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BQ25792 Charger

A buck-boost battery charger board built around the Texas Instruments BQ25792, a switch-mode 1S to 4S charger with integrated USB-C input, I2C control, on-chip ADC and a fully integrated power path. This page carries an interactive 3D model of the assembled board plus schematic and layout views, so you can inspect the real design without opening Fusion.

Designed by Adonis in Autodesk Fusion 360 Electronics (Main project). The board integrates 14 Adom machine pins (MP1 to MP14) so it presses into the Adom modular stack, mating with machine contacts on adjacent boards.

The 3D model above

The interactive viewer shows the fully-placed board: green soldermask, gold plating, the BQ25792 charger IC and power stage, passives, connectors, and the Adom machine pins standing vertical around the board edges. Drag to orbit, scroll to zoom. Colors are the real Fusion materials, preserved through the STEP to GLB pipeline.

Exploded stackup view (current 3D model)

The 3D viewer above currently shows the board EXPLODED by layer (2 mm per slot) so you can see every layer of the stackup in correct order, top to bottom:

components -> top silkscreen -> top soldermask -> top copper (layer 1) -> inner copper layer 2 -> FR4 core -> inner copper layer 15 -> bottom copper (layer 16) -> bottom soldermask -> bottom silkscreen

The outer copper, masks, FR4 and components are the real exported 3D bodies, shifted apart. The INNER copper layers (2, 15) and the silkscreens do not exist as 3D bodies in a Fusion export, so they are the actual gerber layers rendered to copper/white images, registered to the board outline. The assembled (non-exploded) model is bq25792-charger-assembled.glb in Files.

Board stackup (exact physical fabrication stack)

Layer set from the EAGLE design rules: layerSetup (1+2*15+16) = 4 copper layers, mtCopper 0.035 mm each. A 4-layer board is fabricated as copper / prepreg / copper / core / copper / prepreg / copper - a thin core carries the two inner copper layers, then prepreg is bonded top and bottom with the outer copper. The FR4 is NOT one slab: it is prepreg + core + prepreg. Dielectric split fitted to the measured board (1.516 mm total dielectric): outer prepregs 0.200 each, core 1.046. Exact z, mm:

# Layer z bottom z top thickness
1 Components (seated on top mask) 1.582 varies per part
2 Top silkscreen 1.582 1.582 ink
3 Top soldermask 1.516 1.582 0.066
4 Copper L1 (top, traces) 1.516 1.551 0.035
5 Top prepreg (FR4) 1.316 1.516 0.200
6 Copper L2 (inner) 1.281 1.316 0.035
7 Core (FR4) 0.235 1.281 1.046
8 Copper L15 (inner) 0.200 0.235 0.035
9 Bottom prepreg (FR4) 0.000 0.200 0.200
10 Copper L16 (bottom) -0.035 0.000 0.035
11 Bottom soldermask -0.065 0.000 0.065
12 Bottom silkscreen -0.065 -0.065 ink

Copper L1 and L16 are the real exported 3D bodies (routing as geometry). Inner copper L2 and L15 are the real gerber layers (copper_l2.G1, copper_l3.G2) - Fusion does not export inner layers as bodies. Outer prepreg/core split is symmetric to the measured board; the exact fab dielectric ratio comes from mtIsolate when the fab sets it explicitly.

Exploded view placement (physical, 6.000 mm per slot, real thicknesses)

Each layer is its own slab at its EXACT thickness, separated by 6 mm. The FR4 appears as its three real sublayers (top prepreg, core, bottom prepreg) with the four copper layers between them:

Element slot z-center in exploded model (mm) thickness (mm)
Components +7.5 45 (pins hang 7.8 below seats; clears silk at 30) per part
Top silkscreen +5 30 ink
Top soldermask +4 24 0.066
Copper L1 (top) +3 18 0.035
Top prepreg (FR4) +2 12 0.200
Copper L2 (inner) +1 6 0.035
Core (FR4) 0 0 1.046
Copper L15 (inner) -1 -6 0.035
Bottom prepreg (FR4) -2 -12 0.200
Copper L16 (bottom) -3 -18 0.035
Bottom soldermask -4 -24 0.065
Bottom silkscreen -5 -30 ink

What the BQ25792 does

Feature Detail
Type I2C-controlled buck-boost battery charger
Cell count 1 to 4 cells in series (1S to 4S)
Charge current Up to 5 A
Input USB-C and generic DC, wide input range with input current optimizer
Power path Integrated, so the system runs while charging
Telemetry On-chip 16-bit ADC (voltage, current, temperature)
Extras Dual-input selection, MPPT for solar, integrated FETs

Board (Fusion, v222)

Property Value
Outline (FR4) 50.40 x 26.40 mm
Components 109 (108 top, 1 bottom)
Signals 50 nets (3 airwires still to route)
Pads 304
Vias 88
Holes 176
Adom machine pins 14 (MP1 to MP14)

Adom machine pins

The board uses the Adom press-fit machine pin system for board-to-board stacking. Each pin presses into a plated through-hole and mates with a machine contact on a stacked board. See the pin components:

Files (everything exportable is here - this page is for sharing)

File What
bq25792-charger.f3d Fusion 360 archive (native)
bq25792-charger.step STEP 3D (full board)
bq25792-charger.usdz USDZ 3D (PBR)
bq25792-charger.brd / .sch EAGLE board + schematic source
bq25792-charger.fbrd / .fsch Fusion-native board + schematic
bq25792-charger-gerbers.zip Fabrication gerbers + drill (13 files)
bq25792-charger-bom.csv Bill of materials
bq25792-charger-cpl.csv Pick-and-place (component placement)
bq25792-charger-exploded.glb Exploded stackup 3D (current viewer model)
bq25792-charger-assembled.glb Assembled 3D (real copper traces, translucent mask)
bq25792-3d-iso.png / -3d-top.png / bq25792-schematic.png Renders

Provenance

Source of truth is the live Fusion 360 design (Main project, document version 222). This page is a snapshot for browsing and reuse. To edit the board, open the project in Fusion.