etch service placed the mark at the bbox top (floating), so it was re-seated with _tools/seat_mark.py.
- Mark is light on the ochre body: readable in the hero render, but ochre is a mid tone; a dark mark would be the alternative if Ray/Colby prefer.

# CL21A226MPQNNNE: footprint, hover and README pass (2026-10-03)

John: footprints follow the manufacturer's land pattern; README.md replaces README.html; the assembly animation moves to a sub-readme.

- Footprint: redrawn. Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads 0.825 x 1.325 mm, centre to centre 1.6 mm, corner radius 0.1 mm.
- Rebuilt from the footprint: `CL21A226MPQNNNE-fpview.html` (and the lbr-hover bus on both viewers), `CL21A226MPQNNNE.lbr`, `CL21A226MPQNNNE.adom-lbr.json`, the hero GLB, and the pads / solder / silk in `CL21A226MPQNNNE.insertion.glb`.
- Etched STEP: kept.
- README.html removed (it repeated the native Symbol & Footprint viewers); README.md rewritten; `docs/assembly.md` + `docs/assembly.html` carry the pick-and-place animation; `docs/datasheet.md` the datasheet pages.
- New: `CL21A226MPQNNNE-outline.kicad_sym`, `artwork/CL21A226MPQNNNE-3d-outline-blueprint-named.svg`, `artwork/CL21A226MPQNNNE-3d-outline-dark-named.svg`, `artwork/CL21A226MPQNNNE-3d-outline-ink-heavy-named.svg`, `artwork/CL21A226MPQNNNE-3d-outline-teal-named.svg`, `artwork/CL21A226MPQNNNE-thumbs.json`, `cl21a226mpqnnne-hero.overlay.json`, `docs/assembly.html`, `docs/assembly.md`, `docs/datasheet.md`, `footprint-variants/CL21A226MPQNNNE-RR25.kicad_mod`, `footprint-variants/CL21A226MPQNNNE-SQ.kicad_mod`, `footprint-variants/CL21A226MPQNNNE.kicad_mod`, `footprint-variants/CL21A226MPQNNNE.variants.json`
- Removed: `README.html`