by adom
0805 MLCC · 22 µF ±20% X5R · 10 V
| Name | Last updated |
|---|---|
| artwork | 20d ago |
| docs | 20d ago |
| ds | 2mo ago |
| footprint-variants | 20d ago |
| provenance | 20d ago |
| screenshots | 24d ago |
| CHANGES.md | 17d ago |
| CL21A226MPQNNNE-fpview.html | 20d ago |
| cl21a226mpqnnne-hero.glb | 20d ago |
| cl21a226mpqnnne-hero.overlay.json | 20d ago |
| CL21A226MPQNNNE-outline.kicad_sym | 20d ago |
| CL21A226MPQNNNE-symview.html | 21d ago |
| CL21A226MPQNNNE-unetched.step | 17d ago |
| CL21A226MPQNNNE.adom-lbr.json | 20d ago |
| CL21A226MPQNNNE.glb | 20d ago |
| CL21A226MPQNNNE.html | 3mo ago |
| CL21A226MPQNNNE.insertion.glb | 20d ago |
| CL21A226MPQNNNE.kicad_mod | 20d ago |
| CL21A226MPQNNNE.kicad_sym | 3mo ago |
| CL21A226MPQNNNE.lbr | 20d ago |
| CL21A226MPQNNNE.step | 20d ago |
| CL21A226MPQNNNE.svg | 3mo ago |
| page.json | 17d ago |
| README.md | 20d ago |
22 µF Capacitor 0805 - Samsung CL21A226MPQNNNE
Samsung Electro-Mechanics CL21A226MPQNNNE: 0805 MLCC, 22 µF ±20% X5R, 10 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.
Key specs
| Spec | Datasheet |
|---|---|
| 0805 multilayer ceramic chip capacitor, 2.00 × 1.25 × 1.25 mm body (±0.15 mm), 0.50 mm termination bands; Ni inner electrodes, Cu termination, Ni/100% Sn Pb-free plating | p.1 |
| 22 µF ±20%, rated 10 V, X5R (Class II) dielectric, code A | p.1 |
| X5R temperature characteristic: capacitance change within ±15% from −55 to +85 °C | p.2 |
| High-capacitance measurement condition: 120 Hz ±20% at 0.5±0.1 Vrms, after a 150 °C 1-hour heat treatment and 24±2 h rest | p.2 |
| Dissipation factor 0.1 max; insulation resistance 10,000 MΩ or 100 MΩ·µF, whichever is smaller | p.2 |
| Withstands 250% of rated voltage with no dielectric or mechanical breakdown; high-temperature life test at 150% of rated voltage for 1,000 h | p.2 |
| Class II dielectric, capacitance changes with applied DC and AC voltage; the product manual requires designing against the DC-bias characteristic | p.11, p.14 |
| Reflow soldering rated to a 260±5 °C peak, 30 s | p.2 |
| Embossed (plastic) carrier tape, 4 mm pitch, 2,000 pcs per 7-inch (φ178 mm) reel, cover-tape peel-off force 10-70 g·f | p.1, p.4, p.7 |
Notes for designers
CL21A226MPQNNNE packs 22 µF of X5R ceramic into an 0805, rated 10 V with a ±20% tolerance (p.1), a bulk-capacitance part for low-voltage rails, not a precision one. The wide tolerance is the first hint: this is capacitance by volume, and even the factory measures it differently, at 120 Hz and 0.5 Vrms rather than the 1 kHz / 1.0 Vrms used for the smaller values, after a 150 °C de-aging bake. (p.2)
The design numbers: X5R holds capacitance within ±15% from −55 to +85 °C, dissipation factor is 0.1 max, insulation resistance is 10,000 MΩ or 100 MΩ·µF whichever is smaller, and the dielectric is proofed at 250% of rated voltage. (p.2)
The number that bites is DC bias. As a high-capacitance Class II ceramic, its effective capacitance falls as the applied voltage climbs toward the 10 V rating, the product manual requires checking the bias characteristic at the working voltage rather than budgeting the label value. (p.14) Reflow is rated 260±5 °C peak for 30 s, (p.2) and it ships 2,000 to a 7-inch reel on 4 mm-pitch embossed tape. (p.4)
Footprint
Redrawn from the datasheet land pattern (the previous pads were off by up to 0.326 mm).
Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).
| mm | Datasheet | KiCad standard (C_0805_2012Metric) | Previous | This page |
|---|---|---|---|---|
| Pad length (along the part) | 0.8 to 0.85 | 1 | 1.05 | 0.825 |
| Pad width | 1.3 to 1.35 | 1.45 | 1.38 | 1.325 |
| Gap between pads | 0.75 to 0.8 | 0.9 | 0.726 | 0.775 |
| Centre to centre | 1.55 to 1.65 | 1.9 | 1.776 | 1.6 |
| Overall | 2.35 to 2.5 | 2.9 | 2.826 | 2.425 |
| Corner radius | not specified | 0.25 (ratio 0.25) | 0.1313 (ratio 0.125) | square (as drawn) |
| Corners: square, as the datasheet draws them. The datasheet does not call for rounded corners, so the footprint does not add any. |
Chip outline
The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.
Symbol options
The default symbol is the plain standard symbol. CL21A226MPQNNNE-outline.kicad_sym adds the chip outline beside it; the widget below builds other layouts in the browser and never changes the default.
Ordering
| MPN | CL21A226MPQNNNE |
| Manufacturer | Samsung Electro-Mechanics |
| Adom stock | Adom Basic Part, stocked on reels for Adom's pick-and-place line; reel counts on pnp-inventory |
| Other sources | adom-parts-search compares Mouser, DigiKey and JLCPCB |
Downloads
| File | What it is |
|---|---|
| CL21A226MPQNNNE.kicad_sym | KiCad symbol (standard symbol, the page default) |
| CL21A226MPQNNNE-outline.kicad_sym | KiCad symbol with the 3D chip outline |
| CL21A226MPQNNNE.kicad_mod | KiCad footprint (datasheet land pattern) |
| CL21A226MPQNNNE.step | 3D STEP with the part number laser-etched (default) |
| CL21A226MPQNNNE-unetched.step | 3D STEP, bare (no mark) |
| CL21A226MPQNNNE.glb | 3D GLB of the etched model (board use) |
| CL21A226MPQNNNE.lbr | Fusion 360 / EAGLE library |
| CL21A226MPQNNNE.adom-lbr.json | adom-lbr part (converts to Altium, KiCad, EAGLE) |
| CL21A226MPQNNNE-datasheet.pdf | Datasheet (release asset) |
Provenance
- Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics.
md5 1a8b67beddb27758b82e3c4200fa021d - Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
- 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).
- Earlier passes: provenance/ and CHANGES.md.
More
- Datasheet pages: the 36 datasheet pages as images.
- Assembly animation: the part dropping onto its pads, and Adom's pick-and-place picking it from tape.