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Made with adom-basic-parts-overhaul · KiCad file format 20240108
Name Last commit message Last updated
artwork Laser mark by the planner (adom-aiflow 0.1.49): re-etched, outlines regenerated, GLB / hero / outline symbol rebuilt; l… · John Lauer 20d ago
docs Delete docs/img/samsung-cl21-mlcc.jpg · John Lauer 20d ago
ds Revamp to the IN-S42ATR page model: interactive 3D insertion viewer, Summary with Features/Brief tabs, side-by-side sym… · AravK 2mo ago
footprint-variants Delete footprint-variants/CL21A226MPQNNNE-SQ.kicad_mod · John Lauer 20d ago
provenance Samsung STEP stood up Z-up and seated on z = 0 over the footprint (original kept in provenance/) · John Lauer 20d ago
screenshots Datasheet-true STEP thickness 1.25 mm (Samsung spec), MPN mark re-applied; GLBs, hero GLB and hero card rebuilt · John Lauer 24d ago
CHANGES.md Plain STEP posed Z-up and seated (was Samsung Y-up); verified with step2glb features · John Lauer 17d ago
CL21A226MPQNNNE-fpview.html Pads: square corners, as the datasheet draws them (no added rounding); viewers, lbr, insertion GLB, hero rebuilt from t… · John Lauer 20d ago
cl21a226mpqnnne-hero.glb Hero rebuilt: copper fill + dashed pad outlines outside the copper (straight dashes, corners included) · John Lauer 20d ago
cl21a226mpqnnne-hero.overlay.json Laser mark by the planner (adom-aiflow 0.1.49): re-etched, outlines regenerated, GLB / hero / outline symbol rebuilt; l… · John Lauer 20d ago
CL21A226MPQNNNE-outline.kicad_sym Laser mark by the planner (adom-aiflow 0.1.49): re-etched, outlines regenerated, GLB / hero / outline symbol rebuilt; l… · John Lauer 20d ago
CL21A226MPQNNNE-symview.html Footprint per the manufacturer's land pattern (redrawn), derived viewers/lbr/hero rebuilt, lbr-hover on both viewers, R… · John Lauer 21d ago
CL21A226MPQNNNE-unetched.step Plain STEP posed Z-up and seated (was Samsung Y-up); verified with step2glb features · John Lauer 17d ago
CL21A226MPQNNNE.adom-lbr.json Pads: square corners, as the datasheet draws them (no added rounding); viewers, lbr, insertion GLB, hero rebuilt from t… · John Lauer 20d ago
CL21A226MPQNNNE.glb Laser mark by the planner (adom-aiflow 0.1.49): re-etched, outlines regenerated, GLB / hero / outline symbol rebuilt; l… · John Lauer 20d ago
CL21A226MPQNNNE.html Update characterization page for CL21A226MPQNNNE — audit corrections · AravK 3mo ago
CL21A226MPQNNNE.insertion.glb Laser mark by the planner (adom-aiflow 0.1.49): re-etched, outlines regenerated, GLB / hero / outline symbol rebuilt; l… · John Lauer 20d ago
CL21A226MPQNNNE.kicad_mod Pads: square corners, as the datasheet draws them (no added rounding); viewers, lbr, insertion GLB, hero rebuilt from t… · John Lauer 20d ago
CL21A226MPQNNNE.kicad_sym Add CAD bundle for CL21A226MPQNNNE (22µF 10V X5R 0805 MLCC) · AravK 3mo ago
CL21A226MPQNNNE.lbr Pads: square corners, as the datasheet draws them (no added rounding); viewers, lbr, insertion GLB, hero rebuilt from t… · John Lauer 20d ago
CL21A226MPQNNNE.step Laser mark by the planner (adom-aiflow 0.1.49): re-etched, outlines regenerated, GLB / hero / outline symbol rebuilt; l… · John Lauer 20d ago
CL21A226MPQNNNE.svg Add CAD bundle for CL21A226MPQNNNE (22µF 10V X5R 0805 MLCC) · AravK 3mo ago
page.json Plain STEP posed Z-up and seated (was Samsung Y-up); verified with step2glb features · John Lauer 17d ago
README.md Remove the product image: a marketing render, not a photo of the part · John Lauer 20d ago

22 µF Capacitor 0805 - Samsung CL21A226MPQNNNE

Samsung Electro-Mechanics CL21A226MPQNNNE: 0805 MLCC, 22 µF ±20% X5R, 10 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Spec Datasheet
0805 multilayer ceramic chip capacitor, 2.00 × 1.25 × 1.25 mm body (±0.15 mm), 0.50 mm termination bands; Ni inner electrodes, Cu termination, Ni/100% Sn Pb-free plating p.1
22 µF ±20%, rated 10 V, X5R (Class II) dielectric, code A p.1
X5R temperature characteristic: capacitance change within ±15% from −55 to +85 °C p.2
High-capacitance measurement condition: 120 Hz ±20% at 0.5±0.1 Vrms, after a 150 °C 1-hour heat treatment and 24±2 h rest p.2
Dissipation factor 0.1 max; insulation resistance 10,000 MΩ or 100 MΩ·µF, whichever is smaller p.2
Withstands 250% of rated voltage with no dielectric or mechanical breakdown; high-temperature life test at 150% of rated voltage for 1,000 h p.2
Class II dielectric, capacitance changes with applied DC and AC voltage; the product manual requires designing against the DC-bias characteristic p.11, p.14
Reflow soldering rated to a 260±5 °C peak, 30 s p.2
Embossed (plastic) carrier tape, 4 mm pitch, 2,000 pcs per 7-inch (φ178 mm) reel, cover-tape peel-off force 10-70 g·f p.1, p.4, p.7

Notes for designers

CL21A226MPQNNNE packs 22 µF of X5R ceramic into an 0805, rated 10 V with a ±20% tolerance (p.1), a bulk-capacitance part for low-voltage rails, not a precision one. The wide tolerance is the first hint: this is capacitance by volume, and even the factory measures it differently, at 120 Hz and 0.5 Vrms rather than the 1 kHz / 1.0 Vrms used for the smaller values, after a 150 °C de-aging bake. (p.2)

The design numbers: X5R holds capacitance within ±15% from −55 to +85 °C, dissipation factor is 0.1 max, insulation resistance is 10,000 MΩ or 100 MΩ·µF whichever is smaller, and the dielectric is proofed at 250% of rated voltage. (p.2)

The number that bites is DC bias. As a high-capacitance Class II ceramic, its effective capacitance falls as the applied voltage climbs toward the 10 V rating, the product manual requires checking the bias characteristic at the working voltage rather than budgeting the label value. (p.14) Reflow is rated 260±5 °C peak for 30 s, (p.2) and it ships 2,000 to a 7-inch reel on 4 mm-pitch embossed tape. (p.4)

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.326 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).

mm Datasheet KiCad standard (C_0805_2012Metric) Previous This page
Pad length (along the part) 0.8 to 0.85 1 1.05 0.825
Pad width 1.3 to 1.35 1.45 1.38 1.325
Gap between pads 0.75 to 0.8 0.9 0.726 0.775
Centre to centre 1.55 to 1.65 1.9 1.776 1.6
Overall 2.35 to 2.5 2.9 2.826 2.425
Corner radius not specified 0.25 (ratio 0.25) 0.1313 (ratio 0.125) square (as drawn)
Corners: square, as the datasheet draws them. The datasheet does not call for rounded corners, so the footprint does not add any.

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol is the plain standard symbol. CL21A226MPQNNNE-outline.kicad_sym adds the chip outline beside it; the widget below builds other layouts in the browser and never changes the default.

Ordering

MPN CL21A226MPQNNNE
Manufacturer Samsung Electro-Mechanics
Adom stock Adom Basic Part, stocked on reels for Adom's pick-and-place line; reel counts on pnp-inventory
Other sources adom-parts-search compares Mouser, DigiKey and JLCPCB

Downloads

File What it is
CL21A226MPQNNNE.kicad_sym KiCad symbol (standard symbol, the page default)
CL21A226MPQNNNE-outline.kicad_sym KiCad symbol with the 3D chip outline
CL21A226MPQNNNE.kicad_mod KiCad footprint (datasheet land pattern)
CL21A226MPQNNNE.step 3D STEP with the part number laser-etched (default)
CL21A226MPQNNNE-unetched.step 3D STEP, bare (no mark)
CL21A226MPQNNNE.glb 3D GLB of the etched model (board use)
CL21A226MPQNNNE.lbr Fusion 360 / EAGLE library
CL21A226MPQNNNE.adom-lbr.json adom-lbr part (converts to Altium, KiCad, EAGLE)
CL21A226MPQNNNE-datasheet.pdf Datasheet (release asset)

Provenance

  • Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 1a8b67beddb27758b82e3c4200fa021d
  • Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
  • 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).
  • Earlier passes: provenance/ and CHANGES.md.

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